Automated Ceramic Matrix Composite Ply Layup

US2017320785A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2017320785-A1
Application numberUS-201615146132-A
CountryUS
Kind codeA1
Filing dateMay 4, 2016
Priority dateMay 4, 2016
Publication dateNov 9, 2017
Grant date

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  1. Title

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  2. Abstract

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  5. First independent claim

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Abstract

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Methods for forming ceramic matrix composite (CMC) components are provided. In one exemplary embodiment, a method comprises automatically laying up CMC plies. Laying up plies includes transferring a CMC ply to a layup tool; applying heat to the CMC ply; and stacking the CMC ply with at least one other CMC ply. In various embodiments, CMC plies may be laid up using an automated machine. In some embodiments, a CMC ply may be transferred to a layup tool using an automated machine and the CMC ply may be stacked with at least one other CMC ply using the automated machine.

First claim

Opening claim text (preview).

1 . A method for forming a ceramic matrix composite (CMC) component, the method comprising: forming pieces of a pre-impregnated CMC tape; drying the pieces of the pre-impregnated CMC tape to produce CMC plies; and automatically laying up the CMC plies, wherein laying up the CMC plies includes transferring a CMC ply to a layup tool; applying heat to the CMC ply via the layup tool; and stacking the CMC ply with at least one other CMC ply. 2 . The method of claim 1 , further comprising, after applying heat to the CMC ply but before stacking the CMC ply with at least one other CMC ply, heating the CMC ply for a first period of time. 3 . The method of claim 2 , further comprising, after stacking the CMC ply with at least one other CMC ply, heating the stacked CMC plies for a second period of time. 4 . The method of claim 3 , wherein the CMC plies are laid up on a heated layup tool, wherein heating the CMC ply for the first period of time comprises covering the CMC ply for the first period of time, and wherein heating the stacked CMC plies for the second period of time comprises covering the stacked CMC plies for the second period of time. 5 . The method of claim 3 , further comprising, after heating the stacked CMC plies for the second period of time, removing the heat from the stacked CMC plies. 6 . The method of claim 1 , wherein transferring the CMC ply to the layup tool comprises transferring a plurality of CMC plies to the layup tool, wherein applying heat to the CMC ply comprises applying heat to the plurality of CMC plies, and wherein stacking the CMC ply comprises stacking the plurality of CMC plies. 7 . The method of claim 1 , further comprising, while applying heat to the CMC ply, molding the CMC ply to a desired contour. 8 . The method of claim 7 , wherein an automated machine molds the CMC ply to the desired contour. 9 . The method of claim 1 , wherein an automated machine transfers the CMC ply to the layup tool. 10 . The method of claim 1 , wherein an automated machine stacks the CMC ply with the at least one other CMC ply. 11 . The method of claim 1 , further comprising, after stacking the CMC ply with at least one other CMC ply, repeating transferring a CMC ply to the layup tool, applying heat to the CMC ply, and stacking the CMC ply with at least one other CMC ply. 12 . The method of claim 11 , wherein, as transferring, applying, and stacking are repeated, stacking the CMC ply with at least one other CMC ply includes stacking the CMC ply with previously stacked CMC plies. 13 . The method of claim 11 , wherein transferring a CMC ply to the layup tool, applying heat to the CMC ply, and stacking the CMC ply with at least one other CMC ply are repeated until a component preform is formed. 14 . The method of claim 13 , further comprising processing the component preform in an autoclave at an elevated temperature and an elevated pressure. 15 . The method of claim 14 , further comprising densifying the component preform. 16 . (canceled) 17 . A method for forming a ceramic matrix composite (CMC) component, the method comprising: laying up CMC plies using an automated machine, wherein laying up the CMC plies includes transferring a CMC ply to a layup tool; applying heat to the CMC ply via the layup tool; heating the CMC ply for a first period of time; stacking the CMC ply with at least one other CMC ply; and heating the stacked CMC plies for a second period of time, wherein the CMC plies are formed from pre-impregnated CMC tape. 18 . The method of claim 17 , wherein the CMC plies are formed from dried pre-impregnated CMC tape. 19 . The method of claim 17 , wherein transferring a CMC ply to the layup tool, applying heat to the CMC ply, heating the CMC ply for the first period of time, stacking the CMC ply with at least one other CMC ply, and heating the stacked CMC plies for the second period of time are repeated until a component preform is formed. 20 . A method for forming a ceramic matrix composite (CMC) component, the method comprising: forming CMC plies from pre-impregnated CMC tape and laying up CMC plies, wherein laying up CMC plies includes transferring a CMC ply to a layup tool using an automated machine; applying heat to the CMC ply via the layup tool; heating the CMC ply for a first period of time; stacking the CMC ply with at least one other CMC ply using the automated machine; and heating the stacked CMC plies for a second period of time. 21 . The method of claim 4 , wherein covering the CMC ply for the first period of time, and covering the stacked CMC plies for the second period of time is by a shrink wrap.

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What does patent US2017320785A1 cover?
Methods for forming ceramic matrix composite (CMC) components are provided. In one exemplary embodiment, a method comprises automatically laying up CMC plies. Laying up plies includes transferring a CMC ply to a layup tool; applying heat to the CMC ply; and stacking the CMC ply with at least one other CMC ply. In various embodiments, CMC plies may be laid up using an automated machine. In some …
Who is the assignee on this patent?
Gen Electric
What technology area does this patent fall under?
Primary CPC classification F01D5/02. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Thu Nov 09 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).