Circuit card assembly (cca) with reduced susceptibility to deform under loading

Patent metadata

Field	Value
Publication number	US-2017245367-A1
Application number	US-201615049454-A
Country	US
Kind code	A1
Filing date	Feb 22, 2016
Priority date	Feb 22, 2016
Publication date	Aug 24, 2017
Grant date	—

Abstract

A circuit card assembly (CCA) for reduced susceptibility to load deformation when mounted at peripheral mounting portions is provided. The CCA includes a circuit card including a face to which components are operably connectable, a plate defining openings that correspond to the components, the plate being disposable adjacent to the face with the components extending at least partially through the openings and adhesive interposed between the face and the plate.

First claim

What is claimed is:

1 . A circuit card assembly (CCA) for reduced susceptibility to load induced deformation when mounted at peripheral mounting portions, the CCA comprising:
a circuit card including a face to which components are operably connectable; a plate defining openings that correspond to the components, the plate being disposable adjacent to the face with the components extending at least partially through the openings; and adhesive interposed between the face and the plate.

2 . The CCA according to claim 1 , further comprising mounting elements configured for coupling with a periphery of the circuit card.

3 . The CCA according to claim 1 , wherein the components are operably connectable to the face by at least one or more of solder, adhesive, mechanical fastening and mechanical interference.

4 . The CCA according to claim 1 , wherein the components comprise card connectors, chip packages, heat sinks, pin arrays and solder bumps.

5 . The CCA according to claim 1 , wherein the openings comprise recesses and apertures.

6 . The CCA according to claim 1 , wherein the plate defines additional openings.

7 . The CCA according to claim 1 , wherein the plate comprises at least one of high strength metallic or composite material.

8 . The CCA according to claim 1 , wherein the adhesive comprises at least one of epoxy or thermoplastic.

9 . A system including a circuit card assembly (CCA) having reduced susceptibility to load deformation, the system comprising:
a fuselage; a circuit card including a first face to which first components are operably connectable and a second face opposite the first face to which second components are operably connectable; mounting elements coupled to the fuselage and a periphery of the circuit card; first and second plates defining first and second openings that correspond to the first and second components, the first and second plates being disposable adjacent to the first and second faces with the first and second components extending at least partially through the first and second openings; and adhesive interposed between the first face and the first plate and between the second face and the second plate.

10 . The system according to claim 9 , wherein the fuselage comprises a tubular body.

11 . The system according to claim 9 , wherein the mounting elements comprise mounting pins.

12 . The system according to claim 9 , wherein the first and second components are operably connectable to the first and second faces by at least one or more of solder, adhesive, mechanical fastening and mechanical interference.

13 . The system according to claim 9 , wherein the first components comprise card connectors, chip packages and heat sinks and the second components comprise pin arrays and solder bumps.

14 . The system according to claim 9 , wherein the first and second openings comprise recesses and apertures.

15 . The system according to claim 9 , wherein the first and second plates are formed to define additional openings.

16 . The system according to claim 9 , wherein the first and second plates comprise at least one of high strength metallic material and ceramic.

17 . The system according to claim 9 , wherein the adhesive comprises at least one of epoxy and thermoplastic.

18 . A method of reducing a susceptibility of a circuit card assembly (CCA), which includes a circuit card and components operably connectable to a face of the circuit card, to deform under loading perpendicular to a plane of the circuit card with the CCA being mounted at peripheral mounting portions thereof, the method comprising:
defining openings in a plate that correspond to the components; disposing the plate adjacent to the face with the components extending at least partially through the openings; and adhering the plate to the face.

19 . The method according to claim 18 , wherein defining of the openings comprises defining the openings to respectively correspond to sizes, shapes and locations of the openings.

20 . The method according to claim 18 , further comprising defining additional openings in the plate.

Assignees

• Raytheon Co

Inventors

• Gurrola Fazzel
• Homes David W

Classifications

• H05K2201/09027

  Non-rectangular flat PCB, e.g. circular · CPC title

• H05K1/0271

  Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion · CPC title

• H05K3/0061

  onto a metallic substrate, e.g. a heat sink (heat sinks for electric apparatus H05K7/20) · CPC title

• H05K1/0203 Primary

  Cooling of mounted components (H05K1/0272 takes precedence) · CPC title

• H05K3/0058

  Laminating printed circuit boards onto other substrates, e.g. metallic substrates (H05K1/0281 takes precedence) · CPC title