Coil electronic component and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-2017194084-A1
Application number	US-201615253130-A
Country	US
Kind code	A1
Filing date	Aug 31, 2016
Priority date	Dec 30, 2015
Publication date	Jul 6, 2017
Grant date	—

Abstract

A coil electronic component includes a magnetic body, wherein the magnetic body includes a substrate, and a coil part including patterned insulating films disposed on the substrate, a first plating layer formed between the patterned insulating films by plating, and a second plating layer disposed on the first plating layer.

First claim

What is claimed is:

1 . A coil electronic component comprising:
a magnetic body, wherein the magnetic body includes a substrate, and a coil part including patterned insulating films disposed on the substrate, a first plating layer formed between the patterned insulating films, and a second plating layer disposed on the first plating layer.

2 . The coil electronic component of claim 1 , wherein the magnetic body further includes a cover insulating layer disposed on the insulating films and the second plating layer.

3 . The coil electronic component of claim 2 , wherein the cover insulating layer is formed of a material different from that of the insulating films.

4 . The coil electronic component of claim 1 , wherein the first plating layer does not include an internal interface.

5 . The coil electronic component of claim 1 , wherein the first plating layer has a rectangular shape.

6 . The coil electronic component of claim 1 , wherein the first plating layer has a thickness of 200 μm or more, and an aspect ratio of 1.0 or more.

7 . The coil electronic component of claim 1 , wherein the insulating film has a width of 1 μm to 20 μm.

8 . The coil electronic component of claim 1 , wherein the second plating layer is an anisotropic plating layer.

9 . A method of manufacturing a coil electronic component, the method comprising the steps of:
patterning a base conductor layer on a substrate; patterning insulating films so that the base conductor layer is exposed; forming a first plating layer between the patterned insulating films on the base conductor layer by performing plating; forming a second plating layer on the first plating layer by performing anisotropic plating; and forming a magnetic body by stacking magnetic sheets on and below the substrate on which the insulating films and the first and second plating layers are formed.

10 . The method of claim 9 , further comprising, before the step of forming the magnetic body, a step of forming a cover insulating layer on the insulating films and the second plating layer.

11 . The method of claim 10 , wherein the cover insulating layer is formed of a material different from that of the insulating films.

12 . The method of claim 9 , wherein the step of forming the first plating layer is performed by a single plating.

13 . The method of claim 9 , wherein the first plating layer has a rectangular shape.

14 . The method of claim 9 , wherein the first plating layer has a thickness of 200 μm or more, and an aspect ratio of 1.0 or more.

15 . The method of claim 9 , wherein the insulating films have a width of 1 μm to 20 μm.

16 . The method of claim 9 , wherein the step of forming a first plating layer includes performing isotropic plating.

17 . The method of claim 9 , wherein the step of patterning the base conductor layer on the substrate includes forming the base conductor layer on the substrate, forming a resist pattern on the base conductor layer, performing an etching process, and delaminating the resist pattern.

18 . The method of claim 10 , wherein the step of forming the cover insulating layer includes at least one selected from the group consisting of a screen printing method, a spray coating process, a chemical vapor deposition (CVD) method, and a dipping method using a polymer coating solution having low viscosity.

19 . A method of manufacturing a coil electronic component, the method comprising the steps of:
forming a base conductor layer on a substrate; forming a resist pattern on the base conductor layer; patterning the base conductor layer by performing an etching process; delaminating the resist pattern; forming an insulating film on portions of the substrate exposed between the base conductor layer; forming a first plating layer by performing isotropic plating; forming a second plating layer by performing anisotropic plating; forming a cover insulating layer on the insulating film and the second plating layer; and forming a magnetic body by stacking magnetic sheets on and below the insulating substrate.

20 . The method of claim 19 , wherein the step of forming an insulating film includes an exposure and development process.

Assignees

• Samsung Electro Mech

Inventors

• Choi Woon Chul
• Oh Ji Hye
• Jung Jung Hyuk
• Ryu Han Wool

Classifications

• H01F2017/048

  with encapsulating core, e.g. made of resin and magnetic powder · CPC title

• H01F41/046

  structurally combined with ferromagnetic material · CPC title

• H01F27/324

  Insulation between coil and core, between different winding sections, around the coil; Other insulation structures · CPC title

• H01F41/16

  the magnetic material being applied in the form of particles, e.g. by serigraphy {, to form thick magnetic films or precursors therefor} (H01F41/18 {-H01F41/24} take precedence) · CPC title

• H01F41/34

  in patterns, e.g. by lithography · CPC title