Package manufacturing method, light emitting device manufacturing method, package, and light emitting device

Patent metadata

Field	Value
Publication number	US-2017170367-A1
Application number	US-201615373345-A
Country	US
Kind code	A1
Filing date	Dec 8, 2016
Priority date	Dec 9, 2015
Publication date	Jun 15, 2017
Grant date	—

Abstract

A method for manufacturing a package includes the steps of; preparing a lead frame having a frame, a first electrode, a second electrode, a first connecting portion connecting the frame and the first electrode, and a second connecting portion connecting the frame and the second electrode; placing the lead frame in a mold; injecting a first resin into the mold from an inlet of the mold located adjacent to the first electrode to mold a flange portion and a wall portion of the package; and cutting the lead frame and a part of the flange portion located adjacent to the first electrode. In the step of injecting the first resin, the mold and the lead frame together provide a hollow space into which the first resin is injected and in which a part of the flange portion is formed so as to have a thickness different from a thickness of the lead frame.

First claim

1 . A method for manufacturing a package, comprising the steps of:
preparing a lead frame having a frame, a first electrode, a second electrode, a first connecting portion connecting the frame and the first electrode, and a second connecting portion connecting the frame and the second electrode; placing the lead frame in a mold; injecting a first resin into the mold from an inlet of the mold to mold a flange portion and a wall portion of the package, the inlet being located adjacent to the first electrode; and cutting the lead frame and a part of the flange portion, the part being located adjacent to the first electrode, wherein, in the step in which the flange portion is molded, the mold and the lead frame together provide a hollow space into which the first resin is injected and in which a part of the flange portion is formed, and wherein the part of the flange portion formed in the hollow space has a thickness different from a thickness of the lead frame.

2 . A method for manufacturing a package, comprising the steps of:
preparing a lead frame having a package formation region in which a first electrode and a second electrode are located, the second electrode being distinct from the first electrode; sandwiching the first electrode and the second electrode between an upper mold and a lower mold which constitute a mold having an inlet formed at a location outside of the package formation region and adjacent to the first electrode; injecting a first resin from the inlet into the mold in which the first electrode and the second electrode have been sandwiched between the upper mold and the lower mold; curing or solidifying the injected first resin; and after curing or solidifying the injected first resin, removing an injection flow mark of the first resin formed adjacent to the first electrode and cutting the lead frame to singulate a package, wherein, in the step of injecting the first resin, the upper mold, the lower mold, and the lead frame together provide a hollow space into which the first resin is injected and in which a part of the flange portion is formed, and wherein the part of the flange portion formed in the hollow space has a thickness different from a thickness of the lead frame.

3 . A method for manufacturing a package according to claim 1 ,
wherein the lead frame has a first through-hole between the first electrode and the first connecting portion and has a second through-hole between the second electrode and the second connecting portion.

4 . A method for manufacturing a package according to claim 3 ,
wherein, in the package, the first electrode has a first inner lead portion and a first outer lead portion, to which first outer lead portion the first through-hole partially belongs, and wherein, in the package, the second electrode has a second inner lead portion and a second outer lead portion, to which second outer lead portion the second through-hole partially belongs.

5 . A method for manufacturing a package according to claim 1 ,
wherein the prepared lead frame has a first through-opening located adjacent to the first electrode or the first connecting portion and the first resin is injected through the first through-opening.

6 . A method for manufacturing a package according to claim 1 ,
wherein the first electrode and the second electrode of the prepared lead frame are spaced apart from each other.

7 . A method for manufacturing a package according to claim 1 ,
wherein the mold has a recessed portion that corresponds to the wall portion formed on the first electrode and the second electrode, and the first resin is injected into the recessed portion.

8 . A method for manufacturing a package according to claim 1 ,
wherein the wall portion formed by molding the first resin with the mold constitutes side walls of a bottomed recess that fixes the first electrode and the second electrode and has a bottom at least a part of which is composed of the first electrode and the second electrode, and wherein the flange portion formed by molding the first resin with the mold projects outwardly from the wall portion and has a part located adjacent to the first outer lead portion in plan view and having a thickness different from a thickness of the first outer lead portion.

9 . A method for manufacturing a package according to claim 1 ,
wherein the step of injecting the first resin is carried out by transfer molding or injection molding.

10 . A method for manufacturing a package according to claim 1 ,
wherein the first resin has been blended with a light reflecting material.

11 . A method for manufacturing a light emitting device, comprising:
the steps of the method for manufacturing a package according to claim 1 ; and a step of mounting a light emitting element on the first electrode or the second electrode, the step of mounting the light emitting element being carried out after the step of curing or solidifying the injected first resin and before or after the step of removing the injection flow mark of the first resin.

12 . A method for manufacturing a light emitting device according to claim 11 ,
further comprising a step of applying a second resin into the package to seal the light emitting element, the step of applying the second resin being carried out after the step of mounting the light emitting element.

13 . A package having a bottomed recess with a bottom portion, comprising:
a first electrode having a first outer lead portion and disposed in the bottom portion; a second electrode having a second outer lead portion and disposed in the bottom portion; and a first resin fixing the first electrode and the second electrode and constituting a part of the bottomed recess, wherein the first resin has: a part between the first electrode and the second electrode disposed in the bottom portion; a wall portion constituting side walls of the bottomed recess; and a flange portion having a first part located adjacent to at least one of both sides of the first outer lead portion in plan view, the first part having a thickness different from a thickness of the first outer lead portion.

14 . A package according to claim 13 ,
wherein, in plan view, the bottomed recess has: a first outer side; a second outer side adjacent to the first outer side; a third outer side adjacent to the second outer side and opposite to the first outer side; and a fourth outer side adjacent to the first outer side and the third outer side, wherein the first outer lead portion is located at the first outer side, and wherein the second outer lead portion is located at the third outer side.

15 . A package according to claim 13 ,
wherein the first part of the flange portion has a thickness of 1.2 to 2.0 times the thickness of the first outer lead portion.

16 . A package according to claim 13 ,
wherein the first part of the flange portion has a portion having a thickness of 1.2 to 2.0 times the thickness of the first outer lead portion and a portion having a same thickness as the thickness of the first outer lead portion.

17 . A package according to claim 13 ,
wherein the first part of the flange portion has a thickness of 0.5 to 0.8 times the thickness of the first outer lead portion.

18 . A package according to claim 13 ,
wherein the first part of the flange portion has a portion having a thickness of 0.5 to 0.8 times the thickness of the first outer lead portion and a portion having a same thickness as the thickness of the first outer lead portion.

19 . A package according

Assignees

• Nichia Corp

Inventors

• Fukuda Mayumi
• Kishimoto Tomohisa

Classifications

• B29C45/14655

  connected to or mounted on a carrier, e.g. lead frame · CPC title

• B29C45/14065

  Positioning or centering articles in the mould · CPC title

• B29C41/00

  Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor (with compacting pressure B29C43/00 {; by lay-up of reinforcement of substantial or continuous length B29C70/30}) · CPC title

• B29C33/12

  with incorporated means for positioning inserts, e.g. labels {(positioning reinforcements B29C70/541)} · CPC title

• H01L2933/0066

  Electricity · mapped topic