Semiconductor Metrology With Information From Multiple Processing Steps

Patent metadata

Field	Value
Publication number	US-2017287751-A1
Application number	US-201715476683-A
Country	US
Kind code	A1
Filing date	Mar 31, 2017
Priority date	Apr 4, 2016
Publication date	Oct 5, 2017
Grant date	—

Abstract

Methods and systems for measuring process induced errors in a multiple patterning semiconductor fabrication process based on measurements of a specimen and process information from one or more previous process steps employed to fabricate the specimen are presented herein. A metrology tool is employed after a number of process steps have been executed. The metrology tool measures structural parameters of interest of metrology targets on the wafer based on measured signals and process information, and communicates correctable process parameter values to one or more process tools involved in the previous process steps. When executed by the appropriate process tool, the correctable process parameter values reduce process induced errors in the geometry of the structures fabricated by the process flow. In another aspect, multiple metrology tools are used to control a fabrication process in combination with process information from one or more process steps in the process flow.

First claim

What is claimed is:

1 . A metrology system comprising:
an illumination subsystem that provides an amount of illumination light to one or more metrology targets disposed on a wafer previously processed by a plurality of process steps of a fabrication process flow; a detector subsystem that detects an amount of light from the one or more metrology targets in response to the amount of illumination light and generates an amount of measurement signals in response to the amount of detected light; and a computing system configured to: receive a first amount of process information from a first process tool employed to execute a first process step of the plurality of process steps on the wafer; receive a second amount of process information from the first process tool or another process tool employed to execute a second process step of the plurality of process steps on the wafer; and estimate a value of a structural parameter of interest of the one or more metrology targets based on the amount of measurement signals and the first and second amounts of process information.

2 . The metrology system of claim 1 , wherein the computing system is further configured to:
estimate a value of a correctable parameter associated with at least one of the process steps based on the measured characteristic of the metrology target and the first and second amounts of process information; and communicate the value of the correctable parameter to at least one process tool employed to execute the at least one process step.

3 . The metrology system of claim 1 , wherein the first amount of process information includes any of a process control parameter, a process tool set-up parameter, a process environment parameter, an amount of process data collected from sensors on board the first process tool, and an amount of metrology data collected from sensors on board the first process tool.

4 . The metrology system of claim 1 , wherein the first amount of process information includes a lithography focus parameter value, a lithography dosage parameter value, or a combination thereof.

5 . The metrology system of claim 1 , wherein the estimating the value of the parameter of interest of the one or more metrology targets involves a physical model or a trained input-output measurement model.

6 . The metrology system of claim 5 , wherein the computing system is further configured to:
train the input-output measurement model with simulated measurement data and simulated process information, actual measurement data and process information associated with a Design of Experiments (DOE) wafer, or a combination thereof.

7 . The metrology system of claim 1 , wherein the computing system is further configured to:
reduce a dimension of the first and second amounts of process information, the amount of measurement signals, or a combination thereof.

8 . The metrology system of claim 1 , wherein the detector is configured to collect light from the target structure at multiple wavelengths, multiple collection angles, or a combination of multiple wavelengths and multiple collection angles.

9 . A metrology system comprising:
an illumination subsystem that provides an amount of illumination light to one or more metrology targets disposed on a wafer previously processed by a plurality of process steps of a fabrication process flow; a detector subsystem that detects an amount of light from the one or more metrology targets in response to the amount of illumination light and generates an amount of measurement signals in response to the amount of detected light; and a non-transitory, computer-readable medium, comprising: code for causing a computer system to receive a first amount of process information from a first process tool employed to execute a first process step of the plurality of process steps on the wafer; code for causing the computer system to receive a second amount of process information from the first process tool or another process tool employed to execute a second process step of the plurality of process steps on the wafer; and code for causing the computer system to estimate a value of a structural parameter of interest of the one or more metrology targets based on the amount of measurement signals and the first and second amounts of process information.

10 . The metrology system of claim 9 , the non-transitory, computer-readable medium, further comprising:
code for causing the computer system to estimate a value of a correctable parameter associated with at least one of the process steps based on the measured characteristic of the metrology target and the first and second amounts of process information; and code for causing the computer system to communicate the value of the correctable parameter to at least one process tool employed to execute the at least one process step.

11 . A method comprising:
receiving a wafer including one or more metrology targets fabricated by a plurality of process steps of a fabrication process flow executed by a plurality of process tools; receiving a first amount of process information from a first process tool employed to execute a first process step of the plurality of process steps on the wafer; receiving a second amount of process information from the first process tool or another process tool employed to execute a second process step of the plurality of process steps on the wafer; providing an amount of illumination light to the one or more metrology targets; detecting an amount of light from the one or more metrology targets in response to the illumination; generating an amount of measurement signals in response to the amount of detected light; estimating a value of a parameter of interest of the one or more metrology targets based on the amount of measurement signals and the first and second amounts of process information.

12 . The method of claim 11 , further comprising:
estimating a value of a correctable parameter associated with at least one of the process steps based on the measured characteristic of the metrology target and the first and second amounts of process information; and communicating the value of the correctable parameter to at least one process tool employed to execute the at least one process step.

13 . The method of claim 11 , wherein the plurality of process tools involved in the fabrication process flow includes at least one lithography tool and at least one etch tool.

14 . The method of claim 11 , wherein any of the first and second amounts of process information includes a process parameter value.

15 . The method of claim 14 , wherein the process parameter value is any of a lithography focus parameter value, a lithography dosage parameter value, or a combination thereof.

16 . The method of claim 11 , wherein any of the first and second amounts of process information includes a characteristic of the metrology target measured by a metrology system on-board the first process tool.

17 . The method of claim 11 , wherein the estimating the value of the parameter of interest of the one or more metrology targets involves a physical model or a trained input-output measurement model.

18 . The method of claim 17 , further comprising:
training the input-output measurement model with simulated measurement data and simulated process information, actual measurement data and process information associated with a Design of Experiments (DOE) wafer, or a combination thereof.

19 . The method of claim 11 , further comprising:
reducing a dimension of the first and sec

Assignees

• Kla Tencor Corp

Inventors

• Kuznetsov Alexander
• Gellineau Antonio Arion
• Shchegrov Andrei V

Classifications

• H10P72/0604 Primary

  Process monitoring, e.g. flow or thickness monitoring · CPC title

• G06F30/20

  Design optimisation, verification or simulation (optimisation, verification or simulation of circuit designs G06F30/30) · CPC title

• G01B2210/56

  Measuring geometric parameters of semiconductor structures, e.g. profile, critical dimensions or trench depth · CPC title

• G03F7/70625

  Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness · CPC title

• G03F7/705

  Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions · CPC title