Semiconductor light-emitting device
US-2016079485-A1 · Mar 17, 2016 · US
US2017200765A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2017200765-A1 |
| Application number | US-201615208752-A |
| Country | US |
| Kind code | A1 |
| Filing date | Jul 13, 2016 |
| Priority date | Jan 11, 2016 |
| Publication date | Jul 13, 2017 |
| Grant date | — |
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A display device include a substrate including a wiring electrode; an adhesive layer disposed on the substrate; a plurality of semiconductor light emitting devices adhered to the adhesive layer, and electrically connected to the wiring electrode; and a phosphor layer disposed to cover the plurality of semiconductor light emitting devices. Further, the phosphor layer includes a plurality of phosphor portions for converting a wavelength of light, and a plurality of partition wall portions formed between the plurality of phosphor portions, and the plurality of partition wall portions are sequentially disposed between the phosphor portions along a first direction and a second direction crossing each other, respectively, and at least one of the sequentially disposed partition wall portions overlaps with at least one of the plurality of semiconductor light emitting devices.
Opening claim text (preview).
What is claimed is: 1 . A display device, comprising: a substrate including a wiring electrode; an adhesive layer disposed on the substrate; a plurality of semiconductor light emitting devices adhered to the adhesive layer, and electrically connected to the wiring electrode; and a phosphor layer disposed to cover the plurality of semiconductor light emitting devices, wherein the phosphor layer includes a plurality of phosphor portions for converting a wavelength of light, and a plurality of partition wall portions formed between the plurality of phosphor portions, and wherein the plurality of partition wall portions are sequentially disposed between the phosphor portions along a first direction and a second direction crossing each other, respectively, and at least one of the sequentially disposed partition wall portions overlaps with at least one of the plurality of semiconductor light emitting devices. 2 . The display device of claim 1 , wherein the plurality of partition wall portions include a light transmitting material in a space surrounded by metal thin films. 3 . The display device of claim 2 , wherein the plurality of partition wall portions have at least an inclined plane, respectively, and the metal thin films are provided on planes, respectively, sequentially disposed along at least one of the first and the second direction. 4 . The display device of claim 2 , wherein the metal thin films cover a lateral surface of the phosphor portions to reflect light from the metal thin film. 5 . The display device of claim 2 , wherein the phosphor portions comprises at least one of red phosphor portions, green phosphor portions and yellow phosphor portions. 6 . The display device of claim 5 , wherein the light transmitting material is disposed between the green phosphors along either one of the first and the second direction, and disposed between the red phosphor portions along the other one thereof. 7 . The display device of claim 5 , wherein the light transmitting material is disposed between the green phosphor portions and the yellow phosphor portions along either one of the first and the second direction, and disposed between the red phosphor portions along the other one thereof. 8 . The display device of claim 7 , further comprising: a pixel emitting blue light and green light and a pixel emitting red light and green light sequentially disposed. 9 . The display device of claim 1 , wherein the plurality of partition wall portions comprise: a first partition wall portion disposed to cover between the plurality of semiconductor light emitting devices, and a second partition wall portion disposed to cover at least one of the semiconductor light emitting devices. 10 . The display device of claim 9 , wherein at least one of the plurality of semiconductor light emitting devices covered by the second partition wall portion comprises a blue semiconductor light emitting device. 11 . The display device of claim 9 , wherein at least part of the plurality of phosphor portions is disposed by interposing the first partition wall portion therebetween, and wherein the first partition wall portion and the second partition wall portion have different sizes of width formed along the first and the second direction. 12 . The display device of claim 1 , wherein at least one of the plurality of partition wall portions comprises: a first portion extended along the first direction; and a second portion protruded from the first portion in the second direction. 13 . The display device of claim 12 , wherein at least one of the first and the second direction is formed to be connected to an adjoining partition wall portion. 14 . The display device of claim 12 , further comprising: a protrusion portion protruded from a position at which the first portion and the second portion intersect each other. 15 . The display device of claim 12 , wherein at least one of the plurality of partition wall portions is separated from an adjoining partition wall portion along the first direction or the second direction. 16 . The display device of claim 1 , further comprising: an anti-reflection coating layer on a bottom surface of the plurality of partition wall portions. 17 . The display device of claim 16 , wherein the anti-reflection coating layer comprises a non-conductive material. 18 . A fabrication method of a display device, the method comprising: coupling a plurality of semiconductor light emitting devices to an adhesive layer formed on a substrate; and forming a phosphor layer disposed to cover the plurality of semiconductor light emitting devices, wherein the phosphor layer comprises a plurality of phosphor portions for converting a wavelength of light and a plurality of partition wall portions formed between the plurality of phosphor portions, and the plurality of partition wall portions are sequentially disposed between the phosphor portions along a first direction and a second direction that cross each other, respectively, and at least one of the sequentially disposed partition wall portions overlaps with at least one of the plurality of semiconductor light emitting devices. 19 . The method of claim 18 , wherein said forming the phosphor layer comprises: coating a light transmitting material to cover the plurality of semiconductor light emitting devices; etching the light transmitting material, and then depositing a metal thin film on the light transmitting material; and filling a phosphor into a portion from which the light transmitting material is etched to generate the phosphor portions, and wherein the light transmitting material is not etched on a portion corresponding to at least one of the plurality of semiconductor light emitting devices, and the metal thin film is formed to surround the portion from which the light transmitting material is not etched. 20 . The method of claim 19 , further comprising: forming an anti-reflection coating layer between the plurality of semiconductor light emitting devices and the light transmitting material.
Package configurations · CPC title
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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