Window in thin polishing pad

US2017246722A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2017246722-A1
Application numberUS-201615054849-A
CountryUS
Kind codeA1
Filing dateFeb 26, 2016
Priority dateFeb 26, 2016
Publication dateAug 31, 2017
Grant date

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A polishing pad includes a polishing layer stack that has a polishing surface, a bottom surface, and an aperture from the polishing surface to the bottom surface. The polishing layer stack includes a polishing layer that has the polishing surface. A fluid-impermeable layer spans the aperture and the polishing pad. A first adhesive layer of a first adhesive material is in contact with and secures the bottom surface of the polishing layer to the fluid-impermeable layer. The first adhesive layer spans the aperture and the polishing pad. The light-transmitting body is positioned in the aperture and has a lower surface in contact with, is secured to the first adhesive layer, and is spaced apart from a side-wall of the aperture by a gap. An adhesive sealant of a different second material is disposed in and laterally fills the gap.

First claim

Opening claim text (preview).

1 . A polishing pad, comprising: a polishing layer stack having a polishing surface, a bottom surface, and an aperture from the polishing surface to the bottom surface, the polishing layer stack including a polishing layer having the polishing surface; a fluid-impermeable layer spanning the aperture and spanning the polishing pad; a first adhesive layer of a first adhesive material in contact with and securing the bottom surface of the polishing layer stack to the fluid-impermeable layer, the first adhesive layer spanning the aperture and the polishing pad; a light-transmitting body positioned in the aperture, the light-transmitting body having a lower surface in contact with and secured to the first adhesive layer and spaced apart from a side-wall of the aperture by a gap; and an adhesive sealant of a different second material disposed in and laterally filling the gap. 2 . The polishing pad of claim 1 , wherein the light-transmitting body is softer than the polishing layer. 3 . The polishing pad of claim 2 , wherein the adhesive sealant has about the same hardness as the light-transmitting body. 4 . The polishing pad of claim 2 , wherein the polishing layer has a hardness of about 58-65 Shore D and the light-transmitting body has a hardness of about 45-60 Shore D. 5 . The polishing pad of claim 1 , wherein a top surface of the light-transmitting body is recessed relative to the polishing surface. 6 . The polishing pad of claim 1 , wherein the gap completely laterally surrounds the light-transmitting body. 7 . The polishing pad of claim 1 , wherein the adhesive sealant extends to contact the first adhesive layer without extending below the light-transmitting body. 8 . The polishing pad of claim 7 , wherein the adhesive sealant completely vertically fills the gap. 9 . The polishing pad of claim 1 , comprising a second adhesive layer positioned on a side of the fluid-impermeable layer opposite the first adhesive layer and in contact with the fluid-impermeable layer. 10 . The polishing pad of claim 9 , comprising an aperture through the second adhesive layer aligned with the light-transmitting body. 11 . The polishing pad of claim 9 , further comprising a removable liner covering the second adhesive layer. 12 . The polishing pad of claim 1 , wherein the first adhesive material comprises a pressure sensitive adhesive and the second adhesive material comprises a cured epoxy or polyurethane. 13 . The polishing pad of claim 1 , wherein the polishing layer stack comprises the polishing layer and a backing layer, and wherein the polishing layer is a napped polyurethane and the backing layer is a different material than the polishing layer. 14 . The polishing pad of claim 13 , wherein each of the backing layer and the fluid-impermeable are a polyester. 15 . The polishing pad of claim 1 , wherein the polishing pad has a total thickness less than about 3 mm. 16 . A method of making a polishing pad, comprising: forming an aperture through a polishing layer stack from a polishing surface to a bottom surface of the polishing layer to expose a first adhesive layer that is positioned on and contacts the bottom surface of the polishing layer stack and spans the aperture and the polishing pad, the polishing layer stack including a polishing layer having the polishing surface, wherein the first adhesive layer secures the bottom surface of the polishing layer stack to a fluid-impermeable layer that layer spans the aperture and the polishing pad; positioning a pre-formed light-transmitting body in the aperture in the polishing layer stack such that a lower surface of the light-transmitting body contacts and adheres to the first adhesive layer; dispensing an adhesive sealant into a gap that separates the light-transmitting body from side-walls of the aperture to laterally fill the gap; and curing the adhesive sealant. 17 . The method of claim 16 , wherein dispensing the adhesive sealant completely vertically fills the gap. 18 . The method of claim 16 , comprising removing a portion of a second adhesive layer that is positioned on a side of the fluid-impermeable layer opposite the first adhesive layer and in contact with the fluid-impermeable layer, wherein the portion is aligned with the light-transmitting body. 19 . The method of claim 16 , wherein forming the aperture comprises peeling a portion of the polishing layer stack away from the first adhesive layer while leaving a majority of the first adhesive layer in the aperture on the fluid-impermeable layer. 20 . The method of claim 16 , wherein forming the aperture comprises peeling a disposable cover away from the first adhesive layer while leaving a majority of the first adhesive layer in the aperture on the fluid-impermeable layer, wherein the disposable cover is a different material than the polishing layer.

Assignees

Inventors

Classifications

  • B24B37/205Primary

    provided with a window for inspecting the surface of the work being lapped · CPC title

  • characterised by the composition or properties of the pad materials · CPC title

  • characterised by a multi-layered structure · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US2017246722A1 cover?
A polishing pad includes a polishing layer stack that has a polishing surface, a bottom surface, and an aperture from the polishing surface to the bottom surface. The polishing layer stack includes a polishing layer that has the polishing surface. A fluid-impermeable layer spans the aperture and the polishing pad. A first adhesive layer of a first adhesive material is in contact with and secure…
Who is the assignee on this patent?
Applied Materials Inc
What technology area does this patent fall under?
Primary CPC classification B24B37/205. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Thu Aug 31 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).