Pressure sensor and method for manufacturing a pressure sensor

Patent metadata

Field	Value
Publication number	US-2018003580-A1
Application number	US-201715627604-A
Country	US
Kind code	A1
Filing date	Jun 20, 2017
Priority date	Jun 29, 2016
Publication date	Jan 4, 2018
Grant date	—

Abstract

The invention relates to a pressure sensor ( 1 ) comprising a pressure sensing arrangement ( 8 ) and a housing. The housing comprises an intermediate member ( 2 ) and a bottom part ( 3 ), wherein the intermediate member ( 2 ) comprises an aperture ( 4 ). The aperture ( 4 ) extends through the intermediate member ( 2 ), wherein the aperture ( 4 ) is on a first end ( 5 ) covered by a diaphragm ( 6 ) connected to the intermediate member ( 2 ). A second end ( 7 ) of the aperture ( 4 ) is covered by the bottom part ( 3 ) comprising the pressure sensing arrangement ( 8 ). Task of the invention is to provide a pressure sensor which allows a simplified and cost effective assembly and mounting. The task is solved in that the intermediate member ( 2 ) comprises a gripping surface ( 16 ) on an outer surface of the housing.

First claim

What is claimed is:

1 . A pressure sensor comprising a pressure sensing arrangement and a housing, wherein the housing comprises an intermediate member and a bottom part, wherein the intermediate member comprises an aperture extending through the intermediate member, wherein the aperture is on a first end covered by a diaphragm connected to the intermediate member, and wherein a second end of the aperture is covered by the bottom part comprising the pressure sensing arrangement, wherein the intermediate member 2 comprises a gripping surface on an outer surface of the housing.

2 . The pressure sensor according to claim 1 , wherein the gripping surface is a circumferential surface with a rotational symmetry around a rotational axis of the intermediate member.

3 . The pressure sensor according to claim 1 , wherein the intermediate member 2 is nut-shaped, wherein the circumferential surface of the intermediate member forms the gripping surface.

4 . The pressure sensor according to claim 3 , wherein the gripping surface is a polygon, in particular a polygon with a rotational symmetry around a central axis of the intermediate member.

5 . The pressure sensor according to claim 1 , wherein the surface area of the bottom part facing the intermediate member is less than 150% of the cross sectional area of the aperture at the second end.

6 . The pressure sensor according to claim 1 , wherein the pressure sensor comprises a support ring connected to the intermediate member, whereby the diaphragm is at its radially outer ends fixed to the intermediate member by the support ring.

7 . The pressure sensor according to claim 1 , wherein the pressure sensor comprises a connector member comprising at least one connector, wherein the connector member is fixed to the intermediate member at the side of the intermediate member facing the bottom part.

8 . The pressure sensor according to claim 7 , wherein the connector member and the intermediate member form a cavity in which the bottom part is arranged.

9 . The pressure sensor according to claim 1 , wherein the pressure sensor comprises a fluid connector for connecting the pressure sensor to a fluid conduit or a fluid tank, wherein the fluid connector is fixed to the intermediate member.

10 . The pressure sensor according to claim 9 , wherein the fluid connector and the intermediate member form a fluid chamber in which the diaphragm is arranged.

11 . The pressure sensor according to claim 1 , wherein a volume reduction member is arranged in the aperture.

12 . A method for manufacturing a pressure sensor according to claim 1 , wherein the intermediate member is formed by a stamping process, and wherein both the aperture and the gripping surface are formed in the stamping process.

13 . The method according to claim 12 , wherein after the intermediate member is formed, the diaphragm is fixed to the intermediate member covering the first end and then the fluid connector is fixed to the intermediate member.

14 . The method according to claim 13 , wherein the aperture is filled with a pressure transmitting fluid after both the diaphragm and the bottom part have been fixed to the intermediate member.

15 . The method according to claim 14 , wherein the connector member is fixed to the intermediate member after the bottom part has been fixed to the intermediate member, such that the bottom part is enclosed in the cavity.

16 . The pressure sensor according to claim 2 , wherein the intermediate member 2 is nut-shaped, wherein the circumferential surface of the intermediate member forms the gripping surface.

17 . The pressure sensor according to claim 2 , wherein the surface area of the bottom part facing the intermediate member is less than 150% of the cross sectional area of the aperture at the second end.

18 . The pressure sensor according to claim 3 , wherein the surface area of the bottom part facing the intermediate member is less than 150% of the cross sectional area of the aperture at the second end.

19 . The pressure sensor according to claim 4 , wherein the surface area of the bottom part facing the intermediate member is less than 150% of the cross sectional area of the aperture at the second end.

20 . The pressure sensor according to claim 2 , wherein the pressure sensor comprises a support ring connected to the intermediate member, whereby the diaphragm is at its radially outer ends fixed to the intermediate member by the support ring.

Assignees

• Danfoss As

Inventors

• Hansen Hans-Henning
• Kampp Ingvar Smari
• Nørgaard Lars
• Shetty Veenith
• Tonnesen Klaus

Classifications

• G01L19/0084

  to the outside of the housing (other details about the housing see G01L19/14) · CPC title

• G01L19/0046

  using isolation membranes (G01L13/026 and G01L19/0645 take precedence) · CPC title

• G01L19/0038

  being part of the housing (other details about the housing G01L19/14) · CPC title

• G01L9/0042 Primary

  Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms (details about the integration or bonding of piezoresistor in or on the diaphragm G01L9/0052 and G01L9/0057 respectively) · CPC title

• G01L19/142

  Multiple part housings · CPC title