Epoxy resin composition

Patent metadata

Field	Value
Publication number	US-2017369629-A1
Application number	US-201715631790-A
Country	US
Kind code	A1
Filing date	Jun 23, 2017
Priority date	Jun 28, 2016
Publication date	Dec 28, 2017
Grant date	—

Abstract

In developing epoxy resin compositions used as an adhesive for structure (structural adhesive) required to have adhesive properties, if each component is increased to further enhance the adhesive properties such as shear bond strength and peel strength, this causes problems, for example, as follows. The viscosity becomes so high that the workability deteriorates. Hence, the added amount has to be limited. Moreover, the cured product becomes excessively flexible, so that the shear bond strength deteriorates. An epoxy resin composition contains the following components (A) to (E), where the component (A) does not include the component (C): the component (A): an epoxy resin; the component (B): a blocked urethane resin; the component (C): a rubber-modified epoxy resin; the component (D): rubber particles; and the component (E): a latent curing agent.

First claim

1 . An epoxy resin composition comprising the following components (A) to (E), wherein the component (A) does not include the component (C):
the component (A): an epoxy resin; the component (B): a blocked urethane resin; the component (C): a rubber-modified epoxy resin; the component (D): rubber particles; and the component (E): a latent curing agent.

2 . The epoxy resin composition according to claim 1 , wherein the component (D) is selected from the group consisting of acrylic rubbers and butadiene rubbers.

3 . The epoxy resin composition according to claim 1 , wherein the component (E) is selected from the group consisting of dicyandiamide and derivatives thereof, amine adduct compounds, as well as urea compounds and derivatives thereof.

4 . The epoxy resin composition according to claim 1 , comprising
3 to 30 parts by mass of the component (B) and 3 to 30 parts by mass of the component (D) relative to 100 parts by mass of a total of the components (A) and (C), and 1 to 16% by mass of the component (C) in the total of the components (A) and (C).

5 . The epoxy resin composition according to claim 1 , wherein the component (B) is a blocked urethane resin obtained from a urethane resin formed by reacting a polyalkylene polyol with a polyisocyanate compound.

6 . The epoxy resin composition according to claim 1 , wherein the component (A) is selected from the group consisting of bisphenol A-type epoxy resins, bisphenol F-type epoxy resins, and naphthalene type epoxy resins.

7 . The epoxy resin composition according to claim 1 , wherein the rubber component of the component (C) is NBR.

8 . The epoxy resin composition according to claim 1 , further comprising an inorganic powder.

9 . The epoxy resin composition according to claim 1 , wherein the rubber particles of the component (D) have an average particle diameter of 0.01 to 1 μm.

10 . The epoxy resin composition according to claim 1 , wherein the component (E) is selected from the group consisting of dicyandiamide and derivatives thereof, amine adduct compounds, as well as urea compounds and derivatives thereof.

11 . A thermosetting-type adhesive for structure comprising the epoxy resin composition according to claim 1 .

12 . The thermosetting-type adhesive for structure according to claim 11 , wherein the component (D) is selected from the group consisting of acrylic rubbers and butadiene rubbers.

13 . The thermosetting-type adhesive for structure according to claim 11 , wherein the component (E) is selected from the group consisting of dicyandiamide and derivatives thereof, amine adduct compounds, as well as urea compounds and derivatives thereof.

14 . A cured product obtained by curing the epoxy resin composition according to claim 1 .

15 . The cured product according to claim 14 , wherein the component (D) is selected from the group consisting of acrylic rubbers and butadiene rubbers.

16 . The cured product according to claim 14 , wherein the component (E) is selected from the group consisting of dicyandiamide and derivatives thereof, amine adduct compounds, as well as urea compounds and derivatives thereof.

17 . An adherend adhesion method comprising the steps of:
disposing the epoxy resin composition according to claim 1 between a pair of adherends; and curing the epoxy resin composition by heating.

18 . The adhesion method according to claim 17 , wherein the heating is performed at 50° C. to 200° C.

19 . The adhesion method according to claim 17 , wherein the component (D) is selected from the group consisting of acrylic rubbers and butadiene rubbers.

20 . The adhesion method according to claim 17 , wherein the component (E) is selected from the group consisting of dicyandiamide and derivatives thereof, amine adduct compounds, as well as urea compounds and derivatives thereof.

Assignees

• Three Bond Co Ltd

Inventors

• Mashima Miki
• MORITOKI Tatsuya
• Shimokawa Eiji

Classifications

• C08G18/58 Primary

  Epoxy resins {(C08G18/42, C08G18/48 take precedence; reaction products of epoxy resins with at least equivalent amounts of compounds containing active hydrogen C08G18/6407, with at least equivalent amounts of amines C08G18/6415; polymeric products of isocyanates or isothiocyanates with epoxy compounds having no active hydrogen C08G18/003)} · CPC title

• C08G18/755

  and at least one isocyanate or isothiocyanate group linked to a secondary carbon atom of the cycloaliphatic ring, e.g. isophorone diisocyanate · CPC title

• C08L63/00

  Compositions of epoxy resins; Compositions of derivatives of epoxy resins · CPC title

• C09D163/10

  Epoxy resins modified by unsaturated compounds · CPC title

• C08G59/4253

  Rubbers · CPC title