Method for manufacturing a silicon carbide semiconductor element
US-2015380248-A1 · Dec 31, 2015 · US
Material thickness device and method
US2017170080A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2017170080-A1 |
| Application number | US-201514968401-A |
| Country | US |
| Kind code | A1 |
| Filing date | Dec 14, 2015 |
| Priority date | Dec 14, 2015 |
| Publication date | Jun 15, 2017 |
| Grant date | — |
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- Title
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Abstract
Official abstract text for this publication.
A material thickness adjustment device and associated methods are shown. Material thickness adjustment devices and methods shown include eddy current measurement to determine material thickness during a deposition or removal operation. Feedback from the measured thickness may then be applied to adjust one or more processing parameters to meet a desired thickness.
First claim
Opening claim text (preview).
1 - 12 . (canceled) 13 . A conductor material coating adjustment device, comprising: a conductor material coating thickness adjustor; an eddy current thickness measurement device; and a feedback circuit adapted to use data from the eddy current thickness measurement device adjust one or more parameters of the conductor material coating thickness adjustor. 14 . The conductor material coating adjustment device of claim 13 , wherein the adjustor includes a deposition device. 15 . The conductor material coating adjustment device of claim 14 , wherein the adjustor includes an electroless deposition device. 16 . The conductor material coating adjustment device of claim 13 , wherein the adjustor includes a sputter deposition device. 17 . The conductor material coating adjustment device of claim 13 , wherein adjustor includes a removal device. 18 . The conductor material coating adjustment device of claim 13 , wherein the feedback circuit is adapted to adjust a time duration of the conductor material coating thickness adjustor. 19 . The conductor material coating adjustment device of claim 13 , wherein the feedback circuit is adapted to adjust an electroless plating chemistry of the conductor material coating thickness adjustor. 20 . The conductor material coating adjustment device of claim 13 , wherein the conductor material coating thickness adjustor includes a copper coating thickness adjustor.
Assignees
Inventors
Classifications
Electrical properties, e.g. testing or measuring of resistance, deep levels or capacitance-voltage characteristics · CPC title
Process monitoring, e.g. flow or thickness monitoring · CPC title
Subject matter not provided for in other groups of this subclass · CPC title
of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04) · CPC title
- H10P74/238Primary
comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement · CPC title
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Frequently asked questions
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- What does patent US2017170080A1 cover?
- A material thickness adjustment device and associated methods are shown. Material thickness adjustment devices and methods shown include eddy current measurement to determine material thickness during a deposition or removal operation. Feedback from the measured thickness may then be applied to adjust one or more processing parameters to meet a desired thickness.
- Who is the assignee on this patent?
- Intel Corp
- What technology area does this patent fall under?
- Primary CPC classification H10P74/238. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Jun 15 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).