Mechanical impact protection for implantable hermetic assemblies
US-2024399158-A1 · Dec 5, 2024 · US
Hermetic structure and method of manufacturing the same
US2017367204A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2017367204-A1 |
| Application number | US-201715622239-A |
| Country | US |
| Kind code | A1 |
| Filing date | Jun 14, 2017 |
| Priority date | Jun 15, 2016 |
| Publication date | Dec 21, 2017 |
| Grant date | — |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A hermetic structure includes a hermetic body having a through-hole passing through a high pressure side and a low pressure side, the through-hole having a tapered portion whose diameter increases from the low pressure side toward the high pressure side, a conductor inserted through the through-hole, a protector component fit in the tapered portion, the protector component having a hole for inserting the conductor, and a glass member provided in the through-hole, on the low pressure side from the protector component, so as to seal the conductor.
First claim
Opening claim text (preview).
What is claimed is: 1 . A hermetic structure comprising: a hermetic body having a through-hole passing through a high pressure side and a low pressure side, the through-hole having a tapered portion whose diameter increases from the low pressure side toward the high pressure side; a conductor inserted through the through-hole; a protector component fit in the tapered portion, the protector component having a hole for inserting the conductor; and a glass member provided in the through-hole, on the low pressure side from the protector component, so as to seal the conductor. 2 . The hermetic structure according to claim 1 , wherein: the glass member fills a gap between the protector component and the through-hole. 3 . The hermetic structure according to claim 1 , wherein: a plurality of tapered portions is formed. 4 . The hermetic structure according to claim 1 , further comprising: a second glass member provided in the through-hole, on the high pressure side from the protector component so as to seal the conductor. 5 . The hermetic structure according to claim 1 , wherein: the protector component is formed of a material having a Young's modulus larger the that of the hermetic body. 6 . A method of manufacturing a hermetic structure including a hermetic body having a through-hole, which passes through the high pressure side and the low pressure side and has a tapered portion whose diameter increases from the low pressure side toward the high pressure side, and a conductor inserted through the through-hole, comprising: fitting a protector component having a hole for inserting the conductor, in the tapered portion; and melting a glass member disposed on the low pressure side of the through-hole, in a state where the conductor is inserted through the hole, thereby sealing the conductor.
Assignees
Inventors
Classifications
- H05K5/06Primary
Hermetically-sealed casings {(specially adapted for small components H05K5/0095)} · CPC title
- G01L19/145Primary
with stress relieving means · CPC title
- G01L19/00Primary
Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges · CPC title
Leakage or rupture protection or detection · CPC title
to the outside of the housing (other details about the housing see G01L19/14) · CPC title
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- What does patent US2017367204A1 cover?
- A hermetic structure includes a hermetic body having a through-hole passing through a high pressure side and a low pressure side, the through-hole having a tapered portion whose diameter increases from the low pressure side toward the high pressure side, a conductor inserted through the through-hole, a protector component fit in the tapered portion, the protector component having a hole for ins…
- Who is the assignee on this patent?
- Yokogawa Electric Corp
- What technology area does this patent fall under?
- Primary CPC classification H05K5/06. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Dec 21 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).