Methods and apparatuses for laser processing materials

Patent metadata

Field	Value
Publication number	US-2018029165-A1
Application number	US-201715727083-A
Country	US
Kind code	A1
Filing date	Oct 6, 2017
Priority date	Jul 8, 2014
Publication date	Feb 1, 2018
Grant date	—

Abstract

Methods of laser processing a transparent material are disclosed. The method may include positioning the transparent material on a carrier and transmitting a laser beam through the transparent material, where the laser beam may be incident on a side of the transparent material opposite the carrier. The transparent material may be substantially transparent to the laser beam and the carrier may include a support base and a laser disruption element. The laser disruption element may disrupt the laser beam transmitted through the transparent material such that the laser beam may not have sufficient intensity below the laser disruption element to damage the support base.

First claim

What is claimed is:

1 . A method of laser processing a transparent material, the method comprising:
positioning the transparent material on a carrier; and transmitting a laser beam through the transparent material, the laser beam incident on a side of the transparent material opposite the carrier, wherein: the transparent material is substantially transparent to the laser beam; the carrier comprises a support base and a laser disruption element; and the laser disruption element optically disrupts the laser beam transmitted through the transparent material such that the laser beam does not have sufficient intensity below the laser disruption element to damage the support base; and the laser disruption element comprises at least one of: (i) a diffusive material, (ii) a translucent material, (iii) a material or interface with refractive index inhomogeneities that scatter wavefront of the laser beam.

2 . The method of claim 1 , wherein the laser disruption element comprises a top surface with average surface roughness (Ra) greater than or equal to about 0.5 microns.

3 . The method of claim 2 , wherein the average surface roughness (Ra) is greater than or equal to about 1.5 microns.

4 . The method of claim 2 , wherein the average surface roughness (Ra) is greater than or equal to about 2.0 microns

5 . A method of laser processing a transparent material, the method comprising:
positioning the transparent material on a carrier; and transmitting a laser beam through the transparent material, the laser beam incident on a side of the transparent material opposite the carrier, wherein: the transparent material is substantially transparent to the laser beam; the carrier comprises a support base and a laser disruption element; and the laser disruption element optically disrupts the laser beam transmitted through the transparent material such that the laser beam does not have sufficient intensity below the laser disruption element to damage the support base; and the laser disruption element comprises a top surface with average surface roughness (Ra) greater than or equal to about 0.5 microns.

6 . The method of claim 5 , wherein the average surface roughness (Ra) is greater than or equal to about 1.5 microns.

7 . The method of claim 5 , wherein the average surface roughness (Ra) is greater than or equal to about 2.0 microns.

8 . A method of laser processing a transparent material, the method comprising:
positioning the transparent material on a carrier; and transmitting a laser beam through the transparent material, the laser beam incident on a side of the transparent material opposite the carrier, wherein: the transparent material is substantially transparent to the laser beam; the carrier comprises a support base and a laser disruption element; and the laser disruption element optically disrupts the laser beam transmitted through the transparent material such that the laser beam does not have sufficient intensity below the laser disruption element to damage the support base; and the laser disruption element comprises a plurality of holes for providing vacuum suction and securing said transparent material situated over the laser disruption element.

9 . The method of claim 8 wherein, the laser disruption element comprises at least one of: (i) a diffusive material, (ii) a translucent material, (iii) a material or interface with refractive index inhomogeneities that scatter wavefront of the laser beam.

10 . A multilayer stack for laser processing, the multilayer stack comprising:
a carrier comprising a support base and a laser disruption element, the laser disruption element positioned on top of the support base; and a transparent material positioned on the carrier, the transparent material comprising a substantially flat top surface and a substantially flat bottom surface, wherein the transparent material is substantially transparent to a laser beam incident on a surface of the transparent material opposite the carrier, wherein: the laser disruption element optically disrupts the laser beam transmitted through the transparent material such that the laser beam does not have sufficient intensity below the laser disruption element to damage the support base.

11 . The multilayer stack of claim 10 , wherein the laser disruption element comprises a roughened surface that optically disrupts the laser beam.

12 . The multilayer stack of claim 11 , an average roughness (Ra) of the roughened surface is greater than or equal to about 0.5 microns.

13 . The multilayer stack of claim 11 , wherein the average roughness (Ra) of the roughened surface is greater than or equal to about 1.5 microns.

14 . The multilayer stack of claim 11 , wherein the average roughness (Ra) of the roughened surface is greater than or equal to about 2.0 microns.

Assignees

• Corning Inc

Inventors

• Grundmueller Richard
• Herrnberger Frank Fabian
• Klein Michael
• Spaeth Florian

Classifications

• C03B33/091

  using at least one focussed radiation beam, e.g. laser beam (C03B33/0955 takes precedence) · CPC title

• C03B33/082

  using a focussed radiation beam, e.g. laser (C03B33/0855 takes precedence) · CPC title

• C03B33/102

  involving a focussed radiation beam, e.g. lasers · CPC title

• B23K26/0006

  taking account of the properties of the material involved (B23K26/32, B23K26/40 take precedence) · CPC title

• B23K26/706 Primary

  Protective screens · CPC title