Method of manufacturing electroformed components

Patent metadata

Field	Value
Publication number	US-2017362728-A1
Application number	US-201515533694-A
Country	US
Kind code	A1
Filing date	Dec 11, 2015
Priority date	Dec 12, 2014
Publication date	Dec 21, 2017
Grant date	—

Abstract

In manufacturing of a first electroformed component and a second electroformed component having portions fitted to each other into close contact, after the first electroformed component is formed, the first electroformed component is used as a portion of an electroforming mold to form the second electroformed component. Using the first electroformed component as a portion of the electroforming mold to form the second electroformed component, the shape of the first electroformed component is transferred to the second electroformed component. As a result, multiple types of components differing in shape may be accurately manufactured concurrently in a series of manufacturing steps.

First claim

1 - 9 . (canceled)

10 . A method of manufacturing electroformed components comprising:
forming a first through-hole by patterning a first photoresist layer formed on a front surface side of a conductive layer, the first through-hole penetrating the first photoresist layer along a stacking direction of the conductive layer and the first photoresist layer; depositing a first electroformed member on the front surface side of the conductive layer in the first through-hole by electroforming using the conductive layer as one electrode; forming a first electroformed component by planarizing the front surface side of the first electroformed member and the first photoresist layer; removing the first photoresist layer from the conductive layer having the first electroformed component formed; forming a film for separation on a surface of the first electroformed component exposed by removing the first photoresist layer; forming a second through-hole by forming on the front surface side of the conductive layer, a second photoresist layer covering the first electroformed component from the front surface side and by patterning the second photoresist layer, the second through-hole penetrating the second photoresist layer along the stacking direction while a portion of the first electroformed component projects inward; depositing a second electroformed member on the front surface side of the conductive layer in the second through-hole by electroforming using the conductive layer as one electrode; forming a second electroformed component by planarizing the front surface side of the second electroformed member and the second photoresist layer; removing the conductive layer from the first electroformed component, the second electroformed component, and the second photoresist layer; and removing the second photoresist layer from the first electroformed component and the second electroformed component having the conductive layer removed.

11 . The method according to claim 10 , comprising
chamfering the first electroformed component at least on a corner of a portion located in the second through-hole, wherein the forming of the film for separation is executed after the chamfering.

12 . The method according to claim 11 , wherein
the chamfering includes chamfering the corner by one of electrolytic polishing and wet etching.

13 . The method according to claim 10 , wherein
the conductive layer is formed on a surface of a substrate containing one of an insulating material and a semiconductive material.

14 . The method according to claim 10 , wherein,
the forming of the film for separation includes forming a surface oxide film as the film for separation.

15 . The method according to claim 10 , wherein
the first electroformed component and the second electroformed component are components at least partially in close contact with or abutting each other.

16 . The method according to claim 15 , wherein
the first electroformed component and the second electroformed component are components that move relative to each other while at least partially in close contact with or abutting each other.

17 . The method according to claim 10 , wherein
the forming of the first electroformed component includes planarizing the first electroformed member and the first photoresist layer by grinding from the front surface side.

18 . The method according to claim 10 , wherein
the forming of the second electroformed component includes planarizing the second electroformed member and the second photoresist layer by grinding from the front surface side.

Assignees

• Citizen Watch Co Ltd

Inventors

• Abe Yosuke
• Ikeda Tomoo
• Shima Ryoichi
• Ono Yoshiki
• Asami Taku
• Sasaki Yosuke

Classifications

• H10P14/47

  Electrolytic deposition, i.e. electroplating; Electroless plating · CPC title

• G03F7/0035

  Multiple processes, e.g. applying a further resist layer on an already in a previously step, processed pattern or textured surface · CPC title

• G03F7/40

  Treatment after imagewise removal, e.g. baking · CPC title

• G03F7/094

  Multilayer resist systems, e.g. planarising layers · CPC title

• C25D1/08 Primary

  Perforated or foraminous objects, e.g. sieves (C25D1/10 takes precedence) · CPC title