Bump-forming material, method for producing electronic component, method for producing semiconductor device, and semiconductor device

Patent metadata

Field	Value
Publication number	US-2017260348-A1
Application number	US-201715414942-A
Country	US
Kind code	A1
Filing date	Jan 25, 2017
Priority date	Mar 9, 2016
Publication date	Sep 14, 2017
Grant date	—

Abstract

A material includes a base resin; a solvent; and a foaming agent and a photosensitizer, and/or a substance that serves as a foaming agent and a photosensitizer.

First claim

What is claimed is:

1 . A material comprising:
a base resin; a solvent; and a foaming agent and a photosensitizer, and/or a substance that serves as a foaming agent and a photosensitizer.

2 . The material according to claim 1 , wherein the base resin is a phenolic resin, an epoxy resin, an acrylic resin, a melamine resin, a polyurethane resin, a polyimide resin or a silicone resin or any combination thereof.

3 . The material according to claim 1 , wherein the foaming agent is decomposed or evaporated by performing heating at a temperature of 400° C. or lower or performing irradiation with infrared rays.

4 . The material according to claim 1 , wherein the foaming agent is a thermally decomposable resin that has a molecular weight of 10 to 100,000.

5 . The material according to claim 1 , wherein the foaming agent is either an acrylic-based resin or a polystyrene-based resin.

6 . The material according to claim 1 , wherein an amount of the foaming agent contained is 0.1 parts by mass to 200 parts by mass with respect to 100 parts by mass of the base resin.

7 . The material according to claim 1 , wherein the solvent contains an alcohol solvent, a chain ester solvent, a cyclic ester solvent, a ketone solvent, a chain ether solvent or a cyclic ether solvent or any combination thereof.

8 . The material according to claim 1 , further comprising a crosslinker.

9 . The material according to claim 8 , wherein the crosslinker contains a urea derivative, a melamine derivative or a uril derivative or any combination thereof.

10 . The material according to claim 1 , further comprising a reducing agent that has a carboxyl group.

11 . The material according to claim 10 , wherein the reducing agent contains acrylic acid, methacrylic acid, oxalic acid or formic acid or any combination thereof.

12 . A method for producing an electronic component, the method comprising:
forming a pattern that has an opening on a substrate by using a material; and forming a bump by filling the opening of the pattern with a bump metal, wherein the material contains a base resin and a solvent, and further contains a foaming agent and a photosensitizer, and/or a substance that serves a foaming agent and a photosensitizer.

13 . A semiconductor device comprising:
a first substrate; a second substrate configured to be bonded to the first substrate via a bonded part in which two bumps are bonded to each other; and a porous film configured to be interposed between the first substrate and the second substrate, the porous film containing a decomposition residue derived from a photosensitizer.

14 . The semiconductor device according to claim 13 , wherein the semiconductor device is a sensor.

Assignees

• Fujitsu Ltd

Inventors

• Kon Junichi

Classifications

• H10W99/00

  Subject matter not provided for in other groups of this subclass · CPC title

• H10W90/732

  between stacked chips · CPC title

• H10W90/722

  between stacked chips · CPC title

• H10W72/07352

  changes in structures or sizes · CPC title

• H10W72/07341

  Controlling the bonding environment, e.g. atmosphere composition or temperature · CPC title