Cooling device

Patent metadata

Field	Value
Publication number	US-2017172011-A1
Application number	US-201514982956-A
Country	US
Kind code	A1
Filing date	Dec 29, 2015
Priority date	Dec 14, 2015
Publication date	Jun 15, 2017
Grant date	—

Abstract

A cooling device includes a cooling tank, a plurality of circuit board modules received in the cooling tank, and a fill unit received in the cooling tank. The fill unit includes a plurality of first fill modules corresponding to the plurality of circuit board modules. The plurality of first fill modules, the cooling tank and the circuit board modules form a gap, and a plurality of coolant is filled in the gap to dissipate heat for the plurality of circuit board modules.

First claim

1 . A cooling device comprising:
a cooling tank; a plurality of circuit board modules received in the cooling tank; and a fill unit received in the cooling tank and comprising a plurality of first fill modules corresponding to the plurality of circuit board modules; wherein the plurality of first fill modules, the cooling tank and the circuit board modules form a gap, which is filled with coolant to dissipate heat from the plurality of circuit board modules; each of the plurality of circuit board modules comprises a circuit board, a plurality of electronic components are mounted on each of the circuit boards, and each of the first fill modules defines a plurality of through holes to receive the electronic components.

2 . The cooling device of claim 1 , wherein each of the plurality of first fill modules is a plate, and the plate occupies a volume of a space of the cooling tank.

3 . The cooling device of claim 1 , wherein each of the plurality of circuit board modules further comprises support plate to mount the circuit board, each circuit board is mounted between corresponding support plate and the corresponding first fill module, and a handle is mounted on a top portion of each support plate.

4 . (canceled)

5 . The cooling device of claim 3 , wherein a top portion of the cooling tank defines an opening to receive the handle of each support plate.

6 . The cooling device of claim 1 , wherein the fill unit further comprises a plurality of second fill modules, and the plurality of second fill modules are abreast located in one side of the plurality of circuit board modules.

7 . The cooling device of claim 6 , wherein each of the plurality of second fill modules is a plate, and the plate occupies a volume of a space of the cooling tank.

8 . The cooling device of claim 6 , wherein a handle is mounted on each of the second fill modules.

9 . The cooling device of claim 1 , wherein the fill unit further comprises a plurality of second fill modules, and the circuit board modules and the second fill modules are spaced from each other.

Assignees

• Hon Hai Prec Ind Co Ltd

Inventors

• Chen Chin-Hui
• Lee Chia-Yun
• Yang Cheng-Hsiu
• Tsai Yueh-Lin

Classifications

• H05K7/20636

  within sub-racks for removing heat from electronic boards · CPC title

• H05K1/0203

  Cooling of mounted components (H05K1/0272 takes precedence) · CPC title

• H05K7/20218 Primary

  using a liquid coolant without phase change in electronic enclosures (in cabinets of standardized dimensions H05K7/20536; in server cabinets H05K7/20709; in vehicle electronic casings H05K7/20845; in power control electronics H05K7/2089; in displays H05K7/20954) · CPC title

• H05K7/20254

  Cold plates transferring heat from heat source to coolant · CPC title

• H05K7/20236 Primary

  by immersion · CPC title