Wireless antenna array system architecture and methods to achieve 3d beam coverage

Patent metadata

Field	Value
Publication number	US-2017237154-A1
Application number	US-201715437330-A
Country	US
Kind code	A1
Filing date	Feb 20, 2017
Priority date	Mar 11, 2008
Publication date	Aug 17, 2017
Grant date	—

Abstract

Embodiments of wireless antenna array systems to achieve three-dimensional beam coverage are described herein. Other embodiments may be described and claimed.

First claim

1 . (canceled)

2 . A multilayer package for high frequency communications, comprising:
a plurality of patch antennas disposed on a first substrate; a plurality of Yagi antennas disposed on a third substrate, wherein the first substrate and the third substrate are disposed on opposing sides of a second substrate; and an integrated circuit coupled to the plurality of Yagi antennas and the plurality of patch antennas.

3 . The multilayer package of claim 2 , further comprising a first interconnect coupling a first patch antenna to the integrated circuit through the second substrate; and
a second interconnect coupling a second patch antenna to the integrated circuit through the second substrate.

4 . The multilayer package of claim 3 , further comprising a third interconnect coupling a metal layer of the second substrate to the integrated circuit, through the second substrate.

5 . The multilayer package of claim 4 , further comprising a fourth interconnect and a fifth interconnect, each coupling one of the plurality of Yagi antennas to the integrated circuit.

6 . The multilayer package of claim 2 , wherein the integrated circuit is disposed on the third substrate.

7 . The multilayer package of claim 5 , further comprising a sixth interconnect coupling a metal layer of the third substrate to the integrated circuit.

8 . The multilayer package of claim 2 , wherein the plurality of patch antennas are configured to operate in a 60 GHz band and radiate in a broadside direction and wherein the plurality of Yagi antennas are configured to operate in the 60 GHz band and radiate in an end-fire direction.

9 . A multilayer package for high frequency communications, comprising:
a plurality of patch antennas disposed on a first substrate; a plurality of Yagi antennas disposed on a third substrate, wherein the first substrate and third substrate are disposed on opposing sides of a second substrate; a first interconnect coupling a first patch antenna to an integrated circuit through the second substrate; a second interconnect coupling a second patch antenna to the integrated circuit through the second substrate; a third interconnect coupling the integrated circuit to a metal layer of the second substrate; a fourth interconnect coupling a first Yagi antenna to the integrated circuit; and a fifth interconnect coupling a second Yagi antenna to the integrated circuit.

10 . The multilayer package of claim 9 , wherein the integrated circuit is disposed on the third substrate.

11 . The multilayer package of claim 9 , further comprising a sixth interconnect coupling the integrated circuit to a metal layer of the third substrate.

12 . The multilayer package of claim 9 , wherein the integrated circuit is configured to:
transmit signals to the first patch antenna through the first interconnect and receive signals from the second patch antenna through the second interconnect; and transmit signals to the first Yagi antenna through the fourth interconnect and receive signals from the second Yagi antenna through the fifth interconnect.

13 . The multilayer package of claim 12 , wherein the integrated circuit is configured to modify a radiation pattern of the plurality of patch antennas in a broadside direction and to modify a radiation pattern of the plurality of Yagi antennas in an end-fire direction.

14 . The multilayer package of claim 13 , wherein the integrated circuit is configured to modify the radiation pattern of the plurality of patch antennas and the radiation pattern of the plurality of Yagi antennas according to a switched-beam configuration.

15 . The multilayer package of claim 12 , wherein the integrated circuit is configured to:
transmit 60 GHz band signals to the first patch antenna and receive 60 GHz band signals from the second patch antenna; and transmit 60 GHz band signals to the first Yagi antenna and receive 60 GHz band signals from the second Yagi antenna.

16 . The multilayer package of claim 9 , wherein the integrated circuit is a complimentary metal-oxide semiconductor (CMOS) radio frequency integrated chip (RFIC).

17 . A wireless communication device for high frequency communications comprising:
a multilayer package, including a plurality of patch antennas disposed on a first substrate and a plurality of Yagi antennas disposed on a third substrate, wherein the first substrate and third substrate are disposed on opposing sides of a second substrate; and an integrated circuit, wherein each of the plurality of Yagi antennas and each of the plurality of patch antennas are coupled to the integrated circuit.

18 . The wireless communication device of claim 17 , further comprising a first interconnect coupling a first patch antenna to the integrated circuit through the second substrate; and
a second interconnect coupling a second patch antenna to the integrated circuit through the second substrate.

19 . The wireless communication device of claim 18 , further comprising a third interconnect coupling the integrated circuit to a metal layer of the second substrate, through the second substrate.

20 . The wireless communication device of claim 19 , further comprising a fourth interconnect and a fifth interconnect, the fourth and fifth interconnects each coupling the integrated circuit to one of the plurality of Yagi antennas.

21 . The wireless communication device of claim 20 , further comprising a sixth interconnect coupling the integrated circuit to a metal layer of the third substrate.

22 . The wireless communication device of claim 17 , wherein the plurality of patch antennas are configured to operate in a 60 GHz band and radiate in a broadside direction and wherein the plurality of Yagi antennas are configured to operate in the 60 GHz band and radiate in an end-fire direction.

23 . The wireless communication device of claim 17 , wherein the integrated circuit is configured to:
process radio frequency (RF) signals received by one or more patch antennas and process RE signals received by one or more Yagi antennas; and process communication signals for transmission through one or more patch antennas and process communication signals for transmission through one or more Yagi antennas.

24 . The wireless communication device of claim 17 , further comprising switching circuitry to:
switch receiving of radio frequency (RF) signals between one or more patch antennas and one or more Yagi antennas; and switch transmitting of RF signals between one or more patch antennas and one or more Yagi antennas.

25 . The wireless communication device of claim 17 , further comprising baseband processing circuitry to provide baseband signals to the integrated circuit.

26 . A method of operating a multilayer package for high frequency communications that is configured to include:
a plurality of patch antennas disposed on a first substrate and a plurality of Yagi antennas disposed on a third substrate, wherein the first substrate and third substrate are disposed on opposing sides of a second substrate; a first interconnect coupling a first patch antenna to an integrated circuit through the second substrate, a second interconnect coupling a second patch antenna to the integrated circuit through the second substrate, a third interconnect coupling the integrated circuit to a metal layer of the second substrate, a fourth interconnect coupling a first Yagi antenna to the integrated

Assignees

• Intel Corp

Inventors

• Choudhury Debabani
• Roberts Richard D
• Karacaoglu Ulun

Classifications

• H01Q1/246 Primary

  specially adapted for base stations · CPC title

• H01Q21/065

  Patch antenna array · CPC title

• H01Q3/34

  by electrical means (active lenses or reflecting arrays H01Q3/46) · CPC title

• H01Q25/04

  Multimode antennas {(corrugated horns H01Q13/0208)} · CPC title

• H01Q3/26 Primary

  varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture ({H01Q3/12,} H01Q3/22, H01Q3/24 take precedence) · CPC title