Method of forming semiconductor devices
US-2024387980-A1 · Nov 21, 2024 · US
US2017194715A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2017194715-A1 |
| Application number | US-201614988869-A |
| Country | US |
| Kind code | A1 |
| Filing date | Jan 6, 2016 |
| Priority date | Jan 6, 2016 |
| Publication date | Jul 6, 2017 |
| Grant date | — |
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A structural antenna array may include a core including intersecting wall sections, wherein the core further includes antenna elements formed on a first surface of the wall sections, and feed elements formed on a second surface of the wall sections, a distribution substrate layer coupled to the core and in electrical communication with the antenna elements and the feed elements, a first skin coupled to the core opposite the distribution substrate layer, and a second skin coupled to the distribution substrate layer opposite the first skin.
Opening claim text (preview).
What is claimed is: 1 . A structural antenna array comprising: a core comprising intersecting wall sections, wherein said core further comprises antenna elements formed on a first surface of said wall sections, and feed elements formed on a second surface of said wall sections; a distribution substrate layer coupled to said core and in electrical communication with said antenna elements and said feed elements; a first skin coupled to said core opposite said distribution substrate layer; and a second skin coupled to said distribution substrate layer opposite said first skin. 2 . The structural antenna array of claim 1 wherein said antenna elements comprise dipole antenna elements. 3 . The structural antenna array of claim 1 wherein said core comprises a square cell structure of said wall sections intersecting perpendicularly to form columns and rows of antenna cells. 4 . The structural antenna array of claim 3 wherein each one of said antenna cells comprises at least one pair of said antenna elements oriented orthogonally to provide dual polarization. 5 . The structural antenna array of claim 1 wherein each one of said wall sections comprises an electronic board material. 6 . The structural antenna array of claim 1 wherein said distribution substrate layer comprises an electronic board material. 7 . The structural antenna array of claim 1 wherein said first skin and said second skin each comprises: a first non-conductive substrate layer; a dielectric substrate layer coupled to said first non-conductive substrate layer; and a second non-conductive substrate layer coupled to said dielectric substrate layer opposite said first non-conductive substrate layer. 8 . The structural antenna array of claim 1 further comprising RF connectors coupled to and in electrical communication with said distribution substrate layer. 9 . The structural antenna array of claim 8 wherein pairs of said RF connectors are in electrical communication with selected ones of said feed elements and selected ones of said antenna elements. 10 . The structural antenna array of claim 1 wherein at least one of said wall sections comprises a first wall portion, a second wall portion, and a conductive splice electrically connecting one of said antenna elements of said first wall portion to an adjacent one of said antenna elements of said second wall portion. 11 . The structural antenna array of claim 10 further comprising a non-conductive splice clip connected to said first wall portion and said second wall portion over said conductive splice. 12 . A mobile platform comprising: a structural member; and a structural antenna array coupled to and forming a portion of said structural member, wherein said structural antenna array comprises: a core comprising intersecting wall sections, wherein said core further comprises antenna elements formed on a first surface of said wall sections, and feed elements formed on a second surface of said wall sections; a distribution substrate layer coupled to said core and in electrical communication with said antenna elements and said feed elements; a first skin coupled to said core opposite said distribution substrate layer; and a second skin coupled to said distribution substrate layer opposite said first skin. 13 . The mobile platform of claim 12 wherein: each one of said wall sections comprises an electronic board material, said distribution substrate layer comprises said electronic board material, and said first skin and said second skin each comprises: a first non-conductive substrate layer comprising said electronic board material; a dielectric substrate layer coupled to said first non-conductive substrate layer; and a second non-conductive substrate layer coupled to said dielectric substrate layer opposite said first non-conductive substrate layer, said second non-conductive substrate layer comprising said electronic board material. 14 . The mobile platform of claim 12 wherein: said core comprises a square cell structure of said wall sections intersecting perpendicularly to form columns and rows of antenna cells, and each one of said antenna cells comprises at least one pair of said antenna elements oriented orthogonally to provide dual polarization. 15 . The mobile platform of claim 12 wherein said antenna elements comprise dipole antenna elements. 16 . The mobile platform of claim 12 further comprising RF connectors coupled to and in electrical communication with said distribution substrate layer. 17 . The mobile platform of claim 12 wherein at least one of said wall sections comprises a first wall portion, a second wall portion, a conductive splice electrically connecting one of said antenna elements of said first wall portion to an adjacent one of said antenna elements of said second wall portion, and a non-conductive splice clip connected to said first wall portion and said second wall portion over said conductive splice. 18 . The mobile platform of claim 12 wherein said structural member comprises at least one of a fuselage and a wing of an aircraft. 19 . A method for making a structural antenna array comprising: forming a core comprising intersecting wall sections, wherein said wall sections comprise antenna elements formed on a first surface, feed elements formed on an opposed second surface, and connector pins coupled to said feed elements and said antenna elements; connecting a frame around said core; positioning a distribution substrate layer on said core, wherein said distribution substrate layer comprises a plurality of vias; connecting said connector pins to said vias to mechanically couple said wall sections to said distribution substrate layer; soldering said connector pins to said vias to electrically couple said feed elements and said antenna elements to said distribution substrate layer; connecting RF connectors to said distribution substrate layer to electrically couple said feed elements and said antenna elements to said RF connectors; positioning a first skin on said core opposite said distribution substrate layer; positioning a second skin on said distribution substrate layer opposite said first skin; and curing said core, said distribution substrate layer, said first skin, and said second skin. 20 . The method of claim 19 further comprising: testing an electrical continuity of said core connected to said distribution substrate layer; and applying a structural adhesive to said core and said distribution substrate layer.
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