Lamination molding apparatus

US2017274590A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2017274590-A1
Application numberUS-201715468029-A
CountryUS
Kind codeA1
Filing dateMar 23, 2017
Priority dateMar 23, 2016
Publication dateSep 28, 2017
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A lamination molding apparatus, including a chamber covering a molding region; a powder layer forming apparatus to form a material powder layer by discharging the material powder onto the molding region and planarizing the material powder on the molding region; a laser beam emitter to emit a laser beam for sintering the material powder to form a sintered body; a cutting machine to cut the sintered body; a horizontal drive device to move both the cutting machine and the powder layer forming apparatus in a horizontal direction parallel to the molding region; a first vertical drive device to reciprocate the cutting machine in a vertical direction orthogonal to the horizontal direction; and a second vertical drive device to reciprocate the powder layer forming apparatus in the vertical direction, is provided.

First claim

Opening claim text (preview).

What is claimed is: 1 . A lamination molding apparatus, comprising: a chamber covering a molding region; a powder layer forming apparatus to form a material powder layer by discharging the material powder onto the molding region and planarizing the material powder on the molding region; a laser beam emitter to emit a laser beam for sintering the material powder to form a sintered body; a cutting machine to cut the sintered body; a horizontal drive device to move both the cutting machine and the powder layer forming apparatus in a horizontal direction parallel to the molding region; a first vertical drive device to reciprocate the cutting machine in a vertical direction orthogonal to the horizontal direction; and a second vertical drive device to reciprocate the powder layer forming apparatus in the vertical direction. 2 . The apparatus of claim 1 , wherein when cutting the sintered body, the cutting machine is moved vertically downward and the powder layer forming apparatus is moved vertically upward to a position not interfering with the cutting. 3 . The apparatus of claim 1 , wherein the powder layer forming apparatus is configured to be capable of switching start and stop of discharge of the material powder. 4 . The apparatus of claim 3 , wherein the powder layer forming apparatus includes a material discharge unit for discharging the material powder into the molding region, a shutter for opening and closing the material discharge unit, and a shutter through-hole accommodating the shutter therein slidably. 5 . The apparatus of claim 1 , wherein the apparatus is configured to execute a molding cycle in which the material powder layer is formed and sintered with the laser beam, the molding cycle being executed for a plurality of local regions which are different each other in the molding region, adjacent two of the local regions in a same layer being partially overlapped each other.

Assignees

Inventors

Classifications

  • Aspects linked to processes or compositions used in powder metallurgy · CPC title

  • Hoppers · CPC title

  • B22F3/24Primary

    After-treatment of workpieces or articles {(B22F3/1146 takes precedence)} · CPC title

  • characterised by the configuration of the radiation means · CPC title

  • Housings, e.g. machine housings · CPC title

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What does patent US2017274590A1 cover?
A lamination molding apparatus, including a chamber covering a molding region; a powder layer forming apparatus to form a material powder layer by discharging the material powder onto the molding region and planarizing the material powder on the molding region; a laser beam emitter to emit a laser beam for sintering the material powder to form a sintered body; a cutting machine to cut the sinte…
Who is the assignee on this patent?
Sodick Co Ltd
What technology area does this patent fall under?
Primary CPC classification B22F3/24. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Thu Sep 28 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).