Component including two semiconductor elements, between which at least two hermetically sealed cavities are formed and method for establishing a corresponding bonding connection between two semiconductor elements
US-2015353347-A1 · Dec 10, 2015 · US
US2017158496A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2017158496-A1 |
| Application number | US-201615357074-A |
| Country | US |
| Kind code | A1 |
| Filing date | Nov 21, 2016 |
| Priority date | Dec 8, 2015 |
| Publication date | Jun 8, 2017 |
| Grant date | — |
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A method for manufacturing a micromechanical component including a substrate and a cap, which is connected to the substrate and, together with the substrate, encloses a cavity, a pressure prevailing and gas mixture having a chemical composition being enclosed in the cavity. An access opening connecting the to surroundings of the micromechanical component is formed in the substrate or in the cap. The pressure and/or chemical composition are/is adjusted in the cavity. The access opening is sealed by introducing energy or heat into an absorbing part of the substrate or of the cap with the aid of a laser. A layer is deposited on or grown on a surface of the substrate or of the cap in the area of the access opening for mixing with a material area of the substrate or of the cap, which is converted into a liquid aggregate state.
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What is claimed is: 1 . A method for manufacturing a micromechanical component including a substrate, and a cap which is connected to the substrate, and, together with the substrate, encloses a first cavity, a first pressure prevailing and a first gas mixture having a first chemical composition being enclosed in the first cavity, the method comprising: in a first method step, forming, in one of the substrate or the cap, an access opening connecting the first cavity to surroundings of the micromechanical component; in a second method step, adjusting at least one of the first pressure and the first chemical composition in the first cavity; in a third method step, sealing the access opening by introducing energy or heat into an absorbing part of the substrate or the cap, with the aid of a laser; and in a fourth method step, depositing or growning a layer on a surface of the substrate or of the cap in the area of the access opening for mixing with a material area of the substrate or of the cap, which is converted into a liquid aggregate state in the third method step. 2 . The method as recited in claim 1 , wherein the layer is deposited on or grown on a surface of the substrate or of the cap, which faces away from the first cavity. 3 . The method as recited in claim 1 , wherein the fourth method step is carried out chronologically before the first method step. 4 . A micromechanical component, comprising: a substrate; a cap connected to the substrate, the cap, together with the substrate, enclosing a first cavity, a first pressure prevailing and a first gas mixture having a first chemical composition being enclosed in the first cavity, the substrate or the cap including a sealed access opening; and a layer deposited on or grown on a surface of the substrate or of the cap in the area of the access opening, which is at least partially mixed with a material area of the substrate or of the cap, which is converted into a liquid aggregate state during the sealing of the access opening. 5 . The micromechanical component as recited in claim 4 , wherein the layer is situated on a surface of the substrate or of the cap, which faces away from the first cavity. 6 . The micromechanical component as recited in claim 4 , wherein a melting temperature of the layer is lower than at least one of: a melting temperature of the material area, a melting temperature of the substrate, and a melting temperature of the cap. 7 . The micromechanical component as recited in claim 6 , wherein a melting temperature of a mixed material including at least partially the layer and at least partially the material area is lower than at least one of: the melting temperature of the layer, the melting temperature of the material area, the melting temperature of the substrate, and the melting temperature of the cap. 8 . The micromechanical component as recited in claim 4 , wherein an expansion coefficient of the layer is lower than at least one of: an expansion coefficient of the material area, an expansion coefficient of the substrate, and an expansion coefficient of the cap. 9 . The micromechanical component as recited in claim 8 , wherein the cap, together with the substrate, enclose a second cavity, a second pressure prevailing and a second gas mixture having a second chemical composition being enclosed in the second cavity. 10 . The micromechanical component claim 9 , wherein the first pressure is lower than the second pressure, a first sensor unit for rotation rate measurement being situated in the first cavity and a second sensor unit for acceleration measurement being situated in the second cavity.
Cavities · CPC title
Gyroscopes · CPC title
maintaining a controlled atmosphere with processes not provided for in B81C1/00285 · CPC title
characterised by the material or arrangement of seals between parts · CPC title
Hermetically sealing an opening in the lid · CPC title
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