Integrated device package comprising a real time tunable inductor implemented in a package substrate

Patent metadata

Field	Value
Publication number	US-2017207293-A1
Application number	US-201615002138-A
Country	US
Kind code	A1
Filing date	Jan 20, 2016
Priority date	Jan 20, 2016
Publication date	Jul 20, 2017
Grant date	—

Abstract

Some features pertain to a device package that includes a die and a package substrate. The die includes a first switch. The package substrate is coupled to the die. The package substrate includes at least one dielectric layer, a primary inductor, and a first secondary inductor coupled to the first switch of the die. The first secondary inductor and the first switch are coupled to a plurality of interconnects configured to provide an electrical path for a reference ground signal. The primary inductor is configurable to have different inductances by opening and closing the first switch coupled to the first secondary inductor. In some implementations, the primary inductor is configurable in real time while the die is operational. In some implementations, the die further includes a second switch, and the package substrate further includes a second secondary inductor coupled to the second switch of the die.

First claim

What is claimed is:

1 . A device package comprising:
a die comprising a first switch; and a package substrate coupled to the die, the package substrate comprising:
at least one dielectric layer;
a primary inductor; and
a first secondary inductor coupled to the first switch of the die, wherein the primary inductor is configurable to have different inductances by opening and closing the first switch coupled to the first secondary inductor.

2 . The device package of claim 1 , wherein the package substrate comprises a plurality of interconnects configured to provide an electrical path for a reference ground signal, and wherein the first secondary inductor and the first switch are coupled to the plurality of interconnects.

3 . The device package of claim 2 , wherein the first secondary inductor include a first terminal and the second terminal, wherein the first terminal and the second terminal of the first secondary inductor are coupled to the plurality of interconnects configured to provide an electrical path for a reference ground signal.

4 . The device package of claim 1 , wherein the primary inductor is configurable in real time while the die is operational.

5 . The device package of claim 1 , wherein the die further comprises a second switch, and the package substrate further comprises a second secondary inductor coupled to the second switch of the die, wherein the second secondary inductor and the second switch are coupled to a plurality of interconnects configured to provide an electrical path for a reference ground signal.

6 . The device package of claim 5 , wherein the first secondary inductor is located near a first portion of the primary inductor, and the second secondary inductor is located near a second portion of the primary inductor.

7 . The device package of claim 5 , wherein the primary inductor is configurable to have different inductances by opening or closing the first switch and by opening or closing the second switch.

8 . The device package of claim 1 , wherein the primary inductor is substantially co-planar with the first secondary inductor in the package substrate.

9 . The device package of claim 1 , wherein the device package is incorporated into a device selected from the group consisting of a music player, a video player, an entertainment unit, a navigation device, a communications device, a mobile device, a mobile phone, a smartphone, a personal digital assistant, a fixed location terminal, a tablet computer, a computer, a wearable device, an Internet of things (IoT) device, a laptop computer, a server, and a device in a automotive vehicle.

10 . An apparatus comprising:
a die comprising a means for switching; and a package substrate coupled to the die, the package substrate comprising:
at least one dielectric layer;
means for primary inductance; and
means for secondary inductance coupled to the means for switching of the die,
wherein the means for primary inductance is configurable to have different inductances by opening and closing the means for switching coupled to the means for secondary inductance.

11 . The apparatus of claim 10 , wherein the package substrate includes a plurality of interconnects configured to provide an electrical path for a reference ground signal, and wherein the means for secondary inductance and the means for switching are coupled to the plurality of interconnects.

12 . The apparatus of claim 11 , wherein the means for secondary inductance include a first terminal and the second terminal, wherein the first terminal and the second terminal of the means for secondary inductance are coupled to the plurality of interconnects configured to provide an electrical path for a reference ground signal.

13 . The apparatus of claim 10 , wherein the means for primary inductance is configurable in real time while the die is operational.

14 . The apparatus of claim 10 , wherein the means for secondary inductance is located near a first portion of the means for primary inductance.

15 . The apparatus of claim 10 , wherein the means for primary inductance is substantially co-planar with the means for secondary inductance in the package substrate.

16 . The apparatus of claim 10 , wherein the means for secondary inductance includes a plurality of secondary inductors.

17 . The apparatus of claim 10 , wherein the apparatus is incorporated into a device selected from the group consisting of a music player, a video player, an entertainment unit, a navigation device, a communications device, a mobile device, a mobile phone, a smartphone, a personal digital assistant, a fixed location terminal, a tablet computer, a computer, a wearable device, an Internet of things (IoT) device, a laptop computer, a server, and a device in a automotive vehicle.

18 . A method for tuning an inductor, comprising:
transmitting a signal through a primary inductor comprising a first inductance, wherein the primary inductor is implemented in a package substrate; determining to change the first inductance of the primary inductor; and closing a first switch coupled to a first secondary inductor to change the first inductance of the primary inductor to a second inductance, wherein the first switch is implemented in a die, and wherein the first secondary inductor is implemented in the package substrate.

19 . The method of claim 18 , further comprising closing a second switch coupled to a second secondary inductor to change the first inductance of the primary inductor to a third inductance, wherein the second switch is implemented in the die, and wherein the second secondary inductor is implemented in the package substrate.

20 . The method of claim 19 , further comprising:
determining to further change the third inductance of the primary inductor; and opening the first switch coupled to the first secondary inductor to change the third inductance of the primary inductor to a fourth inductance.

21 . The method of claim 18 , wherein transmitting the signal, determining to change the first inductance of the primary inductor, and closing the first switch coupled to the first secondary inductor, are performed while a device package comprising the die, is operational.

22 . The method of claim 18 , wherein the first secondary inductor and the first switch are coupled to a plurality of interconnects configured to provide an electrical path for a reference ground signal.

23 . The method of claim 22 , wherein the first secondary inductor includes a first terminal and the second terminal, and wherein the first terminal and the second terminal of the first secondary inductor are coupled to the plurality of interconnects configured to provide an electrical path for a reference ground signal.

24 . A processor-readable storage medium comprising code for:
transmitting a signal through a primary inductor comprising a first inductance, wherein the primary inductor is implemented in a package substrate; determining to change the first inductance of the primary inductor, and closing a first switch coupled to a first secondary inductor to change the first inductance of the primary inductor to a second inductance, wherein the first switch is implemented in a die, and wherein the first secondary inductor is implemented in the package substrate.

25 . The processor-readable storage medium of claim 24 , further comprising code for closing a second switch coupled to a second seconda

Assignees

• Qualcomm Inc

Inventors

• Song Young Kyu
• Choi Sangjo
• Lee Jong-Hoon
• Thadesar Paragkumar Ajaybhai

Classifications

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W70/685

  comprising multiple insulating layers · CPC title