Laser reseal including an additional layer and alloy formation

US2017158496A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2017158496-A1
Application numberUS-201615357074-A
CountryUS
Kind codeA1
Filing dateNov 21, 2016
Priority dateDec 8, 2015
Publication dateJun 8, 2017
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method for manufacturing a micromechanical component including a substrate and a cap, which is connected to the substrate and, together with the substrate, encloses a cavity, a pressure prevailing and gas mixture having a chemical composition being enclosed in the cavity. An access opening connecting the to surroundings of the micromechanical component is formed in the substrate or in the cap. The pressure and/or chemical composition are/is adjusted in the cavity. The access opening is sealed by introducing energy or heat into an absorbing part of the substrate or of the cap with the aid of a laser. A layer is deposited on or grown on a surface of the substrate or of the cap in the area of the access opening for mixing with a material area of the substrate or of the cap, which is converted into a liquid aggregate state.

First claim

Opening claim text (preview).

What is claimed is: 1 . A method for manufacturing a micromechanical component including a substrate, and a cap which is connected to the substrate, and, together with the substrate, encloses a first cavity, a first pressure prevailing and a first gas mixture having a first chemical composition being enclosed in the first cavity, the method comprising: in a first method step, forming, in one of the substrate or the cap, an access opening connecting the first cavity to surroundings of the micromechanical component; in a second method step, adjusting at least one of the first pressure and the first chemical composition in the first cavity; in a third method step, sealing the access opening by introducing energy or heat into an absorbing part of the substrate or the cap, with the aid of a laser; and in a fourth method step, depositing or growning a layer on a surface of the substrate or of the cap in the area of the access opening for mixing with a material area of the substrate or of the cap, which is converted into a liquid aggregate state in the third method step. 2 . The method as recited in claim 1 , wherein the layer is deposited on or grown on a surface of the substrate or of the cap, which faces away from the first cavity. 3 . The method as recited in claim 1 , wherein the fourth method step is carried out chronologically before the first method step. 4 . A micromechanical component, comprising: a substrate; a cap connected to the substrate, the cap, together with the substrate, enclosing a first cavity, a first pressure prevailing and a first gas mixture having a first chemical composition being enclosed in the first cavity, the substrate or the cap including a sealed access opening; and a layer deposited on or grown on a surface of the substrate or of the cap in the area of the access opening, which is at least partially mixed with a material area of the substrate or of the cap, which is converted into a liquid aggregate state during the sealing of the access opening. 5 . The micromechanical component as recited in claim 4 , wherein the layer is situated on a surface of the substrate or of the cap, which faces away from the first cavity. 6 . The micromechanical component as recited in claim 4 , wherein a melting temperature of the layer is lower than at least one of: a melting temperature of the material area, a melting temperature of the substrate, and a melting temperature of the cap. 7 . The micromechanical component as recited in claim 6 , wherein a melting temperature of a mixed material including at least partially the layer and at least partially the material area is lower than at least one of: the melting temperature of the layer, the melting temperature of the material area, the melting temperature of the substrate, and the melting temperature of the cap. 8 . The micromechanical component as recited in claim 4 , wherein an expansion coefficient of the layer is lower than at least one of: an expansion coefficient of the material area, an expansion coefficient of the substrate, and an expansion coefficient of the cap. 9 . The micromechanical component as recited in claim 8 , wherein the cap, together with the substrate, enclose a second cavity, a second pressure prevailing and a second gas mixture having a second chemical composition being enclosed in the second cavity. 10 . The micromechanical component claim 9 , wherein the first pressure is lower than the second pressure, a first sensor unit for rotation rate measurement being situated in the first cavity and a second sensor unit for acceleration measurement being situated in the second cavity.

Assignees

Inventors

Classifications

  • Cavities · CPC title

  • Gyroscopes · CPC title

  • maintaining a controlled atmosphere with processes not provided for in B81C1/00285 · CPC title

  • characterised by the material or arrangement of seals between parts · CPC title

  • Hermetically sealing an opening in the lid · CPC title

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Frequently asked questions

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What does patent US2017158496A1 cover?
A method for manufacturing a micromechanical component including a substrate and a cap, which is connected to the substrate and, together with the substrate, encloses a cavity, a pressure prevailing and gas mixture having a chemical composition being enclosed in the cavity. An access opening connecting the to surroundings of the micromechanical component is formed in the substrate or in the cap…
Who is the assignee on this patent?
Bosch Gmbh Robert
What technology area does this patent fall under?
Primary CPC classification B81C1/00293. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Thu Jun 08 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).