Wafer processing apparatus and wafer processing method
US-2024395512-A1 · Nov 28, 2024 · US
US2017191155A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2017191155-A1 |
| Application number | US-201615218507-A |
| Country | US |
| Kind code | A1 |
| Filing date | Jul 25, 2016 |
| Priority date | Jan 4, 2016 |
| Publication date | Jul 6, 2017 |
| Grant date | — |
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A vapor deposition system including a vapor deposition mechanism and a separation mechanism is provided. The vapor deposition mechanism includes a vapor deposition source, and further includes a vapor deposition baseplate and a cover plate that are located at a side of the vapor deposition source in a vapor deposition direction in order; the cover plate comprises a frame defining an enclosed frame region, the frame comprises a contact surface with the vapor deposition baseplate, and the contact surface comprise an adhesion portion, and the vapor deposition baseplate is capable of being adhered to the cover plate; the separation mechanism comprises at least one support plate and at least one movable bar connected with the support plate, the movable bar is configured to separate the vapor deposition baseplate from the cover plate after completion of film vapor deposition.
Opening claim text (preview).
What is claimed is: 1 . A vapor deposition system, comprising a vapor deposition mechanism and a separation mechanism, wherein the vapor deposition mechanism comprises a vapor deposition source, and further comprises a vapor deposition baseplate and a cover plate that are located at a side of the vapor deposition source in a vapor deposition direction in order, and the vapor deposition mechanism is configured for depositing a thin film on a first surface of the vapor deposition baseplate; the cover plate comprises a frame defining an enclosed frame region, the frame comprises a contact surface with the vapor deposition baseplate, and the contact surface comprise an adhesion portion, and the vapor deposition baseplate is capable of being adhered to the cover plate; the separation mechanism comprises at least one support plate and at least one movable bar connected with the support plate, the movable bar is configured to separate the vapor deposition baseplate from the cover plate after completion of film vapor deposition, the support plate comprises a third surface and a fourth surface that are opposite to each other, the third surface of the support plate is capable of being in contact with a second surface of the vapor deposition baseplate in the frame region, and the second surface is opposite to the first surface; the movable bar is connected to the fourth surface of the support plate and is configured to bring the support plate to move in a vertical direction to the frame region, and an area of the third surface is greater than a contact area between the movable bar and the support plate. 2 . The vapor deposition system according to claim 1 , wherein the cover plate further comprises at least one connecting rod located in the frame region, the connecting rod is connected with the frame and divides the frame region into at least two sub-frame regions; the separation mechanism comprises at least two support plates each corresponding to one sub-frame region, the third surface of each of the support plates is in contact with the second surface of the vapor deposition baseplate in a sub-frame region corresponding to this support plate. 3 . The vapor deposition system according to claim 2 , wherein the at least two sub-frame regions are identical to each other in area. 4 . The vapor deposition system according to claim 2 , wherein the third surface of each support plate has an area greater than half of an area of the sub-frame region corresponding to this area. 5 . The vapor deposition system according to claim 2 , wherein the vapor deposition baseplate is configured to form a display panel masterboard, and is divided into a plurality of display panel units, and the sub-frame regions are in one-to-one correspondence with the display panel units. 6 . The vapor deposition system according to claim 3 , wherein the vapor deposition baseplate is configured to form the display panel masterboard, and is divided into several display panel units, and the sub-frame regions are in one-to-one correspondence with the display panel units. 7 . The vapor deposition system according to claim 1 , wherein the vapor deposition system further comprises a cooling component; and the cooling component is configured to reduce a temperature of the vapor deposition baseplate. 8 . The vapor deposition system according to claim 7 , wherein the cooling component comprises a cooling tube which allows gas and/or liquid to flow therein, and the cooling tube is provided on a surface of the support plate having no contact with the vapor deposition baseplate. 9 . The vapor deposition system according to claim 8 , wherein the cooling tube is provided on the fourth surface of the support plate. 10 . The vapor deposition system according to claim 8 , wherein the cooling tube is provided on the surface of the support plate in a zigzag arrangement. 11 . The vapor deposition system according to claim 9 , wherein the cooling tube is provided on the surface of the support plate in a zigzag arrangement. 12 . The vapor deposition system according to claim 1 , wherein the support plate is a metal plate or a ceramic baseplate. 13 . The vapor deposition system according to claim 3 , wherein the vapor deposition baseplate is configured to form a display panel masterboard, and is divided into a plurality of display panel units, and the sub-frame regions are in one-to-one correspondence with the display panel units.
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