Thermally conductive graft

US2018014971A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2018014971-A1
Application numberUS-201715714518-A
CountryUS
Kind codeA1
Filing dateSep 25, 2017
Priority dateMar 25, 2015
Publication dateJan 18, 2018
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present disclosure provides thermally conductive grafts and methods of passively cooling a hyperthermic region and preventing epilepsy, neural inflammation, and other neurological abnormalities using a thermally conductive graft including a thermally conductive matrix disposed between two opposed surfaces.

First claim

Opening claim text (preview).

What is claimed is: 1 . A thermally conductive graft comprising: a first surface; a second surface; and a thermally conductive matrix disposed between the first and second surfaces. 2 . The thermally conductive graft of claim 1 , wherein the thermally conductive matrix comprises: a biocompatible matrix and a thermally conductive material embedded into the biocompatible matrix. 3 . The thermally conductive graft of claim 2 , wherein the thermally conductive material comprises one or more of the following: thermally conductive polymers, graphene, carbon nanotubes, diamond, metal powders, metal beads, and combinations thereof. 4 . The thermally conductive graft of claim 2 , wherein the biocompatible matrix comprises one or more of the following: silicon, collagen, expanded polytetrafluoroethylene, polylactide, polyglycolide, gelatin, agar, cellulose, thermally conductive polymer, carbohydrate chain, collagen autograph, allograph, xenograph, and combinations thereof. 5 . The thermally conductive graft of claim 1 , wherein the thermally conductive graft is sized and configured to: (1) overlay a meningeal membrane under a skull of a human subject; or (2) replace a portion of the meningeal membrane of the human subject. 6 . The thermally conductive graft of claim 1 , wherein the thermally conductive graft is sized and configured to extend from a dural space through a channel in a skull to a subgaleal space of a human subject. 7 . The thermally conductive graft of claim 1 , wherein the thermally conductive matrix comprises a biocompatible polymer matrix. 8 . The thermally conductive graft of claim 1 , wherein the thermally conductive graft is between 0.1 mm and 8 mm thick. 9 . The thermally conductive graft of claim 1 , wherein the second surface comprises a coating which is adhesive to a meninges of a human subject. 10 . The thermally conductive graft of claim 1 , wherein the second surface comprises a coating which is non-scarring to a meninges of a human subject. 11 . The thermally conductive graft of claim 1 , further comprising a non-fouling coating on one or more of the first surface and the second surface. 12 . The thermally conductive graft of claim 1 , further comprising at least one aperture disposed in the thermally conductive matrix sized and configured to allow fluid to drain from one substantially planar opposed surface to the other. 13 . The thermally conductive graft of claim 1 , further comprising at least one aperture disposed in the thermally conductive matrix having a first and a second end sized and configured to allow fluid to drain laterally from portion of the thermally conductive graft to the other. 14 . The thermally conductive graft of claim 1 , wherein the first surface is substantially planar and the second surface is substantially planar. 15 . A method of passively cooling a hyperthermic region of a central nervous system of a human subject, the method comprising: implanting a thermally conductive graft adjacent to the hyperthermic region of the central nervous system, wherein the thermally conductive graft is effective to conduct heat from the hyperthermic region to another region. 16 . The method of claim 15 , further comprising: making an incision in a scalp of a subject; removing a portion of a cranium through the incision to form a recess in which a portion of a meningeal membrane adjacent to the hyperthermic region is exposed; and implanting the thermally conductive graft adjacent to the exposed meningeal membrane. 17 . The method of claim 15 , wherein the thermally conductive graft comprises: a first surface; a second surface; and a thermally conductive matrix disposed between the first and second surfaces. 18 . The method of claim 17 , wherein the thermally conductive matrix comprises a biocompatible matrix and a thermally conductive material embedded in the biocompatible matrix. 19 . The method of claim 18 , wherein: the thermally conductive matrix comprises one or more of the following: thermally conductive polymers, graphene, carbon nanotubes, diamond, metal powders, metal beads, and combinations thereof; and the biocompatible matrix comprises one or more of the following: silicon, collagen, expanded polytetrafluoroethylene, polylactide, polyglycolide, gelatin, agar, cellulose, thermally conductive polymer, carbohydrate chain, collagen autograph, allograph, xenograph, and combinations thereof. 20 . The method of claim 15 , further comprising: (1) removing a portion of a dura mater adjacent to the hyperthermic region of the human subject; or (2) replacing a portion of a cranium of the human subject adjacent to the hyperthermic region.

Assignees

Inventors

Classifications

  • Head or parts thereof · CPC title

  • A61F7/12Primary

    Devices for heating or cooling internal body cavities · CPC title

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Frequently asked questions

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What does patent US2018014971A1 cover?
The present disclosure provides thermally conductive grafts and methods of passively cooling a hyperthermic region and preventing epilepsy, neural inflammation, and other neurological abnormalities using a thermally conductive graft including a thermally conductive matrix disposed between two opposed surfaces.
Who is the assignee on this patent?
Univ Washington, Univ Washington
What technology area does this patent fall under?
Primary CPC classification A61F7/12. Mapped technology areas include Human Necessities.
When was this patent published?
Publication date Thu Jan 18 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).