Method for manufacturing current collector layer

US2017214056A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2017214056-A1
Application numberUS-201715407212-A
CountryUS
Kind codeA1
Filing dateJan 16, 2017
Priority dateJan 27, 2016
Publication dateJul 27, 2017
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method for manufacturing a current collector layer is provided. The method comprises: forking a release layer on a surface of a film; forming an adhesive layer on the release layer; forming a metal layer on the adhesive layer; and removing the film and the release layer.

First claim

Opening claim text (preview).

What is claimed is: 1 . A method for manufacturing a current collector layer, comprising: forming a release layer on a surface of a film; forming an adhesive layer on the release layer; forming a metal layer on the adhesive layer; and removing the film and the release layer. 2 . The method for manufacturing the current collector layer according to claim 1 , wherein the step of forming the release layer on the surface of the film includes: coating a release agent on the surface of the film; and performing a drying treatment to the release agent. 3 . The method for manufacturing the current collector layer according to claim 2 , wherein the release agent includes one or a combination selected from the group consisting a fluorine-containing organic compound, a chlorine-containing polymer and a silicon-containing organic compound. 4 . The method for manufacturing the current collector layer according to claim 3 , wherein the fluorine-containing organic compound include one or a combination selected from the group consisting polytetrafluoroethene (PTEF), polyvinylidene difluoride (PVDF) and fluorinated ethylene propylene copolymer (FEP). 5 . The method for manufacturing the current collector layer according to claim 3 , wherein the chlorine-containing polymer includes polyvinyl chloride (PVC), and the silicon-containing organic compound includes polyester and/or silicone resin. 6 . The method for manufacturing the current collector layer according to claim 1 , wherein a surface treatment is performed onto the release layer before the adhesive layer is formed on the release layer. 7 . The method for manufacturing the current collector layer according to claim 6 , wherein the surface treatment includes one or a combination selected from the group consisting a plasma treatment, an ion source treatment and a spark treatment. 8 . The method for manufacturing the current collector layer according to claim 1 , wherein the material of the adhesive layer includes silicon oxide and/or titanium oxide. 9 . The method for manufacturing the current collector layer according to claim 1 , wherein a method for forming the metal layer includes a wet deposition method, and the wet deposition method includes electroplating and/or chemical plating. 10 . The method for manufacturing the current collector layer according to claim 1 , wherein the material of the film includes one or a combination selected from the group consisting polyethylene terephthalate (PET), polycarbonate (PC) and polymethyl methacrylate (PMMA).

Assignees

Inventors

Classifications

  • H01M4/661Primary

    Metal or alloys, e.g. alloy coatings (H01M4/669 take precedence) · CPC title

  • Multilayered product (layered product B32B) · CPC title

  • Gastight metal hydride accumulators · CPC title

  • Rocking-chair batteries, i.e. batteries with lithium insertion or intercalation in both electrodes; Lithium-ion batteries · CPC title

  • Use of metal, e.g. activation, sensitisation with noble metals · CPC title

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Frequently asked questions

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What does patent US2017214056A1 cover?
A method for manufacturing a current collector layer is provided. The method comprises: forking a release layer on a surface of a film; forming an adhesive layer on the release layer; forming a metal layer on the adhesive layer; and removing the film and the release layer.
Who is the assignee on this patent?
Asustek Comp Inc
What technology area does this patent fall under?
Primary CPC classification H01M4/661. Mapped technology areas include Electricity.
When was this patent published?
Publication date Thu Jul 27 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).