Flexible film, circuit board assembly including the same and display apparatus including the same

US2018020550A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2018020550-A1
Application numberUS-201715467004-A
CountryUS
Kind codeA1
Filing dateMar 23, 2017
Priority dateJul 15, 2016
Publication dateJan 18, 2018
Grant date

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A flexible film includes a base film including an edge portion which extends in a first direction, a plurality of wirings disposed on the base film, and a plurality of pads which is disposed in the edge portion of the base film and connected to the plurality of wirings. The plurality of pads disposed in the edge portion include a plurality of horizontal pads horizontally arranged in the first direction to define a pad row extended in the first direction; and a vertical pad including a plurality of vertically arranged pads arranged in a second direction perpendicular to the first direction, within a same pad row in which the plurality of horizontal pads are horizontally arranged.

First claim

Opening claim text (preview).

What is claimed is: 1 . A flexible film comprising: a base film comprising an edge portion which extends in a first direction; a plurality of wirings disposed on the base film; and a plurality of pads which is disposed in the edge portion of the base film and connected to the plurality of wirings, wherein the plurality of pads disposed in the edge portion comprise: a plurality of horizontal pads horizontally arranged in the first direction to define a pad row extended in the first direction; and a vertical pad comprising a plurality of vertically arranged pads arranged in a second direction perpendicular to the first direction, within a same pad row in which the plurality of horizontal pads are horizontally arranged. 2 . The flexible film of claim 1 , wherein each of the horizontal pads and each of the vertically arranged pads defines a length thereof larger than a width thereof, the lengths extending in the second direction, and the length of each of the vertically arranged pads in the second direction is smaller than the length of each of the horizontal pads in the second direction. 3 . The flexible film of claim 2 , wherein the length of each of the horizontal pads in the second direction is at least two times greater than the length of each of the vertically arranged pads in the second direction. 4 . The flexible film of claim 1 , wherein the vertically arranged pads within the vertical pad define a pad column of the flexible film, and at least two vertically arranged pads are disposed in the pad column of the flexible film. 5 . The flexible film of claim 1 , wherein the base film comprises a mounting region thereof at which a chip through which a signal from outside the flexible film passes is mounted, and the plurality of wirings of the flexible film comprise: a plurality of input wirings disposed on a first side of the mounting region and through which the signal is input to the chip; and a plurality of output wirings disposed on a second side of the mounting region opposite to the first side thereof and through which the signal is output from the chip. 6 . The flexible film of claim 5 , wherein the plurality of pads of the flexible film further comprise: a plurality of input side pads connected to the plurality of input wirings; and a plurality of output side pads connected to the plurality of output wirings, wherein at least one of the output side pads and the input side pads includes the plurality of horizontal pads horizontally arranged and the vertical pad comprising the plurality of vertically arranged pads. 7 . The flexible film of claim 1 , wherein within the same pad row extended in the first direction, the plurality of pads of the flexible film are disposed in a plurality of pad sub-rows each extended in the first direction, and the plurality of vertically arranged pads are respectively provided in the pad sub-rows. 8 . The flexible film of claim 1 , wherein the edge portion of the base film extends from an outer edge of the base film, within the same pad row extended in the first direction, a first virtual line extends in the first direction, a second virtual line extends parallel to the first virtual line and is spaced further from the outer edge in the second direction than the first virtual line, the plurality of vertically arranged pads within the vertical pad comprise: a first vertically arranged pad disposed on the first virtual line extending in the first direction and non-overlapping with the second virtual line; and a second vertically arranged pad disposed on the second virtual line and non-overlapping with the first vertical lines, and each of the horizontal pads horizontally arranged is disposed to overlap both of the first and second virtual lines. 9 . The flexible film of claim 8 , wherein each of the vertically arranged pads defines a length thereof larger than a width thereof, the widths extending in the first direction, and the width of the first vertically arranged pad in the first direction is greater than the width of the second vertically arranged pad in the first direction. 10 . The flexible film of claim 8 , wherein the plurality of wirings of the flexible film comprise: a first vertically arranged wiring extended from and connected to the first vertically arranged pad; and a second vertically arranged wiring extended from and connected to the second vertically arranged pad, wherein the first vertically arranged wiring is disposed to be spaced apart a predetermined distance in the first direction from the second vertically arranged pad. 11 . A circuit board assembly comprising: a circuit board which provides a signal; and a flexible film which is attached to and receives the signal from the circuit board, wherein the flexible film comprises: a base film comprising an edge portion which extends in a first direction; a plurality of wirings disposed on the base film; and a plurality of pads which is disposed in the edge portion of the base film and connected to the plurality of wirings, wherein the plurality of pads disposed in the edge portion comprise: a plurality of horizontal pads horizontally arranged in the first direction to define a pad row extended in the first direction; and a vertical pad comprising plurality of vertically arranged pads arranged in a second direction perpendicular to the first direction, within a same pad row in which the plurality of horizontal pads are horizontally arranged. 12 . The circuit board assembly of claim 11 , wherein the circuit board comprises: an edge portion which extends in the first direction, and a plurality of leads which is disposed in the edge portion of the circuit board and connected to the plurality of pads of the flexible film, and the plurality of leads in the edge portion of the circuit board comprises: a plurality of horizontal leads horizontally arranged in the first direction and respectively corresponding to the plurality of horizontal pads horizontally arranged of the flexible film, to define a lead row extended in the first direction; and a vertical lead comprising a plurality of vertically arranged leads arranged in the second direction and respectively corresponding to the plurality of vertically arranged pads of the flexible film, within a same lead row in which the plurality of horizontal leads are horizontally arranged. 13 . The circuit board assembly of claim 12 , wherein the circuit board further comprises: a plurality of horizontally arranged wirings respectively extended from and connected to the plurality of horizontal leads horizontally arranged; and a plurality of vertically arranged wirings respectively extended from and connected to the plurality of vertically arranged leads. 14 . The circuit board assembly of claim 13 , wherein the edge portion of the circuit board extends from an outer edge of the circuit board, within the same lead row extended in the first direction, a first virtual line extends in the first direction, and a second virtual line extends parallel to the first virtual line and is spaced further from the outer edge of the circuit board in the second direction than the first virtual line, the plurality of vertically arranged leads within the vertical lead of the circuit board comprise: a first vertically arranged lead disposed on the first virtual line extending in the first direction and non-overlapping with the second virtual line; and a second vertically arranged lead disposed on the second virtual line and non-overlapping with the first virtual line, and each of the plurality of

Assignees

Inventors

Classifications

  • Bending or folding regions of flexible printed circuits (H05K1/0283 takes precedence) · CPC title

  • H05K1/189Primary

    characterised by the use of flexible or folded printed circuits · CPC title

  • Display · CPC title

  • Special orientation of pads, lands or terminals of component, e.g. radial or polygonal orientation · CPC title

  • specially for flexible printed circuits, e.g. using folded portions · CPC title

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Frequently asked questions

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What does patent US2018020550A1 cover?
A flexible film includes a base film including an edge portion which extends in a first direction, a plurality of wirings disposed on the base film, and a plurality of pads which is disposed in the edge portion of the base film and connected to the plurality of wirings. The plurality of pads disposed in the edge portion include a plurality of horizontal pads horizontally arranged in the first d…
Who is the assignee on this patent?
Samsung Display Co Ltd
What technology area does this patent fall under?
Primary CPC classification H05K1/189. Mapped technology areas include Electricity.
When was this patent published?
Publication date Thu Jan 18 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).