Organic Silicon Compound, Curable Silicone Composition, And Semiconductor Device

Patent metadata

Field	Value
Publication number	US-2017190878-A1
Application number	US-201515315067-A
Country	US
Kind code	A1
Filing date	May 28, 2015
Priority date	May 30, 2014
Publication date	Jul 6, 2017
Grant date	—

Abstract

An organosilicon compound represented by the general formula, a hydrosilylation-curable silicone composition containing the compound as an adhesion promoter, and a semiconductor device having a semiconductor element sealed with a cured product of the composition. To provide a novel organosilicon compound, a curable silicone composition that contains the organosilicon compound as an adhesion promoter, has excellent initial adhesion and adhesion durability to a base material such as an organic resin, and forms a cured product having high light transmittance, and a highly reliable semiconductor device produced using this composition.

First claim

1 . An organosilicon compound represented by the general formula:

wherein, R 1 are the same or different monovalent hydrocarbon groups each having from 1 to 12 carbon atoms and no aliphatic unsaturated bond; R 2 is an alkenyl group having from 2 to 12 carbon atoms; R 3 is an alkylene group having 2 to 12 carbon atoms; X is at least one group selected from the group consisting of an alkoxysilylalkyl group, a glycidoxyalkyl group, an epoxycycloalkylalkyl group, an epoxyalkyl group, and a carboxylic acid anhydride residue-containing alkyl group; m is an integer of 0 or greater, n is an integer of 1 or greater, and p is an integer of 1 or greater, provided that the sum of m, n, and p is an integer of from 3 to 50; and z is an integer of from 1 to 50.

2 . The organosilicon compound according to claim 1 , wherein R 3 is an ethylene group or a propylene group.

3 . The organosilicon compound according to claim 1 , wherein X is an alkoxysilylalkyl group and/or a glycidoxyalkyl group.

4 . The organosilicon compound according to claim 1 , wherein z is an integer of from 1 to 5.

5 . An organosilicon compound represented by the general formula:

wherein, R 1 are the same or different monovalent hydrocarbon groups each having from 1 to 12 carbon atoms and no aliphatic unsaturated bond; R 2 is an alkenyl group having from 2 to 12 carbon atoms; R 3 is an alkylene group having from 2 to 12 carbon atoms; X is at least one group selected from the group consisting of an alkoxysilylalkyl group, a glycidoxyalkyl group, an epoxycycloalkylalkyl group, an epoxyalkyl group, and a carboxylic acid anhydride residue-containing alkyl group; a is an integer of from 1 to 3 and b is an integer of from 1 to 3, provided that the sum of a and b is an integer of from 2 to 4; and z is an integer of from 1 to 50.

6 . The organosilicon compound according to claim 5 , wherein R 3 is an ethylene group or a propylene group.

7 . The organosilicon compound according to claim 5 , wherein X is an alkoxysilylalkyl group and/or a glycidoxyalkyl group.

8 . The organosilicon compound according to claim 5 , wherein z is an integer of from 1 to 5.

9 . An adhesion promoter comprising the organosilicon compound according to described in claim 1 .

10 . A curable silicone composition comprising the organosilicon compound according to described in claim 1 as an adhesion promoter.

11 . The curable silicone composition according to claim 10 that is curable by a hydrosilylation reaction.

12 . The curable silicone composition according to claim 11 , wherein the hydrosilylation reaction curable silicone composition comprises:
(A) 100 parts by mass of an organopolysiloxane having at least two alkenyl groups in a molecule; (B) an organohydrogenpolysiloxane having at least two silicon atom-bonded hydrogen atoms in a molecule, in an amount such that 0.1 to 10.0 mol of silicon atom-bonded hydrogen atom is provided relative to 1 mol of all alkenyl groups in components (A) and (C); (C) 0.01 to 50 parts by mass of adhesion promoter consisting of the organosilicon compound; and (D) a hydrosilylation reaction catalyst, in an amount sufficient to accelerate curing of the composition.

13 . A semiconductor device comprising a semiconductor element sealed with a cured product of the curable silicone composition according to claim 10 .

14 . The semiconductor device according to claim 13 , wherein the semiconductor element is a light emitting element.

15 . An adhesion promoter comprising the organosilicon compound according to claim 5 .

16 . A curable silicone composition comprising the organosilicon compound according to claim 5 as an adhesion promoter.

17 . The curable silicone composition according to claim 16 that is curable by a hydrosilylation reaction.

18 . The curable silicone composition according to claim 17 , wherein the hydrosilylation reaction curable silicone composition comprises:
(A) 100 parts by mass of an organopolysiloxane having at least two alkenyl groups in a molecule; (B) an organohydrogenpolysiloxane having at least two silicon atom-bonded hydrogen atoms in a molecule, in an amount such that 0.1 to 10.0 mol of silicon atom-bonded hydrogen atom is provided relative to 1 mol of all alkenyl groups in components (A) and (C); (C) 0.01 to 50 parts by mass of adhesion promoter consisting of the organosilicon compound; and (D) a hydrosilylation reaction catalyst, in an amount sufficient to accelerate curing of the composition.

19 . A semiconductor device comprising a semiconductor element sealed with a cured product of the curable silicone composition according to claim 16 .

Assignees

• Dow Corning Toray Co Ltd

Inventors

• Iimura Tomohiro
• Toda Nohno
• INAGAKI Sawako
• Miyamoto Yusuke
• Furukawa Haruhiko

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W74/40

  characterised by their materials · CPC title

• H10W74/10 Primary

  characterised by their shape or disposition · CPC title