Resin powder material, laser powder molding method and device

US2017190905A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2017190905-A1
Application numberUS-201515312991-A
CountryUS
Kind codeA1
Filing dateJan 28, 2015
Priority dateJan 28, 2015
Publication dateJul 6, 2017
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Molded bodies formed from PA- 12 resin lose elasticity by absorbing water and lose strength as a result. Due to this, application to only some products used in low humidity environments is possible, which is a problem that needed to be addressed. This resin powder material, for use in powder laminate molding methods, is characterized in that the resin powder is a polybutylene terephthalate resin which has a crystallization temperature lower than that of homopolybutylene terephthalate resins.

First claim

Opening claim text (preview).

1 . A resin powder material used for a powder laminate molding method, wherein said resin powder is a polybutylene terephthalate resin having a crystallization temperature lower than that of a homopolybutylene terephthalate resin, and wherein said polybutylene terephthalate resin has a melting point of from 200 to 215° C. 2 . (canceled) 3 . The resin powder material according to claim 1 , wherein said polybutylene terephthalate resin comprises, as a main component, polybutylene terephthalate copolymer containing a copolymer component. 4 . The resin powder material according to claim 1 , wherein said polybutylene terephthalate copolymer comprises a copolymer component in an amount of from 3 to 30 mol %. 5 . A resin powder material used for a powder laminate molding method, wherein said resin powder is a polybutylene terephthalate resin having a crystallization temperature lower than that of a homopolybutylene terephthalate resin, and wherein said polybutylene terephthalate is as copolymer comprising an isophthalic acid component in an amount of from 5 to 15 mol %. 6 . The resin powder material according to claim 5 , wherein a stress is applied by a step of pulverizing in a manner of applying at least either shock or shearing action to pellets of a polybutylene terephthalate resin composition. 7 . The resin powder material according to claim 6 , wherein said pulverizing step is a step of pulverizing said pellets at a temperature of normal temperature or less. 8 . The resin powder material according to claim 1 , wherein said polybutylene terephthalate resin is alloyed with a polyethylene terephthalate resin or polycarbonate resin in an alloy ratio of from 5 to 40 wt %. 9 . A resin powder material used for a powder laminate molding method, wherein said resin powder is a polybutylene terephthalate resin having a crystallization temperature lower than that of a homopolybutylene terephthalate resin, and wherein said polybutylene terephthalate resin comprises an inorganic substance having an average primary particle diameter of 100 nm or less in an amount of 0.05 or more but less than 1.0 wt %. 10 . The resin powder material according to claim 1 , wherein the resin powder material comprises a flame retardant mixed with said polybutylene terephthalate resin. 11 . A resin powder material used for a powder laminate molding method, wherein said resin powder is a polybutylene terephthalate resin having a crystallization temperature lower than that of a homopolybutylene terephthalate resin, and wherein the resin powder material comprises an inorganic substance having a major axis direction size of 300 μm or less in an amount of from 5 to 40 wt % mixed with said polybutylene terephthalate resin. 12 . A resin powder material used for a powder laminate molding method, wherein said resin powder is a polybutylene terephthalate resin having a crystallization temperature lower than that of a homopolybutylene terephthalate resin, and wherein the resin powder material comprises inorganic substance beads having an average primary particle diameter and 50% average particle diameter of 100 μm or less in an amount of at least from 5 to 40 wt % mixed with said polybutylene terephthalate resin. 13 . A resin powder material used for a powder laminate molding method, wherein said resin powder is a polybutylene terephthalate resin having a crystallization temperature lower than that of a homopolybutylene terephthalate resin, and wherein said polybutylene terephthalate resin has a Hausner ratio of 1.34 or less at room temperature. 14 . A resin powder material used for a powder laminate molding method, wherein said resin powder is a polybutylene terephthalate resin having a crystallization temperature lower than that of a homopolybutylene terephthalate resin, and wherein said polybutylene terephthalate resin has an angle of repose of 40° or less at room temperature. 15 . A laser powder molding method comprising: the step of arranging a resin powder material; and the laser irradiating step of irradiating a laser on said arranged resin powder material to sinter or melt a place which said laser is irradiated on; wherein said arranging step and said laser irradiating step are sequentially repeated to prepare a laminate molded body, wherein said resin powder material is a polybutylene terephthalate resin having a crystallization temperature lower than that of a homopolybutylene terephthalate resin, wherein the laser powder molding method includes the step of arranging another member prior to arranging said resin powder material, and wherein at said laser irradiating step, when an underlayer of the place to be laser irradiated is said resin powder material, a laser is irradiated on said another member at an energy lower than that of a place of said resin powder material arranged. 16 . (canceled) 17 . The laser powder molding method according to claim 15 , wherein said another member is a member comprising a resin or metal. 18 . The laser powder molding method according to claim 15 , wherein a temperature of a place arranging said resin powder material is retained at a crystallization temperature or less of said polybutylene terephthalate resin. 19 . The laser powder molding method according to claim 15 , wherein said another member has a rigidity higher than that of a molded body of said polybutylene terephthalate resin. 20 . A laser powder molding device having a roller or blade and a laser light source comprising: arranging a resin powder material by using said roller or blade; and irradiating a laser on said arranged resin powder material from said laser light source to sinter or melt a place irradiated, wherein said arranging step and said laser irradiating step are sequentially repeated to prepare a laminate molded body, wherein said resin powder material is a polybutylene terephthalate resin having a crystallization temperature lower than that of a homopolybutylene terephthalate resin, and wherein said polybutylene terephthalate resin has a melting point of from 200 to 215° C.

Assignees

Inventors

Classifications

  • for controlling or regulating additive manufacturing processes · CPC title

  • Structures for supporting 3D objects during manufacture and intended to be sacrificed after completion thereof · CPC title

  • Particles, powder or granules (expandable particles B29K2105/046) · CPC title

  • Silica · CPC title

  • Processes of additive manufacturing · CPC title

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What does patent US2017190905A1 cover?
Molded bodies formed from PA- 12 resin lose elasticity by absorbing water and lose strength as a result. Due to this, application to only some products used in low humidity environments is possible, which is a problem that needed to be addressed. This resin powder material, for use in powder laminate molding methods, is characterized in that the resin powder is a polybutylene terephthalate res…
Who is the assignee on this patent?
Hitachi Ltd
What technology area does this patent fall under?
Primary CPC classification C08L67/02. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Thu Jul 06 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).