Compound and Composition for Forming Lower Film of Resist Pattern, and Method for Forming Lower Film Using Same
US-2015286139-A1 · Oct 8, 2015 · US
US2017199459A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2017199459-A1 |
| Application number | US-201715405612-A |
| Country | US |
| Kind code | A1 |
| Filing date | Jan 13, 2017 |
| Priority date | Jan 13, 2016 |
| Publication date | Jul 13, 2017 |
| Grant date | — |
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A method of forming a pattern is disclosed. The method includes preparing a composition that includes a solvent and a polymer including a repeating unit in which at least one isocyanurate unit having a first structure is connected to another isocyanurate unit having a second structure different from the first structure; applying the composition on a substrate to form an underlayer; forming a photoresist layer on the underlayer; etching the photoresist layer to form a photoresist pattern; and patterning the substrate using the photoresist pattern.
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What is claimed is: 1 . A method of forming a pattern, comprising: preparing a composition that includes a solvent and a polymer including a repeating unit in which at least one isocyanurate unit having a first structure is connected to another isocyanurate unit having a second structure different from the first structure; applying the composition on a substrate to form an underlayer; forming a photoresist layer on the underlayer; etching the photoresist layer to form a photoresist pattern; and patterning the substrate or a layer on the substrate using the photoresist pattern. 2 . The method according to claim 1 , wherein each of the isocyanurate units includes a self-crosslinking side chain moiety. 3 . The method according to claim 1 , wherein the repeating unit includes at least two different types of self-crosslinking side chain moieties. 4 . The method according to claim 2 , wherein the repeating unit is represented by Chemical Formula 1: wherein, in Chemical Formula 1, R 1 and R 2 each independently represents a C 1 -C 10 chain-shaped or ring-shaped hydrocarbon group, the hydrocarbon group is saturated or includes at least one unsaturated bond, and the hydrocarbon group is unsubstituted or includes at least one hetero atom, wherein X and Y each represents the self-crosslinking side chain moiety, X and Y each independently represents a C 1 -C 12 chain-shaped or ring-shaped hydrocarbon group, at least one of X or Y includes a hetero atom, and X and Y are different from each other. 5 . The method according to claim 4 , wherein the repeating unit includes at least one of structures represented by Chemical Formulae 1-1 to 1-4: 6 . The method according to claim 2 , wherein the repeating unit includes at least three isocyanurate units. 7 . The method according to claim 6 , wherein the repeating unit is represented by Chemical Formula 2: 8 . The method according to claim 1 , further comprising preparing an acid generator. 9 . The method according to claim 8 , wherein the composition consists of the self-crosslinkable polymer, the acid generator and the solvent, and is devoid of a cross-linking agent. 10 . A method of forming a pattern, comprising: preparing a composition that includes a self-crosslinkable polymer including a repeating unit in which at least one isocyanurate unit having a first structure is connected to another isocyanurate unit having a second structure different from the first structure, and a solvent; coating the composition on an object layer to form an underlayer; forming a photoresist layer on the underlayer; performing an exposure process on the photoresist layer such that the photoresist layer is divided into an exposed portion and a non-exposed portion; removing one of the exposed portion or the non-exposed portion to form a photoresist pattern; and patterning the object layer using the photoresist pattern. 11 . The method of claim 10 , wherein a refractive index of the underlayer exceeds about 1.9. 12 . The method of claim 11 , wherein the refractive index of the underlayer is in a range from about 1.94 to about 2. 13 . The method of claim 10 , wherein the exposure process is performed using an ArF light source and an ArF immersion light source. 14 . The method of claim 10 , wherein forming the underlayer includes thermally cross-linking the self-crosslinkable polymer included in the composition. 15 . The method of claim 14 , wherein thermally cross-linking includes a baking process performed at a temperature from about 150° C. to about 250° C. 16 . The method according to claim 10 , wherein each of the isocyanurate units includes a self-crosslinking side chain moiety. 17 . The method according to claim 10 , wherein the repeating unit includes at least two different types of self-crosslinking side chain moieties. 18 . The method according to claim 16 , wherein the repeating unit is represented by Chemical Formula 1: wherein, in Chemical Formula 1, R 1 and R 2 each independently represents a C 1 -C 10 chain-shaped or ring-shaped hydrocarbon group, the hydrocarbon group is saturated or includes at least one unsaturated bond, and the hydrocarbon group is unsubstituted or includes at least one hetero atom, wherein X and Y each represents the self-crosslinking side chain moiety, X and Y each independently represents a C 1 -C 12 chain-shaped or ring-shaped hydrocarbon group, at least one of X or Y includes a hetero atom, and X and Y are different from each other. 19 . The method according to claim 18 , wherein the repeating unit includes at least one of structures represented by Chemical Formulae 1-1 to 1-4: 20 . A method of forming a pattern for a semiconductor device, comprising: preparing an underlayer composition that includes a solvent and a polymer including a repeating unit having a plurality of isocyanurate units in which at least one isocyanurate unit having a first chemical composition is connected to another isocyanurate unit having a second chemical composition different from the first chemical composition; applying the underlayer composition on a semiconductor substrate to form an underlayer; forming a photoresist layer on the underlayer; etching a portion of the photoresist layer to form a photoresist pattern; and patterning the semiconductor substrate or a layer on the semiconductor substrate using the photoresist pattern.
using an anti-reflective coating · CPC title
characterised by the process involved to create the mask, e.g. lift-off masks or sidewalls or to modify the mask · CPC title
characterised by their composition, e.g. multilayer masks or materials · CPC title
Chemical etching · CPC title
using masks for insulating materials · CPC title
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