Frit material, photoelectric packaged device and packaging method thereof, and display apparatus

Patent metadata

Field	Value
Publication number	US-2017197871-A1
Application number	US-201615322755-A
Country	US
Kind code	A1
Filing date	Jan 29, 2016
Priority date	Aug 27, 2015
Publication date	Jul 13, 2017
Grant date	—

Abstract

Examples of the present invention provide a frit material, a photoelectric packaged device and a packaging method thereof, and a display apparatus. They relates to the field of display technology, and may reduce the bubbles generated during the sintering of the frit material at high temperature, improve the flatness of the surface of the frit material, and increase the proportion of the packaged area after the frit material is adhered to the device substrate, to increase the mechanical strength of the packaged OLED panel, while the viscosity of the frit material is not affected. The frit material comprises frit-powders and an organic material comprising an organic thickener, wherein the frit material further comprises an inorganic thickener consisting of a clay mineral material. Examples of the present invention are used for production of the frit material, the photoelectric packaged device comprising the frit material, and the display apparatus.

First claim

1 . A frit material, which comprises frit-powders and an organic material comprising an organic thickener, wherein the frit material further comprises an inorganic thickener consisting of a clay mineral material.

2 . The frit material according to claim 1 , wherein the frit material has a viscosity ranging from 0.3×10 5 to 1.3×10 5 cps.

3 . The frit material according to claim 2 , wherein the mass of the inorganic thickener accounts for 30 to 70% of the total mass of the inorganic thickener and the organic thickener.

4 . The frit material according to claim 2 , wherein the mass of the inorganic thickener accounts for 3 to 15% of the total mass of the frit material.

5 . The frit material according to claim 1 , wherein the clay mineral material comprises at least one of palygorskite, bentonite and kaolin.

6 . The frit material according to claim 1 , wherein the inorganic thickener has a particle size ranging from 0.1 to 2.0 μm.

7 . A photoelectric packaged device, comprising a first substrate and a second substrate disposed oppositely, a photoelectric element disposed between the first substrate and the second substrate, and a packaging material around the photoelectric element, wherein the packaging material, the first substrate and the second substrate forms a sealed space, wherein the packaging material is formed by curing the frit material according to claim 1 .

8 . A display apparatus, wherein the display apparatus comprises the photoelectric packaged device according to claim 7 .

9 . A packaging method of a photoelectric packaged device, comprising:
providing a first substrate and a second substrate; wherein the second substrate has a photoelectric element to be packaged formed thereon, and the region on the first substrate corresponding to the region on the second substrate around the photoelectric element is a packaging region; forming the frit material in the packaging region on the first substrate; or, forming the frit material according to claim 1 in the region on the second substrate around the photoelectric element; subjecting the frit material to a heat treatment; adhering one of the first substrate and the second substrate, which has the frit material formed thereon, to the other; subjecting the frit material to a laser irradiation.

10 . The packaging method according to claim 9 , wherein the temperature of the heat treatment ranges from 400 to 450° C., and the time of the heat treatment ranges from 10 to 60 min.

11 . The packaging method according to claim 9 , wherein a stage heating is used by the heat treatment.

12 . The frit material according to claim 1 , wherein the organic thickener is ethyl cellulose.

13 . The packaging method according to claim 10 , wherein a stage heating is used by the heat treatment.

Assignees

• Boe Technology Group Co Ltd

Inventors

• Hong Rui

Classifications

• C03C3/122

  containing oxides of As, Sb, Bi, Mo, W, V, Te as glass formers · CPC title

• C03C8/24 Primary

  Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders · CPC title

• H01L51/5246

  Electricity · mapped topic

• C03C8/04

  containing zinc · CPC title

• H01L51/56

  Electricity · mapped topic