Cover Plate, Method for Manufacturing Cover Plate and Electronic Device

Patent metadata

Field	Value
Publication number	US-2018036961-A1
Application number	US-201715667897-A
Country	US
Kind code	A1
Filing date	Aug 3, 2017
Priority date	Aug 8, 2016
Publication date	Feb 8, 2018
Grant date	—

Abstract

A cover plate, a method of manufacturing the cover plate, and an electronic device having the cover plate are provided. The cover plate includes a substrate, at least one slot defined in the substrate and penetrating through the substrate, and a filling layer received in the slot including an insulating layer and a gel layer located on the insulating layer.

First claim

What is claimed is:

1 . A cover plate, comprising:
a substrate; at least one slot, defined in the substrate and penetrating through the substrate in a thickness direction of the substrate; and a filling layer, received in the at least one slot, comprising an insulating layer and a gel layer located on the insulating layer.

2 . The cover plate of claim 1 , wherein the gel layer comprises at least one selected from the group consisting of silver powder and pigment.

3 . The cover plate of claim 2 , wherein the gel layer comprises 5-20% silver powder by weight.

4 . The cover plate of claim 3 , wherein the gel layer comprises 15% silver powder by weight.

5 . The cover plate of claim 2 , wherein the gel layer comprises 0.2% yellow pigment by weight and 0.1% red pigment by weight.

6 . The cover plate of claim 1 , wherein the gel layer has a width not less than that of the insulating layer.

7 . The cover plate of claim 6 , wherein the width of the gel layer is 0.02-0.06 mm larger than that of the insulating layer.

8 . The cover plate of claim 1 , wherein the gel layer has a thickness of 0.4-0.8 mm.

9 . The cover plate of claim 1 , wherein the substrate is made of metal, and the cover plate further comprises an anodized layer formed on an outer surface of the substrate.

10 . A method for manufacturing a cover plate, comprising:
forming at least one slot in a substrate and filling the at least one slot with an insulating material, wherein the at least one slot penetrates through the substrate in a thickness direction of the substrate; forming an insulating layer in the at least one slot by removing a part of the insulating material and forming a groove on the insulating layer, wherein the groove is adjacent to an outer surface of the substrate; and filling the groove with gel to form a gel layer in the groove.

11 . The method of claim 10 , wherein the forming the insulating layer in the at least one slot by removing the part of the insulating material and forming the groove on the insulating layer comprises:
removing a part of the insulating material adjacent to the outer surface of the substrate and a part of the substrate adjacent to the part of the insulating material such that the remaining insulating material forms the insulating layer and the groove has a width larger than the insulating layer.

12 . The method of claim 10 , wherein the gel comprises at least one selected from the group consisting of silver powder and pigment.

13 . The method of claim 12 , wherein the gel comprises 5-20% silver powder by weight.

14 . The method of claim 13 , wherein the gel comprises 15% silver powder by weight.

15 . The method of claim 12 , wherein the gel comprises 0.2% yellow pigment by weight and 0.1% red pigment by weight.

16 . The method of claim 10 , wherein the gel has an initial viscosity of 3000-10000 mPa·s.

17 . The method of claim 16 , wherein the initial viscosity of the gel comprises 7000 mPa·s.

18 . The method of claim 10 , further comprising:
horizontally cutting an outer surface of the cover plate.

19 . The method of claim 10 , wherein the substrate is made of metal, and the method further comprises forming an anodized layer on the outer surface of the substrate.

20 . An electronic device, comprising a cover plate and an antenna covered by the cover plate, wherein the cover plate comprises:
a substrate; at least one slot, defined in the substrate and penetrating through the substrate in a thickness direction of the substrate; and a filling layer, received in the at least one slot, comprising an insulating layer and a gel layer located on the insulating layer, wherein the slot is aligned with the antenna.

Assignees

• Guangdong Oppo Mobile Telecommunications Corp Ltd

Inventors

• Li Jing
• Yang Guangming
• Gong Qingguo

Classifications

• B29C70/74 Primary

  Moulding material on a relatively small portion of the preformed part, e.g. outsert moulding {(B29C70/845 takes precedence)} · CPC title

• B29L2031/3456

  Antennas, e.g. radomes · CPC title

• B29L2031/3481

  Housings or casings incorporating or embedding electric or electronic elements · CPC title

• B22F2301/255

  Silver or gold · CPC title

• B29C65/7808 Primary

  in the form of holes or slots (B29C65/7814 takes precedence; holding or clamping means cooperating with specially formed features of at least one of the parts to be joined B29C65/7844) · CPC title