Sensor with symmetrically embedded sensor elements

Patent metadata

Field	Value
Publication number	US-2018011124-A1
Application number	US-201615540791-A
Country	US
Kind code	A1
Filing date	Jan 26, 2016
Priority date	Jan 28, 2015
Publication date	Jan 11, 2018
Grant date	—

Abstract

A sensor for detecting a physical variable, including: —a sensor element for outputting an electrical signal dependent on the physical variable, —a substrate carrying the sensor element, —a printed circuit board, conducting the electrical signal, on the substrate, and —an embedding compound, in which the sensor element is completely embedded and the printed circuit board is at least partly embedded, —wherein at least one compensation element is embodied in the embedding compound, by which compensation element a mechanical stress caused by an element of the sensor at least partly embedded in the embedding compound is counteracted.

First claim

1 . A sensor for detecting a physical variable, comprising:
a sensor element for outputting an electrical signal dependent on the physical variable, a substrate supporting the sensor element, a conductor track conducting the electrical signal on the substrate, and an embedding compound, in which the sensor element is completely embedded and the conductor track is at least partially embedded, wherein at least one compensation element is embodied in the embedding compound, by means of which compensation element a mechanical stress induced by an element of the sensor at least partially embedded in the embedding compound is counteracted.

2 . The sensor as claimed in claim 1 ,
wherein the compensation element and the element of the sensor which causes the mechanical stress are arranged symmetrically.

3 . The sensor as claimed in claim 1 ,
wherein the compensation element is made of a different material from the embedding compound.

4 . The sensor as claimed in claim 1 ,
wherein the element of the sensor at least partially embedded in the embedding compound comprises the sensor element.

5 . The sensor as claimed in claim 4 ,
the compensation element comprising an electrical component which differs from the sensor element.

6 . The sensor as claimed in claim 5 ,
wherein the electrical component that differs from the sensor element is a filter element or a signal processing circuit.

7 . The sensor as claimed in claim 4 ,
wherein an electrical contact between the conductor track and the sensor element is different from an electrical contact of the compensation element with the conductor track or with another conductor track.

8 . The sensor as claimed in claim 7 ,
wherein the electrical contacts differ in their size.

9 . The sensor as claimed in claim 8 ,
wherein the size difference is designed in such a way that the mechanical stress is further reduced.

10 . A control device for a vehicle for controlling a behavior of the vehicle based on a detected physical variable, comprising a sensor as claimed in claim 1 , for detecting the physical variable.

11 . The sensor as claimed in claim 2 ,
wherein the compensation element is made of a different material from the embedding compound.

12 . The sensor as claimed in claim 5 ,
wherein an electrical contact between the conductor track and the sensor element is different from an electrical contact of the compensation element with the conductor track or with another conductor track.

Assignees

• Continental Teves Ag & Co Ohg

Inventors

• Raukopf Svenja
• Schillinger Jakob
• Schulmeister Michael

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/753

  between laterally-adjacent chips · CPC title

• B81B2207/012

  the micromechanical device and the control or processing electronics being separate parts in the same package · CPC title

• G01D11/245 Primary

  Housings for sensors · CPC title

• B81B7/0054

  between other parts not provided for in B81B7/0048 - B81B7/0051 · CPC title