Fe-P-Cr ALLOY THIN PLATE AND METHOD FOR MANUFACTURING SAME

Patent metadata

Field	Value
Publication number	US-2017362729-A1
Application number	US-201515539624-A
Country	US
Kind code	A1
Filing date	Dec 2, 2015
Priority date	Dec 24, 2014
Publication date	Dec 21, 2017
Grant date	—

Abstract

The present invention relates to an Fe—P—Cr alloy thin plate and a method for manufacturing the same. An embodiment of the present invention provides an Fe—P—Cr alloy thin plate including, in terms of wt %, P (6.0-13.0%), Cr (0.002-0.1%), and the balance of Fe and other inevitable impurities.

First claim

1 - 29 . (canceled)

30 . An Fe—P—Cr alloy thin plate comprising, in terms of wt %, P (6.0-13.0%), Cr (0.002-0.1%), and the balance of Fe and other inevitable impurities.

31 . The Fe—P—Cr alloy thin plate of claim 30 , wherein the Fe—P—Cr alloy thin plate further includes Ni (0.5-5.0%) in terms of wt %.

32 . The Fe—P—Cr alloy thin plate of claim 31 , wherein the thin plate has Vickers hardness of less than or equal to 600 HV.

33 . The Fe—P—Cr alloy thin plate of claim 32 , wherein the thin plate has a saturation magnetic flux density of greater than or equal to 1.5 T.

34 . The Fe—P—Cr alloy thin plate of claim 33 , wherein the thin plate has a thickness of 1 μm to 100 μm.

35 . The Fe—P—Cr alloy thin plate of claim 34 , wherein the Fe—P—Cr alloy thin plate has a mixed form of amorphous and crystal grains.

36 . The Fe—P—Cr alloy thin plate of claim 35 , wherein the crystal grain has a particle diameter of greater than or equal to 0.1 nm and less than or equal to 100 nm.

37 . The Fe—P—Cr alloy thin plate of claim 36 , wherein a volume fraction of the crystal grain based on an amorphous matrix is 1% to 10%.

38 . A method of manufacturing an Fe—P—Cr alloy thin plate, comprising:
forming a plating solution including an iron compound, a phosphorus compound, and a chromium compound;
applying a current to the formed plating solution;
electrodepositing an Fe—P—Cr alloy layer including, in terms of wt %, P (6.0-13.0%), Cr (0.002-0.1%), and the balance of Fe and other inevitable impurities on a cathode plate using the current; and
delaminating the Fe—P—Cr alloy layer from the cathode plate to obtain an Fe—P—Cr alloy thin plate.

39 . The method of manufacturing an Fe—P—Cr alloy thin plate of claim 38 , wherein the Fe—P—Cr alloy thin plate has a thickness of 1 μm to 100 μm.

40 . The method of manufacturing an Fe—P—Cr alloy thin plate of claim 38 , wherein the forming of the plating solution including the iron compound, the phosphorus compound, and the chromium compound includes
forming a plating solution including an iron compound, a phosphorus compound, a chromium compound, and a nickel compound.

41 . The method of manufacturing an Fe—P—Cr alloy thin plate of claim 40 , wherein in the forming of the plating solution including the iron compound, the phosphorus compound, the chromium compound, and the nickel compound,
a concentration of the iron compound in the plating solution is 0.5 M to 4.0 M, and
the iron compound includes FeSO 4 , Fe(SO 3 NH 2 ) 2 , FeCl 2 , or a combination thereof.

42 . The method of manufacturing an Fe—P—Cr alloy thin plate of claim 41 , wherein in the forming of the plating solution including the iron compound, the phosphorus compound, the chromium compound, and the nickel compound,
a concentration of the phosphorus compound in the plating solution is 0.01 M to 3.0 M, and
the phosphorus compound includes NaH 2 PO 2 , H 3 PO 2 , H 3 PO 3 , or a combination thereof.

43 . The method of manufacturing an Fe—P—Cr alloy thin plate of claim 42 , wherein in the forming of the plating solution including the iron compound, the phosphorus compound, the chromium compound, and the nickel compound,
a concentration of the chromium compound in the plating solution is 0.001 M to 2.0 M, and
the chromium compound includes CrCl 3 , Cr 2 (SO 4 ) 3 , CrO 3 , or a combination thereof.

44 . The method of manufacturing an Fe—P—Cr alloy thin plate of claim 43 , wherein in the forming of the plating solution including the iron compound, the phosphorus compound, the chromium compound, and the nickel compound,
a concentration of the nickel compound in the plating solution is 0.1 M to 3.0 M, and
the nickel compound includes NiSO 4 , NiCl 2 , or a combination thereof.

45 . The method of manufacturing an Fe—P—Cr alloy thin plate of claim 40 , wherein the forming of the plating solution including the iron compound, the phosphorus compound, the chromium compound, and the nickel compound includes
forming a plating solution including the iron compound, the phosphorus compound, the chromium compound, the nickel compound, and an additive, wherein a concentration of the additive in the plating solution is 0.001 M to 0.1 M.

46 . The method of manufacturing an Fe—P—Cr alloy thin plate of claim 38 , wherein in the forming of the plating solution including the iron compound, the phosphorus compound, and the chromium compound,
pH of the plating solution is 1 to 4.

47 . The method of manufacturing an Fe—P—Cr alloy thin plate of claim 38 , wherein in the forming of the plating solution including the iron compound, the phosphorus compound, and the chromium compound,
a temperature of the plating solution is 30° C. to 100° C.

48 . The method of manufacturing an Fe—P—Cr alloy thin plate of claim 38 , wherein in the applying of a current to the formed plating solution,
a current density is 1 A/dm 2 to 100 A/dm 2 .

49 . The method of manufacturing an Fe—P—Cr alloy thin plate of claim 38 , wherein the electrodepositing of the Fe—P—Cr alloy layer including, in terms of wt %, P (6.0-13.0%), Cr (0.002-0.1%), and the balance of Fe and other inevitable impurities on a cathode plate using the current includes
electrodepositing an Fe—P—Cr—Ni alloy layer including, in terms of wt %, P (6.0-13.0%), Cr (0.002-0.1%), Ni (0.5-5.0%), and the balance of Fe and other inevitable impurities on a cathode plate using the current.

Assignees

• Posco

Inventors

• Kim Dongkyun
• Yang Hongseok

Classifications

• C25D1/04

  Wires; Strips; Foils · CPC title

• C22C38/18 Primary

  containing chromium · CPC title

• C25D1/20 Primary

  Separation of the formed objects from the electrodes {with no destruction of said electrodes} · CPC title

• C22C45/008

  with Fe, Co or Ni as the major constituent (C22C45/02, C22C45/04 take precedence) · CPC title

• C22C38/002 Primary

  containing In, Mg, or other elements not provided for in one single group C22C38/001 - C22C38/60 · CPC title