Combined patch and design-based defect detection

Patent metadata

Field	Value
Publication number	US-2017345142-A1
Application number	US-201615356799-A
Country	US
Kind code	A1
Filing date	Nov 21, 2016
Priority date	May 25, 2016
Publication date	Nov 30, 2017
Grant date	—

Abstract

Defect detection is performed by comparing a test image and a reference image with a rendered design image, which may be generated from a design file. This may occur because a comparison of the test image and another reference image was inconclusive due to noise. The results of the two comparisons with the rendered design image can indicate whether a defect is present in the test image.

First claim

What is claimed is:

1 . A system comprising:
a review tool, wherein the review tool includes:
a stage configured to hold a wafer; and
an image generation system configured to generate a test image of the wafer; and
a controller in electronic communication with the review tool, wherein the controller is configured to:
compare the test image and a first reference image;
determine that a defect is present in the test image based on comparing the test image and the first reference image;
compare the first reference image to a rendered design image to generate a first value;
compare the test image to the rendered design image to generate a second value; and
determine a result corresponding to whether the second value is greater than the first value.

2 . The system of claim 1 , wherein the controller includes a processor, an electronic data storage unit in electronic communication with the processor, and a communication port in electronic communication with the processor and the electronic data storage unit, and wherein the electronic data storage unit includes the first reference image.

3 . The system of claim 1 , wherein the review tool is a scanning electron microscope.

4 . The system of claim 1 , wherein the image generation system is configured to use at least one of an electron beam, a broad band plasma, or a laser to generate the image of the wafer.

5 . The system of claim 1 , wherein the result is that the first value is greater than or equal to the second value, and wherein the controller is further configured to report that no defect is present in the test image.

6 . The system of claim 1 , wherein the result is that the second value is greater than the first value, and wherein the controller is further configured to compare the second value to a threshold.

7 . The system of claim 6 , wherein the second value exceeds the threshold, and wherein the controller is configured to report that a defect is present in the test image.

8 . The system of claim 6 , wherein the second value is less than the threshold, and wherein the controller is configured to report that no defect is present in the test image.

9 . The system of claim 1 , wherein the rendered design is based on a design file.

10 . The system of claim 1 , wherein comparing the test image and the first reference image includes subtracting the first reference image from the test image.

11 . The system of claim 1 , wherein comparing the first reference image and the rendered design image includes subtracting the rendered design image from the first reference image, and wherein comparing the test image to the rendered design image includes subtracting the rendered design image from the test image.

12 . A method comprising:
comparing, using a controller, a test image and a first reference image of a wafer; determining, using the controller, that a defect is present in the test image based on comparing the test image and the first reference image; comparing, using the controller, the first reference image to a rendered design image to generate a first value; comparing, using the controller, the test image to the rendered design image to generate a second value; and determining, using the controller, a result, wherein the result corresponds to whether the second value is greater than the first value.

13 . The method of claim 12 , further comprising:
comparing the test image and a second reference image prior to comparing the test image to the rendered design, wherein the second reference image has more noise than the first reference image; and determining, using the controller, that no defect is present in the test image based on comparing the test image and the second reference image.

14 . The method of claim 12 , wherein the result is that the first value is greater than or equal to the second value, and further comprising reporting, using the controller, that no defect is present in the test image.

15 . The method of claim 12 , wherein the result is that the second value is greater than the first value, and further comprising comparing, using the controller, the second value to a threshold.

16 . The method of claim 15 , wherein the second value exceeds the threshold, and further comprising reporting, using the controller, that a defect is present in the test image.

17 . The method of claim 15 , wherein the second value is less than the threshold, and further comprising reporting, using the controller, that no defect is present in the test image.

18 . The method of claim 12 , wherein the rendered design is based on a design file.

19 . The method of claim 12 , wherein comparing the test image and the first reference image includes subtracting the first reference image from the test image, wherein comparing the first reference image and the rendered design image includes subtracting the rendered design image from the first reference image, and wherein comparing the test image to the rendered design image includes subtracting the rendered design image from the test image.

20 . The method of claim 12 , further comprising:
loading the wafer onto a stage of a review tool; and imaging the wafer on the stage of the review tool.

Assignees

• Kla Tencor Corp

Inventors

• Brauer Bjorn
• Bhattacharyya Santosh

Classifications

• G06T7/001 Primary

  using an image reference approach · CPC title

• G06T7/0006 Primary

  using a design-rule based approach · CPC title

• G06V10/751

  Comparing pixel values or logical combinations thereof, or feature values having positional relevance, e.g. template matching · CPC title

• G06T2207/10061

  from scanning electron microscope · CPC title

• G06K9/6202

  Physics · mapped topic