Double-sided circuit substrate suitable for high-frequency circuits

Patent metadata

Field	Value
Publication number	US-2017231088-A1
Application number	US-201515501949-A
Country	US
Kind code	A1
Filing date	Aug 5, 2015
Priority date	Aug 7, 2014
Publication date	Aug 10, 2017
Grant date	—

Abstract

Provided is a double-sided circuit substrate being a laminate of: a composite material comprising a fluorine resin and a glass cloth; and a copper foil having a two-dimensional roughness Ra in a mat surface (a surface that comes in contact with the resin) of less than 0.2 μm. Ideally, a surface of the fluorine resin has an O content of at least 1.0%, as observed using ESCA.

First claim

1 . A double-sided circuit substrate which is a laminate of a composite material comprising a tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer (PFA) and a glass cloth, and a copper foil having a two-dimensional roughness Ra on the matte side (side in contact with the resin) of less than 0.2 μm,
wherein the matte side of the copper foil is in contact with the tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer (PFA) of the composite material.

2 . A double-sided circuit substrate comprising n sheets of tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer (PFA) films and n−1 sheet(s) of glass cloth(s) alternately laminated between two copper foils (n is an integer of 2 or larger and 10 or smaller),
wherein the copper foils have a two-dimensional roughness Ra on the matte side (side in contact with the resin) of less than 0.2 μm,
wherein the two copper foils are in contact with the tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer (PFA) films.

3 . The double-sided circuit substrate according to claim 1 , wherein the abundance ratio of oxygen atom on the surface of the tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer (PFA) is 1.0% or more when observed using ESCA.

4 . The double-sided circuit substrate according to claim 1 , wherein the tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer (PFA) are surface-modified.

5 . The double-sided circuit substrate according to claim 1 , wherein the copper foil peel strength in a direction of 90 degrees with respect to the double-sided circuit substrate is 0.8 N/mm or larger between the copper foil and the tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer (PFA) layer.

6 . The double-sided circuit substrate according to claim 1 , wherein when the thickness of the substrate except for the copper foils on both sides is defined as X (μm) and the transmission loss of the substrate measured at 20 GHz using a network analyzer is defined as Y (dB/cm), the product of X and Y (X×Y) is 22 or lower.

7 . (canceled)

8 . The double-sided circuit substrate according to claim 2 , wherein the abundance ratio of oxygen atom on the surface of the tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer (PFA) films is 1.0% or more when observed using ESCA.

9 . The double-sided circuit substrate according to claim 2 , wherein the tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer (PFA) films are surface-modified.

10 . The double-sided circuit substrate according to claim 2 , wherein the copper foil peel strength in a direction of 90 degrees with respect to the double-sided circuit substrate is 0.8 N/mm or larger between the copper foil and the tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer (PFA) layer.

11 . The double-sided circuit substrate according to claim 2 , wherein when the thickness of the substrate except for the copper foils on both sides is defined as X (μm) and the transmission loss of the substrate measured at 20 GHz using a network analyzer is defined as Y (dB/cm), the product of X and Y (X×Y) is 22 or lower.

12 . The double-sided circuit substrate according to claim 1 , wherein the tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer (PFA) has a melt flow rate (MFR) of 1.0 g/10 min or higher.

13 . The double-sided circuit substrate according to claim 2 , wherein the tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer (PFA) has a melt flow rate (MFR) of 1.0 g/10 min or higher.

Assignees

• Nippon Kayaku Kk
• Daikin Ind Ltd

Inventors

• Akatuka Yasumasa
• Moteki Shigeru
• Komori Hirokazu
• Inaba Takeshi

Classifications

• H05K1/09

  Use of materials for the {conductive, e.g. } metallic pattern · CPC title

• H05K1/036 Primary

  Multilayers with layers of different types · CPC title

• H05K3/06

  the conductive material being removed chemically or electrolytically, e.g. by photo-etch process {(semi-additive methods H05K3/108)} · CPC title

• H05K3/4644

  by building the multilayer layer by layer, i.e. build-up multilayer circuits (making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602) · CPC title

• H05K2201/015

  Fluoropolymer, e.g. polytetrafluoroethylene [PTFE] · CPC title