Method and system of sealing front half of camera module

Patent metadata

Field	Value
Publication number	US-2017192340-A1
Application number	US-201514986367-A
Country	US
Kind code	A1
Filing date	Dec 31, 2015
Priority date	Dec 31, 2015
Publication date	Jul 6, 2017
Grant date	—

Abstract

A method and apparatus for sealing components of a front half camera module subassembly is described herein. The camera may be used in an automotive camera, which includes but is not limited to automotive rear-view cameras. A glue bead seal may be applied to the front half camera housing to which a camera lens may be attached. Then a glue bead seal may be applied to the other side of the front half camera housing to which a printed circuit board (PCB) is attached. As a result, the seals protect the lens inside optical surface and image sensor located between the camera lens and PCB from the outside environment. The lens inside optical surface and image sensor and PCB may be tested, calibrated, or have other assembly sequences completed outside of a clean room. Alignment of the PCB and lens inside optical surface and image sensor is also secured.

First claim

What is claimed is:

1 . A method for sealing a front half camera module subassembly, the method comprising:
applying a first glue bead to a front half camera housing; attaching a printed circuit board (PCB), wherein the PCB includes a lens inside optical surface and image sensor, to the front half camera housing via the first glue bead to seal the lens inside optical surface and image sensor inside the front half camera module subassembly and protect the lens inside optical surface and image sensor from an outside environment; applying a second glue bead to the front half camera housing; and attaching a lens to the front half camera housing via the second glue bead.

2 . The method of claim 1 , wherein the first glue bead and second glue bead are composed of ultra violet (UV) light cured waterproof glue.

3 . The method of claim 1 , wherein the first glue bead and second glue bead are composed of heat cured waterproof glue.

4 . The method of claim 1 , wherein the first glue bead and second glue bead are composed of ultra violet (UV) light and heat cured waterproof glue.

5 . The method of claim 1 , wherein the camera module is associated with an automotive rear-view camera.

6 . The method of claim 1 , wherein the attaching the PCB to the front half camera housing via the first glue bead creates a plurality of openings that expose the second glue bead to ultraviolet (UV) light to enable initial glue curing and to tack the PCB in place.

7 . A sealed front half camera module subassembly comprising:
a first glue bead applied to a front half camera housing; a printed circuit board (PCB), wherein the PCB includes a lens inside optical surface and image sensor, attached to the front half camera housing via the first glue bead to seal the lens inside optical surface and image sensor inside the front half camera module subassembly and protect the lens inside optical surface and image sensor from an outside environment; a second glue bead applied to the front half camera housing; and a lens attached to the front half camera housing via the second glue bead.

8 . The sealed front half camera module subassembly of claim 7 , wherein the first glue bead and second glue bead are composed of ultra violet (UV) light cured waterproof glue.

9 . The sealed front half camera module subassembly of claim 7 , wherein the first glue bead and second glue bead are composed of heat cured waterproof glue.

10 . The sealed front half camera module subassembly of claim 7 , wherein the first glue bead and second glue bead are composed of ultra violet (UV) light and heat cured waterproof glue.

11 . The sealed front half camera module subassembly of claim 7 , wherein the camera module is associated with an automotive rear-view camera.

12 . The sealed front half camera module subassembly of claim 7 , wherein the PCB attached to the front half camera housing via the first glue bead creates a plurality of openings that expose the second glue bead to ultraviolet (UV) light to enable initial glue curing and to tack the PCB in place.

Assignees

• Flextronics Ap Llc

Inventors

• Warren Gary
• Van Roon Darren
• Grills Reginald C
• Tofilescu Pompilian

Classifications

• H04N23/55

  Optical parts specially adapted for electronic image sensors; Mounting thereof · CPC title

• H04N23/51

  Housings · CPC title

• H04N23/54

  Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils · CPC title

• F16B11/006

  by gluing (gluing of plastics material B29C65/48) · CPC title

• B29C65/4845

  Radiation curing adhesives, e.g. UV light curing adhesives · CPC title