Flame retardant laser direct structuring materials

Patent metadata

Field	Value
Publication number	US-2017342263-A1
Application number	US-201715673583-A
Country	US
Kind code	A1
Filing date	Aug 10, 2017
Priority date	May 23, 2008
Publication date	Nov 30, 2017
Grant date	—

Abstract

Flame retardant thermoplastic compositions that are capable of being used in a laser direct structuring process. The compositions include a thermoplastic resin, a laser direct structuring additive, and a flame retardant. The compositions offer flame retardant characteristics while also substantially maintaining the mechanical properties of the base thermoplastic resin, such as the impact strength and/or HDT of the composition. The compositions can be used in a variety of applications such as personal computers, notebook and portable computers, cell phone and other such communications equipment.

First claim

What is claimed is:

1 . A thermoplastic composition, comprising:
a) from 15 to 85 wt % of a thermoplastic resin, wherein the thermoplastic resin comprises a polyamide resin; b) from 0.1 to 30 wt % by weight of a laser direct structuring additive; and c) 20 wt % or less of a flame retardant; wherein a molded sample of the thermoplastic composition is capable of achieving UL94 V0 rating at a thickness of 1.6 mm (±10%).

2 . The composition of claim 1 , wherein the polyamide resin comprises polyamide-6, polyamide-6,6, polyamide-4,6, polyamide-11, polyamide-12, polyamide-6,10, polyamide-6,12, polyamide 6/6,6, polyamide-6/6,12, polyamide MXD,6, polyamide-6,T, polyamide-6,I, polyamide-6/6,T, polyamide-6/6,I, polyamide-6,6/6,T, polyamide-6,6/6,I, polyamide-6/6,T/6,I, polyamide-6,6/6,T/6,I, polyamide-6/12/6,T, polyamide-6,6/12/6,T, polyamide-6/12/6,I, polyamide-6,6/12/6,I, or a combination comprising at least one of the foregoing polyamide resins.

3 . The composition of claim 1 , wherein the laser direct structuring additive is selected from a heavy metal mixture oxide spinel, a copper salt, or a combination including at least one of the foregoing laser direct structuring additives.

4 . The composition of claim 3 , wherein the laser direct structuring additive comprises copper chromium oxide spinel or copper hydroxide phosphate.

5 . The composition of claim 1 , wherein the flame retardant is selected from a phosphorus containing flame retardant, an organic compound containing phosphorus-nitrogen bonds, or a combination including at least one of the foregoing flame retardants.

6 . The composition of claim 1 , wherein a molded sample of the thermoplastic composition is capable of achieving UL94 V0 rating at a thickness of 1.2 mm (±10%).

7 . The composition of claim 1 , wherein a molded sample of the thermoplastic composition is capable of achieving UL94 V0 rating at a thickness of 1.0 mm (±10%).

8 . The composition of claim 1 , wherein a molded sample of the thermoplastic composition is capable of achieving UL94 V0 rating at a thickness of 0.8 mm (±10%).

9 . The composition of claim 1 , wherein the thermoplastic composition includes from 0.1 to 15 wt % of the flame retardant.

10 . An article of manufacture comprising the composition of claim 1 .

11 . The article of claim 10 , wherein the article is selected from a personal computer, a notebook computer, a portable computers, a cell phone, or a personal digital assistant.

12 . A method of forming a thermoplastic composition comprising the step of: blending in an extruder:
a) from 15 to 85 wt % of a thermoplastic resin, wherein the thermoplastic resin comprises a polyamide resin; b) from 0.1 to 15 wt % of a laser direct structuring additive; and c) 20 wt % or less of a flame retardant; wherein a molded sample of the thermoplastic composition is capable of achieving UL94 V0 rating at a thickness of 1.6 mm (±10%).

13 . The method of claim 12 , wherein the polyamide resin comprises polyamide-6, polyamide-6,6, polyamide-4,6, polyamide-11, polyamide-12, polyamide-6,10, polyamide-6,12, polyamide 6/6,6, polyamide-6/6,12, polyamide MXD,6, polyamide-6,T, polyamide-6,I, polyamide-6/6,T, polyamide-6/6,I, polyamide-6,6/6,T, polyamide-6,6/6,I, polyamide-6/6,T/6,I, polyamide-6,6/6,T/6,I, polyamide-6/12/6,T, polyamide-6,6/12/6,T, polyamide-6/12/6,I, polyamide-6,6/12/6,I, or a combination comprising at least one of the foregoing polyamide resins.

14 . The method of claim 12 , wherein the laser direct structuring additive is selected from a heavy metal mixture oxide spinel, a copper salt, or a combination including at least one of the foregoing laser direct structuring additives.

15 . The method of claim 14 , wherein the laser direct structuring additive comprises copper chromium oxide spinel or copper hydroxide phosphate.

16 . The method of claim 12 , wherein the flame retardant is selected from a phosphorus containing flame retardant, an organic compound containing phosphorus-nitrogen bonds, or a combination including at least one of the foregoing flame retardants.

17 . The method of claim 12 , wherein a molded sample of the thermoplastic composition is capable of achieving UL94 V0 rating at a thickness of 1.2 mm (±10%).

18 . The method of claim 12 , wherein a molded sample of the thermoplastic composition is capable of achieving UL94 V0 rating at a thickness of 1.0 mm (±10%).

19 . The method of claim 12 , wherein a molded sample of the thermoplastic composition is capable of achieving UL94 V0 rating at a thickness of 0.8 mm (±10%).

20 . The method of claim 12 , wherein the thermoplastic composition includes from 0.1 to 15 wt % of the flame retardant.

Assignees

• Sabic Global Technologies Bv

Inventors

• Li Yanjun Frank
• Meng Jiru
• Zou Xiangping David

Classifications

• C08L25/04

  Homopolymers or copolymers of styrene · CPC title

• C08K5/521

  Esters of phosphoric acids, e.g. of H3PO4 · CPC title

• C08L71/12

  Polyphenylene oxides · CPC title

• C08K5/5399

  Phosphorus bound to nitrogen · CPC title

• C08L69/00 Primary

  Compositions of polycarbonates; Compositions of derivatives of polycarbonates · CPC title