Lamination molding apparatus

US2017297105A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2017297105-A1
Application numberUS-201715415870-A
CountryUS
Kind codeA1
Filing dateJan 26, 2017
Priority dateApr 18, 2016
Publication dateOct 19, 2017
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A lamination molding apparatus is provided capable of preventing damage to a cutting device. Every time a sintered body including a sintered layer group consisting of a predetermined number of sintered layers is formed, gas is injected from a gas injector toward a vicinity of a side surface of the newly formed sintered body so as to blow off material powder, and then the side surface of the sintered body is shaved by a cutting tool of the cutting device, wherein the gas injector blows off the material powder by only intermittent injection which repeats short-time gas injection or by a combination of the intermittent injection and continuous injection which continuously injects the gas.

First claim

Opening claim text (preview).

What is claimed is: 1 . A lamination molding apparatus comprising a table, on which a powder layer comprising metal material powder is formed; a laser irradiation device, irradiating a predetermined region of the powder layer formed on the table with a laser beam so as to sinter the predetermined region of the powder layer to form a sintered layer; a cutting device, having a cutting tool that cuts the sintered layer formed by the laser irradiation device; and a gas injector, blowing off the material powder by gas injection, wherein every time a sintered body comprising a sintered layer group consisting of a predetermined number of sintered layers is formed, gas is injected from the gas injector toward a vicinity of a side surface of the newly formed sintered body so as to blow off the material powder, and then the side surface of the sintered body is shaved by the cutting tool, wherein the gas injector blows off the material powder by only intermittent injection which repeats short-time gas injection or by a combination of the intermittent injection and continuous injection which continuously injects the gas. 2 . The lamination molding apparatus according to claim 1 , wherein the gas injector blows off by gas injection the material powder at least to a depth allowing the cutting tool to enter. 3 . The lamination molding apparatus according to claim 1 , wherein a strength of the gas injection performed by the gas injector is in a range of not blowing up the material powder. 4 . The lamination molding apparatus according to claim 1 , wherein a gas injection port of the gas injector has a circular shape, and the gas injected from the gas injection port is blown vertically.

Assignees

Inventors

Classifications

  • B22F3/24Primary

    After-treatment of workpieces or articles {(B22F3/1146 takes precedence)} · CPC title

  • Removing material: carving, cleaning, grinding, hobbing, honing, lapping, polishing, milling, shaving, skiving, turning the surface · CPC title

  • B33Y30/00Primary

    Apparatus for additive manufacturing; Details thereof or accessories therefor · CPC title

  • Blades · CPC title

  • Scanners · CPC title

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What does patent US2017297105A1 cover?
A lamination molding apparatus is provided capable of preventing damage to a cutting device. Every time a sintered body including a sintered layer group consisting of a predetermined number of sintered layers is formed, gas is injected from a gas injector toward a vicinity of a side surface of the newly formed sintered body so as to blow off material powder, and then the side surface of the sin…
Who is the assignee on this patent?
Sodick Co Ltd
What technology area does this patent fall under?
Primary CPC classification B22F3/24. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Thu Oct 19 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).