Mounting and environmental protection device for an igbt module

Patent metadata

Field	Value
Publication number	US-2017330815-A1
Application number	US-201615156169-A
Country	US
Kind code	A1
Filing date	May 16, 2016
Priority date	May 16, 2016
Publication date	Nov 16, 2017
Grant date	—

Abstract

A semiconductor module is disclosed. The semiconductor module may include a housing having a sidewall portion, a housing support plate coupled to a bottom surface of the sidewall portion such that the housing support plate and the sidewall portion define an interior space of the housing of the semiconductor module, and a semiconductor device disposed within the interior space and fixedly coupled to the housing. The semiconductor module may further include a cover member fixedly attached to a top surface of the sidewall portion such that the cover member, the housing and the housing support plate form a protective enclosure for the semiconductor device.

First claim

1 . A semiconductor module, comprising:
a housing having a sidewall portion; a housing support plate coupled to a bottom surface of the sidewall portion, the housing support plate and the sidewall portion defining an interior space of the housing of the semiconductor module; a semiconductor device disposed within the interior space and fixedly coupled to the housing; and a cover member fixedly attached to a top surface of the sidewall portion, such that the cover member, the housing, and the housing support plate form a protective enclosure for the semiconductor device,
wherein:
the cover member includes a first set of holes extending from a top surface of the cover member to a bottom surface of the cover member,
the housing includes a second set of holes extending from the top surface of the sidewall portion to the bottom surface of the sidewall portion,
the housing support plate includes a third set of holes formed in a top surface of the housing support plate, and
the first set of holes, the second set of holes and the third set of holes are aligned such that a fastening device being inserted into each of the first set of holes, the second set of holes, and the third set of holes fixedly attaches the cover member, the housing, and the housing support plate together.

2 . (canceled)

3 . The semiconductor module of claim 1 , further comprising a plurality of attachment structures integrated with the sidewall portion,
wherein the plurality of attachment structures include a first set of attachment holes and the semiconductor device includes a second set of attachment holes,
the first set of attachment holes aligning with the second set of attachment holes such that a fastening device, inserted into each of the first and second set of attachment holes, secures the semiconductor device between the plurality of attachment structures and the housing support plate.

4 . The semiconductor module of claim 3 , wherein the fastening device is a pressure fastening device which exerts a pressure on the semiconductor device such that a bottom surface of the semiconductor device maintains contact with a top surface of the housing support plate.

5 . The semiconductor module of claim 2 , wherein a first sealing element is disposed between the bottom surface of the cover member and the top surface of the sidewall portion thereby forming a first seal between the cover member and the sidewall portion, and
wherein a second sealing element is disposed between the bottom surface of the sidewall portion and the top surface of the housing support plate thereby forming a second seal between the sidewall portion and the housing support plate.

6 . The semiconductor module of claim 1 , wherein the interior space of the housing is configured to accommodate a plurality of semiconductor module components arranged above the semiconductor device.

7 . The semiconductor module of claim 6 , wherein the sidewall portion includes a sidewall aperture extending from the interior space of the housing to an exterior space of the housing, and
wherein the plurality of semiconductor module components have an input/output connection extending through the sidewall aperture.

8 . The semiconductor module of claim 5 , wherein the housing support plate includes a housing support plate aperture extending from the top surface of the housing support plate through a bottom surface of the housing support plate, and
wherein the housing support plate aperture is contained within a sealing element groove formed around a periphery of the housing support plate, such that the second seal is maintained and a semiconductor module input/output connection passes from the interior space of the housing to an exterior space of the semiconductor module.

9 . A power converter system, comprising:
a plurality of semiconductor modules,
each semiconductor module, of the plurality of semiconductor modules, including a housing and a semiconductor device,
the housing, of each semiconductor module of the plurality of semiconductor modules, having a sidewall portion which includes a top surface and a bottom surface;

a semiconductor module heat sink having a plurality of module mounting locations arranged on a top surface of the semiconductor module heat sink,
each semiconductor module, of the plurality of semiconductor modules, being positioned at one of the plurality of module mounting locations and coupled to the semiconductor module heat sink along the bottom surface of the sidewall portion,
the sidewall portion of each semiconductor module of the plurality of semiconductor modules, and the top surface of the semiconductor module heat sink defining an interior space of each semiconductor module of the plurality of semiconductor modules;

a plurality of attachment structures integrated with the sidewall portion of each semiconductor module, of the plurality of semiconductor modules, and adapted to secure the semiconductor device, of each semiconductor module, within the interior space of the semiconductor module; and a cover member attached to the top surface of the sidewall portion, of the semiconductor module, such that the cover member, the housing of the semiconductor module, and the semiconductor module heat sink form a protective enclosure for the semiconductor device of the semiconductor module.

10 . The power converter system of claim 9 , wherein:
the cover member, of the semiconductor module, includes a first set of holes extending from a top surface of the cover member to a bottom surface of the cover member, the housing, of the semiconductor module, includes a second set of holes extending from the top surface of the sidewall portion, of the semiconductor module, to the bottom surface of the sidewall portion, each module mounting location, of the plurality of module mounting locations, includes a third set of holes formed in the top surface of the semiconductor module heat sink, and the first set of holes, the second set of holes, and the third set of holes are aligned such that a fastening device being inserted into each of the first set of holes, the second set of holes and the third set of holes fixedly attaches the cover member, the housing and the semiconductor module heat sink together.

11 . The power converter system of claim 9 , wherein:
the plurality of attachment structures include a first set of attachment holes, the semiconductor device, of the semiconductor module, includes a second set of attachment holes, and the first set of attachment holes align with the second set of attachment holes such that a fastening device, inserted into each of the first set of attachment holes and the second set of attachment holes, positions and secures the semiconductor device between the plurality of attachment structures and the semiconductor module heat sink.

12 . The power converter system of claim 11 , wherein the fastening device is a pressure fastening device which exerts a pressure on the semiconductor device, of the semiconductor module, such that a bottom surface of the semiconductor device maintains contact with the top surface of the semiconductor module heat sink.

13 . The power converter system of claim 10 , wherein a first sealing element is disposed between the bottom surface of the cover member and the top surface of the sidewall portion, thereby forming a first seal between the cover member and the sidewall portion, and
wherein a second sealing element is disposed between the bottom surface of the sidewall portion and the top surface of the semiconductor module heat sink thereby forming a second seal between the housing and the semiconductor module heat si

Assignees

• Caterpillar Inc

Inventors

• Mische William
• Andris Eric
• Qattum Basheer
• Sergison Daniel

Classifications

• H10W90/00

  Package configurations · CPC title

• H10W40/60

  Securing means for detachable heating or cooling arrangements, e.g. clamps · CPC title

• H10W40/611

  Bolts or screws · CPC title

• H10W40/22

  characterised by their shape, e.g. having conical or cylindrical projections · CPC title

• H05K7/14324 Primary

  comprising modular units, e.g. DIN rail mounted units · CPC title