Polymer composition, electronic device and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-2018002525-A9
Application number	US-201615340001-A
Country	US
Kind code	A9
Filing date	Nov 1, 2016
Priority date	Dec 4, 2015
Publication date	Jan 4, 2018
Grant date	—

Abstract

The present disclosure relates to a polymer composition including eco-friendly materials, an electronic device and a method of manufacturing the same. The polymer composition according to an aspect of the present disclosure includes a thermoplastic resin at 30 to 70 parts by weight; an eco-friendly resin, including a bio-resin, at 1 to 50 parts by weight; and a silicone resin at 1 to 60 parts by weight based on the total weight of the polymer composition.

First claim

What is claimed is:

1 . A polymer composition, comprising:
a thermoplastic resin at 30 to 70 parts by weight; an eco-friendly resin, including a bio-resin, at 1 to 50 parts by weight; and a silicone resin at 1 to 60 parts by weight based on the total weight of the polymer composition.

2 . The polymer composition of claim 1 , wherein the bio-resin includes at least one of a PA11 resin derived from castor bean and a corn-derived resin.

3 . The polymer composition of claim 2 , wherein the corn-derived resin includes an inedible corn-derived ingredient including polyether glycol.

4 . The polymer composition of claim 1 , wherein the eco-friendly resin includes a polyketone resin prepared using carbon monoxide as a raw material.

5 . The polymer composition of claim 1 , wherein the thermoplastic resin includes at least one selected from the group consisting of:
a thermoplastic polyurethane (TPU) resin, a thermoplastic polyolefin (TPO) resin, a thermoplastic elastomer resin, a rubber-modified styrene-based resin, a polyol-based resin, a polycarbonate (PC)-based resin, an ether-based resin, an ester-based resin, ethylene octane rubber (EOR), and a polypropylene (PP)-based thermoplastic vulcanizate (TPV).

6 . The polymer composition of claim 1 , wherein a tensile strength of the polymer composition is 10 kgF or greater.

7 . An electronic device comprising:
a polymer composition which includes:
a thermoplastic resin at 30 to 70 parts by weight,
an eco-friendly resin, including a bio-resin, at 1 to 50 parts by weight, and
a silicone resin at 1 to 60 parts by weight based on the total weight of the polymer composition.

8 . The electronic device of claim 7 , wherein the bio-resin includes at least one of a PA11 resin derived from castor bean and a corn-derived resin.

9 . The electronic device of claim 8 , wherein the corn-derived resin includes an inedible corn-derived ingredient including polyether glycol.

10 . The electronic device of claim 7 , wherein the eco-friendly resin includes a polyketone resin prepared using carbon monoxide as a raw material.

11 . The electronic device of claim 7 , wherein the thermoplastic resin includes at least one selected from the group consisting of:
a thermoplastic polyurethane (TPU) resin, a thermoplastic polyolefin (TPO) resin, a thermoplastic elastomer resin, a rubber-modified styrene-based resin, a polyol-based resin, a polycarbonate (PC)-based resin, an ether-based resin, an ester-based resin, ethylene octane rubber (EOR), and a polypropylene (PP)-based thermoplastic vulcanizate (TPV).

12 . The electronic device of claim 7 , wherein a tensile strength of the electronic device is 10 kgF or greater.

13 . The electronic device of claim 7 , wherein the electronic device includes a wearable device.

14 . A method of manufacturing an electronic device, the method comprising:
mixing:
a thermoplastic resin at 30 to 70 parts by weight,
co-friendly resin, including a bio-resin, at 1 to 50 parts by weight, and
a silicone resin at 1 to 60 parts by weight based on the total weight of the polymer composition;
adding the mixed polymer composition into a hopper of an extruder to produce the polymer composition in a pellet form; and adding the pellet into an injection molding device for injection molding.

15 . The method of claim 14 , further comprising performing injection molding by:
inserting the pellet into a hopper of the injection molding device; melting the inserted pellet; and providing the melted polymer composition to a mold.

16 . The method of claim 14 , wherein the bio-resin includes at least one of a PA11 resin derived from castor bean and a corn-derived resin.

17 . The method of claim 16 , wherein the corn-derived resin includes an inedible corn-derived ingredient including polyether glycol.

18 . The method of claim 14 , wherein the eco-friendly resin includes a polyketone resin prepared using carbon monoxide as a raw material.

19 . The method of claim 14 , wherein the thermoplastic resin includes at least one selected from the group consisting of:
a thermoplastic polyurethane (TPU) resin, a thermoplastic polyolefin (TPO) resin, a thermoplastic elastomer resin, a rubber-modified styrene-based resin, a polyol-based resin, a polycarbonate (PC)-based resin, an ether-based resin, an ester-based resin, ethylene octane rubber (EOR), and a polypropylene (PP) based thermoplastic vulcanizate (TPV).

20 . The method of claim 14 , wherein the electronic device includes a wearable device; and
wherein a tensile strength of the mixed polymer composition is 10 kgF or greater.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Jung Moon Il
• Kim In
• Pang Kyeong

Classifications

• C08L2205/03

  containing three or more polymers in a blend · CPC title

• C08G67/02

  Copolymers of carbon monoxide and aliphatic unsaturated compounds · CPC title

• C08L75/04 Primary

  Polyurethanes · CPC title

• B29C48/04

  Particle-shaped (making granules B29B9/00) · CPC title

• C08L77/02 Primary

  Polyamides derived from omega-amino carboxylic acids or from lactams thereof (C08L77/10 takes precedence) · CPC title