Thermal insulation structure for electronic device, motor provided with said thermal insulation structure, and method for forming thermal insulation member for electronic device

Patent metadata

Field	Value
Publication number	US-2017194829-A1
Application number	US-201515325514-A
Country	US
Kind code	A1
Filing date	Jul 29, 2015
Priority date	Aug 1, 2014
Publication date	Jul 6, 2017
Grant date	—

Abstract

A thermal insulation structure for an electronic device of the present invention is a thermal insulation structure which thermally insulates between an electronic circuit unit and a heat generator formed with another component. In the thermal insulation structure, a partition wall for separating each space and formed of resin having electric insulation properties is provided between the electronic circuit unit and the heat generator. Also, the partition wall is formed by integrating the resin and a thermal insulation material having thermal conductivity lower than thermal conductivity of air so that the resin includes the thermal insulation material. Further, the partition wall is formed by insert-molding the thermal insulation material with the resin. Further, the resin having the electric insulation properties is thermoplastic resin, and a thermal insulation raw material of the thermal insulation material is silica xerogel.

First claim

1 . A thermal insulation structure for an electronic device which thermally insulates between an electronic circuit unit and a heat generator formed with another component, wherein
a partition wall for separating each space and formed of resin having electric insulation properties is provided between the electronic circuit unit and the heat generator, and the partition wall is formed by integrating the resin and a thermal insulation material having thermal conductivity lower than thermal conductivity of air so that the resin includes the thermal insulation material.

2 . The thermal insulation structure for the electronic device according to claim 1 , wherein the partition wall is formed by insert-molding the thermal insulation material with the resin.

3 . The thermal insulation structure for the electronic device according to claim 1 , wherein the resin having the electric insulation properties is thermoplastic resin.

4 . The thermal insulation structure for the electronic device according to claim 1 , wherein a thermal insulation raw material of the thermal insulation material is silica xerogel.

5 . The thermal insulation structure for the electronic device according to claim 1 , wherein the thermal insulation material has a film-like shape or a sheet-like shape.

6 . The thermal insulation structure for the electronic device according to claim 1 , wherein the thermal insulation material included in the partition wall is formed by die-cutting a film-like thermal insulation material or a sheet-like thermal insulation material.

7 . The thermal insulation structure for the electronic device according to claim 1 , wherein the partition wall is formed so that an entire peripheral end part of the thermal insulation material is included in the resin.

8 . The thermal insulation structure for the electronic device according to claim 5 , wherein a plurality of the thermal insulation materials are laminated.

9 . A motor which integrally incorporates a motor mechanism and a circuit board, the motor mechanism including a stator, around which a coil is wound, and a rotor opposing the stator and rotatably disposed around a shaft, and the circuit board being mounted with an electronic component for energizing and driving the coil, the motor comprising:
a magnetic circuit unit which stores the stator and the rotor inside a motor case; an electronic circuit unit which stores the circuit board inside a box-shaped bracket; and the thermal insulation structure for the electronic device according to claim 1 provided between the magnetic circuit unit and the electronic circuit unit.

10 . A method for forming a thermal insulation member for an electronic device which thermally insulates between an electronic circuit unit and a heat generator formed with another component, the method comprising:
impregnating a non-woven fabric serving as a sheet-like impregnated raw material with a thermal insulation raw material having thermal conductivity lower than thermal conductivity of air; holding and molding the non-woven fabric impregnated with the thermal insulation raw material, held by a film and forming a thermal insulation sheet; stamping out the thermal insulation sheet and generating a thermal insulation material; and insert-molding the thermal insulation material with resin and forming the thermal insulation member.

Assignees

• Panasonic Ip Man Co Ltd

Inventors

• Sadanaga Yuichiro
• Kondo Kenji
• Sakata Takeshi
• Morita Masanori

Classifications

• H02K11/33 Primary

  Drive circuits, e.g. power electronics (H02K11/38 takes precedence) · CPC title

• H02K5/08 Primary

  Insulating casings · CPC title

• B29K2995/0015

  Insulating · CPC title

• H02K5/04

  Casings or enclosures characterised by the shape, form or construction thereof · CPC title

• H05K7/20

  Modifications to facilitate cooling, ventilating, or heating · CPC title