Method for fabricating an interface layer to separate binder jetted objects from support structures

US2017297100A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2017297100-A1
Application numberUS-201715469425-A
CountryUS
Kind codeA1
Filing dateMar 24, 2017
Priority dateApr 14, 2016
Publication dateOct 19, 2017
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Binder jetting techniques can be used to deposit and bind metallic particles or the like in a net shape for debinding and sintering into a final part. Where support structures are required to mitigate deformation of the object during the debinding and/or sintering, an interface layer may be formed between the support structures and portions of the object in order to avoid bonding of the support structure to the object during sintering.

First claim

Opening claim text (preview).

1 . A method comprising: depositing a number of layers of a powdered material in a bed, the powdered material including a sinterable powder of a material selected for sintering into a final part; applying a first binder in a first pattern to the number of layers as they are deposited to form a support structure from the powdered material within the bed; applying a second binder in a second pattern to the number of layers as they are deposited to form an object from the powdered material within the bed; and applying an interface material at an interface between the support structure and the object, wherein the interface material resists bonding of the support structure to the object during sintering. 2 . The method of claim 1 wherein the powdered material includes a metallic powder. 3 . The method of claim 1 wherein the first binder and the second binder are a substantially similar or identical binder system deposited from a single print head. 4 . The method of claim 1 wherein applying the interface material includes jetting the interface material through a jetting print head. 5 . The method of claim 1 wherein the interface material includes a colloidal suspension of ceramic particles sized to infiltrate the sinterable powder in a surface of the support structure adjacent to the object. 6 . The method of claim 5 wherein the ceramic particles have a mean particle size of less than one micron. 7 . The method of claim 5 wherein the sinterable powder has a mean particle size of about fifteen to thirty-five microns. 8 . The method of claim 5 wherein the ceramic particles have a mean particle size at least one order of magnitude smaller than a similarly measured mean particle size of the sinterable powder. 9 . The method of claim 1 wherein the interface material includes a layer of ceramic particles deposited at a surface of the support structure adjacent to the object. 10 . The method of claim 9 wherein the layer of ceramic particles is solidified to prevent displacement by subsequent layers of the sinterable powder, thereby forming a sinter-resistant ceramic layer between the support structure and the object. 11 . The method of claim 9 wherein the layer of ceramic particles is deposited in a carrier that gels upon contact with the sinterable powder. 12 . The method of claim 9 wherein the layer of ceramic particles is deposited in a curable carrier, the method further comprising curing the curable carrier substantially concurrently with deposition on the sinterable powder. 13 . The method of claim 1 wherein the interface material includes a material that remains as an interface layer physically separating the support structure from the object after debind and into a thermal sintering cycle. 14 . The method of claim 13 wherein the interface material is deposited in an intermittent pattern between the support structure and the object to create a corresponding pattern of gaps between the support structure and the object, thereby weakening a mechanical structure between the support structure and the object to facilitate removal. 15 . The method of claim 1 wherein the first binder is debindable with a chemical solvent, and wherein the interface material is at least partially non-soluble in the chemical solvent. 16 . The method of claim 1 wherein the interface material includes a soluble metal salt that transforms to a ceramic upon dehydration and heating. 17 . The method of claim 16 wherein the interface material includes at least one of a hydroxide, a chloride, a sulfate, a nitrate, an acetate, and a stearate. 18 . The method of claim 16 wherein the interface material further includes aluminum. 19 . The method of claim 16 wherein the interface material includes at least one of zirconium, yttrium, silicon, titanium, iron, magnesium, and calcium. 20 . The method of claim 1 further comprising applying successive layers of the powdered material in opposing directions with a bi-directional spreader. 21 . The method of claim 1 further comprising sintering the support structure and the object in a thermal sintering cycle. 22 . The method of claim 1 wherein the second binder includes a secondary infiltrant selected to modify properties of a final part formed by sintering the object. 23 . The method of claim 22 wherein the secondary infiltrant includes at least one of a carbon, a boron, and a metal salt.

Assignees

Inventors

Classifications

  • Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM] · CPC title

  • of the atmosphere, e.g. composition or pressure in a building chamber · CPC title

  • Metallic powder containing lubricating or binding agents; Metallic powder containing organic material · CPC title

  • by chemical means · CPC title

  • Structures for supporting workpieces or articles during manufacture and removed afterwards · CPC title

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Frequently asked questions

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What does patent US2017297100A1 cover?
Binder jetting techniques can be used to deposit and bind metallic particles or the like in a net shape for debinding and sintering into a final part. Where support structures are required to mitigate deformation of the object during the debinding and/or sintering, an interface layer may be formed between the support structures and portions of the object in order to avoid bonding of the support…
Who is the assignee on this patent?
Desktop Metal Inc
What technology area does this patent fall under?
Primary CPC classification B22F3/1021. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Thu Oct 19 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).