Chemical mechanical polishing method
US-2015375361-A1 · Dec 31, 2015 · US
US2017246722A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2017246722-A1 |
| Application number | US-201615054849-A |
| Country | US |
| Kind code | A1 |
| Filing date | Feb 26, 2016 |
| Priority date | Feb 26, 2016 |
| Publication date | Aug 31, 2017 |
| Grant date | — |
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A polishing pad includes a polishing layer stack that has a polishing surface, a bottom surface, and an aperture from the polishing surface to the bottom surface. The polishing layer stack includes a polishing layer that has the polishing surface. A fluid-impermeable layer spans the aperture and the polishing pad. A first adhesive layer of a first adhesive material is in contact with and secures the bottom surface of the polishing layer to the fluid-impermeable layer. The first adhesive layer spans the aperture and the polishing pad. The light-transmitting body is positioned in the aperture and has a lower surface in contact with, is secured to the first adhesive layer, and is spaced apart from a side-wall of the aperture by a gap. An adhesive sealant of a different second material is disposed in and laterally fills the gap.
Opening claim text (preview).
1 . A polishing pad, comprising: a polishing layer stack having a polishing surface, a bottom surface, and an aperture from the polishing surface to the bottom surface, the polishing layer stack including a polishing layer having the polishing surface; a fluid-impermeable layer spanning the aperture and spanning the polishing pad; a first adhesive layer of a first adhesive material in contact with and securing the bottom surface of the polishing layer stack to the fluid-impermeable layer, the first adhesive layer spanning the aperture and the polishing pad; a light-transmitting body positioned in the aperture, the light-transmitting body having a lower surface in contact with and secured to the first adhesive layer and spaced apart from a side-wall of the aperture by a gap; and an adhesive sealant of a different second material disposed in and laterally filling the gap. 2 . The polishing pad of claim 1 , wherein the light-transmitting body is softer than the polishing layer. 3 . The polishing pad of claim 2 , wherein the adhesive sealant has about the same hardness as the light-transmitting body. 4 . The polishing pad of claim 2 , wherein the polishing layer has a hardness of about 58-65 Shore D and the light-transmitting body has a hardness of about 45-60 Shore D. 5 . The polishing pad of claim 1 , wherein a top surface of the light-transmitting body is recessed relative to the polishing surface. 6 . The polishing pad of claim 1 , wherein the gap completely laterally surrounds the light-transmitting body. 7 . The polishing pad of claim 1 , wherein the adhesive sealant extends to contact the first adhesive layer without extending below the light-transmitting body. 8 . The polishing pad of claim 7 , wherein the adhesive sealant completely vertically fills the gap. 9 . The polishing pad of claim 1 , comprising a second adhesive layer positioned on a side of the fluid-impermeable layer opposite the first adhesive layer and in contact with the fluid-impermeable layer. 10 . The polishing pad of claim 9 , comprising an aperture through the second adhesive layer aligned with the light-transmitting body. 11 . The polishing pad of claim 9 , further comprising a removable liner covering the second adhesive layer. 12 . The polishing pad of claim 1 , wherein the first adhesive material comprises a pressure sensitive adhesive and the second adhesive material comprises a cured epoxy or polyurethane. 13 . The polishing pad of claim 1 , wherein the polishing layer stack comprises the polishing layer and a backing layer, and wherein the polishing layer is a napped polyurethane and the backing layer is a different material than the polishing layer. 14 . The polishing pad of claim 13 , wherein each of the backing layer and the fluid-impermeable are a polyester. 15 . The polishing pad of claim 1 , wherein the polishing pad has a total thickness less than about 3 mm. 16 . A method of making a polishing pad, comprising: forming an aperture through a polishing layer stack from a polishing surface to a bottom surface of the polishing layer to expose a first adhesive layer that is positioned on and contacts the bottom surface of the polishing layer stack and spans the aperture and the polishing pad, the polishing layer stack including a polishing layer having the polishing surface, wherein the first adhesive layer secures the bottom surface of the polishing layer stack to a fluid-impermeable layer that layer spans the aperture and the polishing pad; positioning a pre-formed light-transmitting body in the aperture in the polishing layer stack such that a lower surface of the light-transmitting body contacts and adheres to the first adhesive layer; dispensing an adhesive sealant into a gap that separates the light-transmitting body from side-walls of the aperture to laterally fill the gap; and curing the adhesive sealant. 17 . The method of claim 16 , wherein dispensing the adhesive sealant completely vertically fills the gap. 18 . The method of claim 16 , comprising removing a portion of a second adhesive layer that is positioned on a side of the fluid-impermeable layer opposite the first adhesive layer and in contact with the fluid-impermeable layer, wherein the portion is aligned with the light-transmitting body. 19 . The method of claim 16 , wherein forming the aperture comprises peeling a portion of the polishing layer stack away from the first adhesive layer while leaving a majority of the first adhesive layer in the aperture on the fluid-impermeable layer. 20 . The method of claim 16 , wherein forming the aperture comprises peeling a disposable cover away from the first adhesive layer while leaving a majority of the first adhesive layer in the aperture on the fluid-impermeable layer, wherein the disposable cover is a different material than the polishing layer.
provided with a window for inspecting the surface of the work being lapped · CPC title
characterised by the composition or properties of the pad materials · CPC title
characterised by a multi-layered structure · CPC title
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