Refined copper, method of producing refined copper, electric wire and method of manufacturing electric wire

US2017327961A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2017327961-A1
Application numberUS-201615194366-A
CountryUS
Kind codeA1
Filing dateJun 27, 2016
Priority dateMay 10, 2016
Publication dateNov 16, 2017
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method of producing a refined copper includes depositing the refined copper on a cathode by an electroplating process or an electroless plating process in an alkaline plating bath including a solution of a copper compound that includes none of sulfur, chlorine and oxygen elements and produces copper ions having a valence of +1 in the solution.

First claim

Opening claim text (preview).

What is claimed is: 1 . A method of producing a refined copper, comprising depositing the refined copper on a cathode by an electroplating process or an electroless plating process in an alkaline plating bath comprising a solution of a copper compound that includes none of sulfur, chlorine and oxygen elements and produces copper ions having a valence of +1 in the solution. 2 . The method according to claim 1 , wherein the copper compound comprises a copper cyanide. 3 . The method according to claim 1 , wherein only the copper compound composes a copper compound in the plating bath. 4 . The method according to claim 1 , wherein a sulfur concentration in the refined copper from an outermost surface to a depth of 80 nm is not more than 620 mass ppm. 5 . The method according to claim 1 , wherein a chlorine concentration in the refined copper from an outermost surface to a depth of 60 nm is not more than 700 mass ppm. 6 . The method according to claim 1 , wherein a sulfur concentration in the refined copper from an outermost surface to a depth of 2.5 μm is not more than 300 mass ppm. 7 . The method according to claim 1 , wherein a chlorine concentration in the refined copper from an outermost surface to a depth of 2.5 μm is not more than 61 mass ppm. 8 . The method according to claim 1 , wherein a sulfur concentration in an entirety of the refined copper is not more than 3.1 mass ppm. 9 . The method according to claim 1 , wherein a chlorine concentration in an entirety of the refined copper is not more than 1.1 mass ppm. 10 . The method according to claim 1 , wherein a particle size on a surface of the refined copper is not less than 0.5 μm and not more than 5 μm. 11 . The method according to claim 1 , wherein a starting sheet comprising copper is used as the cathode and is included in the refined copper, and wherein a sulfur concentration in an entirety of the refined copper including the starting sheet is not more than 3.1 mass ppm. 12 . The method according to claim 1 , wherein a starting sheet comprising copper is used as the cathode and is included in the refined copper, and wherein a chlorine concentration in an entirety of the refined copper including the starting sheet is not more than 1.1 mass ppm. 13 . The method according to claim 1 , wherein a conductive metal plate comprising an alloy including at least one or more of stainless steel, transition metals or transition metal elements is used as the cathode, and wherein the refined copper is obtained by stripping from the conductive metal plate. 14 . The method according to claim 1 , wherein a conductive plate comprising a composite material comprising a metal in the form of mesh or plate and a carbon nanotube is used as the cathode, and wherein the refined copper is obtained by stripping from the conductive plate. 15 . A refined copper, wherein a sulfur concentration from an outermost surface to a depth of 80 nm is not more than 620 mass ppm. 16 . A refined copper, wherein a chlorine concentration from an outermost surface to a depth of 60 nm is not more than 700 mass ppm. 17 . A refined copper, wherein a sulfur concentration from an outermost surface to a depth of 2.5 μm is not more than 300 mass ppm. 18 . A refined copper, wherein a chlorine concentration from an outermost surface to a depth of 2.5 μm is not more than 61 mass ppm. 19 . A refined copper, wherein a sulfur concentration in an entirety of the refined copper is not more than 3.1 mass ppm. 20 . A refined copper, wherein a chlorine concentration in an entirety of the refined copper is not more than 1.1 mass ppm. 21 . A refined copper, wherein a sulfur concentration from an outermost surface to a depth of 80 nm is not more than 620 mass ppm, wherein a chlorine concentration from the outermost surface to a depth of 60 nm is not more than 700 mass ppm, wherein a sulfur concentration from the outermost surface to a depth of 2.5 μm is not more than 300 mass ppm, wherein a chlorine concentration from the outermost surface to a depth of 2.5 μm is not more than 61 mass ppm, wherein a sulfur concentration in an entirety of the refined copper is not more than 3.1 mass ppm, and wherein a chlorine concentration in the entirety of the refined copper is not more than 1.1 mass ppm. 22 . A refined copper, wherein a particle size on a surface of the refined copper is not less than 0.5 μm and not more than 5 μm. 23 . A method of manufacturing an electric wire, comprising making a wire conductor using the refined copper produced by the method according to claim 1 . 24 . The method according to claim 23 , wherein the wire conductor has a sulfur concentration of not more than 3.1 mass ppm, a conductivity of not less than 102.5% IACS and a half-softening temperature of not less than 125° C. and not more than 133° C. 25 . An electric wire, comprising a conductor that does not titanium as an additive element, and that has a sulfur concentration of not more than 3.1 mass ppm, a chlorine concentration of not more than 1.1 mass ppm, a conductivity of not less than 102.5% IACS and a half-softening temperature of not less than 125° C. and not more than 133° C. 26 . A method of manufacturing an electric wire, comprising making a wire conductor using the refined copper according to claim 15 . 27 . A method of manufacturing an electric wire, comprising making a wire conductor using the refined copper according to claim 16 . 28 . A method of manufacturing an electric wire, comprising making a wire conductor using the refined copper according to claim 17 . 29 . A method of manufacturing an electric wire, comprising making a wire conductor using the refined copper according to claim 18 . 30 . A method of manufacturing an electric wire, comprising making a wire conductor using the refined copper according to claim 19 . 31 . A method of manufacturing an electric wire, comprising making a wire conductor using the refined copper according to claim 20 . 32 . A method of manufacturing an electric wire, comprising making a wire conductor using the refined copper according to claim 21 . 33 . A method of manufacturing an electric wire, comprising making a wire conductor using the refined copper according to claim 22 .

Assignees

Inventors

Classifications

  • Obtaining copper · CPC title

  • Alloys based on copper · CPC title

  • Alloys based on copper · CPC title

  • Electrodes (consumable anodes for the refining the metals C25C1/00 - C25C5/00); Connections thereof · CPC title

  • C25C1/12Primary

    of copper · CPC title

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What does patent US2017327961A1 cover?
A method of producing a refined copper includes depositing the refined copper on a cathode by an electroplating process or an electroless plating process in an alkaline plating bath including a solution of a copper compound that includes none of sulfur, chlorine and oxygen elements and produces copper ions having a valence of +1 in the solution.
Who is the assignee on this patent?
Hitachi Metals Ltd
What technology area does this patent fall under?
Primary CPC classification C25C1/12. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Thu Nov 16 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).