Additive for high-purity copper electrolytic refining and method of producing high-purity copper

Patent metadata

Field	Value
Publication number	US-2017283967-A1
Application number	US-201515509496-A
Country	US
Kind code	A1
Filing date	Oct 2, 2015
Priority date	Oct 4, 2014
Publication date	Oct 5, 2017
Grant date	—

Abstract

The additive for high-purity copper electrolytic refining of the present invention is an additive which is added to a copper electrolyte in electrolytic refining for high-purity copper and is formed of a non-ionic surfactant that includes a hydrophobic group containing an aromatic ring and a hydrophilic group containing a polyoxyalkylene group.

First claim

1 . An additive for high-purity copper electrolytic refining which is added to a copper electrolyte in electrolytic refining for high-purity copper and is formed of a non-ionic surfactant that includes a hydrophobic group containing an aromatic ring and a hydrophilic group containing a polyoxyalkylene group.

2 . The additive for high-purity copper electrolytic refining according to claim 1 , wherein
the hydrophilic group contains one of the group consisting of a polyoxyethylene group, a polyoxypropylene group, and a combination of the polyoxyethylene group and the polyoxypropylene group, and the hydrophobic group contains one of the group consisting of a phenyl group and a naphthyl group.

3 . The additive for high-purity copper electrolytic refining according to claim 1 , wherein
an added number of moles of the polyoxyalkylene group of the hydrophilic group is 2 to 20.

4 . The additive for high-purity copper electrolytic refining according to claim 3 , which is formed of one of the group consisting of a polyoxyethylene monophenyl ether having an added number of moles of 2 to 15 and polyoxyethylene naphthyl ether having an added number of moles of 2 to 15.

5 . A method of producing high-purity copper comprising:
performing copper electrolysis using a copper electrolyte to which an additive is added which is formed of a non-ionic surfactant that includes a hydrophobic group containing an aromatic ring and a hydrophilic group containing a polyoxyalkylene group.

6 . The method of producing high-purity copper according to claim 5 , wherein
the copper electrolysis is performed while a concentration of the additive is maintained within a range of 2 to 500 mg/L.

7 . The method of producing high-purity copper according to claim 5 , wherein
the copper electrolyte is one of the group consisting of a copper sulfate solution, a copper nitrate solution, and a copper chloride solution.

8 . The method of producing high-purity copper according to claim 5 , wherein
the copper electrolyte is a copper sulfate solution having a sulfuric acid concentration of 10 to 300 g/L and a copper concentration of 5 to 90 g/L.

9 . The method of producing high-purity copper according to claim 5 , wherein
the copper electrolyte is a copper nitrate solution having a nitric acid concentration of 0.1 to 100 g/L and a copper concentration of 5 to 90 g/L.

10 . The method of producing high-purity copper according to claim 5 , wherein
high-purity copper is produced in which both of the sulfur concentration and the silver concentration are 1 ppm or less.

11 . The additive for high-purity copper electrolytic refining according to claim 2 , wherein
an added number of moles of the polyoxyalkylene group of the hydrophilic group is 2 to 20.

12 . The method of producing high-purity copper according to claim 6 , wherein
the copper electrolyte is one of the group consisting of a copper sulfate solution, a copper nitrate solution, and a copper chloride solution.

13 . The method of producing high-purity copper according to claim 6 , wherein
the copper electrolyte is a copper sulfate solution having a sulfuric acid concentration of 10 to 300 g/L and a copper concentration of 5 to 90 g/L.

14 . The method of producing high-purity copper according to claim 7 , wherein
the copper electrolyte is a copper sulfate solution having a sulfuric acid concentration of 10 to 300 g/L and a copper concentration of 5 to 90 g/L.

15 . The method of producing high-purity copper according to claim 6 , wherein
the copper electrolyte is a copper nitrate solution having a nitric acid concentration of 0.1 to 100 g/L and a copper concentration of 5 to 90 g/L.

16 . The method of producing high-purity copper according to claim 7 , wherein
the copper electrolyte is a copper nitrate solution having a nitric acid concentration of 0.1 to 100 g/L and a copper concentration of 5 to 90 g/L.

17 . The method of producing high-purity copper according to claim 6 , wherein
high-purity copper is produced in which both of the sulfur concentration and the silver concentration are 1 ppm or less.

18 . The method of producing high-purity copper according to claim 7 , wherein
high-purity copper is produced in which both of the sulfur concentration and the silver concentration are 1 ppm or less.

19 . The method of producing high-purity copper according to claim 8 , wherein
high-purity copper is produced in which both of the sulfur concentration and the silver concentration are 1 ppm or less.

20 . The method of producing high-purity copper according to claim 9 , wherein
high-purity copper is produced in which both of the sulfur concentration and the silver concentration are 1 ppm or less.

Assignees

• Mitsubishi Materials Corp

Inventors

• Kubota Kenji
• Tarutani Yoshie
• Nakaya Kiyotaka

Classifications

• C08G2650/38

  containing oxygen in addition to the ether group · CPC title

• C08L71/02

  Polyalkylene oxides · CPC title

• C08G65/329

  with organic compounds · CPC title

• C25C1/12 Primary

  of copper · CPC title

• C08G2650/04

  End-capping · CPC title