Light-emitting assembly

Patent metadata

Field	Value
Publication number	US-2017148964-A1
Application number	US-201615293298-A
Country	US
Kind code	A1
Filing date	Oct 14, 2016
Priority date	Nov 23, 2015
Publication date	May 25, 2017
Grant date	—

Abstract

A light-emitting assembly includes a first substrate, a first electrode layer, a light-emitting layer, a second electrode layer, a second substrate, a first conductive member and a second conductive member. The first electrode layer, the light-emitting layer and the second electrode layer are sequentially disposed on the first substrate. An area of the second electrode layer is entirely located within an area of the light emitting layer. The second electrode layer is located between the second substrate and the light-emitting layer. The first and second conductive members are disposed between the first and second substrates. The first electrode layer is electrically connected to a first circuit on the second substrate through the first conductive member. The second electrode layer is electrically connected to a second circuit on the second substrate through the second conductive member. The second conductive member is located within the area of the second electrode layer.

First claim

What is claimed is:

1 . A light-emitting assembly, comprising:
a first substrate; a first electrode layer, disposed on the first substrate; a light-emitting layer, disposed on the first electrode layer; a second electrode layer, disposed on the light-emitting layer, wherein an area of the second electrode layer is entirely located within an area of the light-emitting layer; a second substrate, having a barrier metal layer, a first circuit and a second circuit, wherein the second electrode layer is located between the second substrate and the light-emitting layer, the barrier metal layer is disposed between the second circuit and the second electrode layer, and an area of the barrier metal layer covers the area of the light emitting layer; a first conductive member, disposed between the first substrate and the second substrate, wherein the first electrode layer is electrically connected to the first circuit on the second substrate through the first conductive member; and a second conductive member, disposed between the first substrate and the second substrate, wherein the second electrode layer is electrically connected to the second circuit on the second substrate through the second conductive member, and the second conductive member is located within the area of the second electrode layer.

2 . The light-emitting assembly as claimed in claim 1 , wherein a sheet resistance of at least one of the first conductive member and the second conductive member is smaller than or equal to 100 ohm/square unit.

3 . The light-emitting assembly as claimed in claim 1 , wherein a water vapour transmission rate of at least one of the first conductive member and the second conductive member is smaller than or equal to 10 −2 g/m 2 /day.

4 . The light-emitting assembly as claimed in claim 1 , further comprising:
a sealing layer, disposed between the second electrode layer and the second substrate, wherein the second conductive member is surrounded by the sealing layer.

5 . The light-emitting assembly as claimed in claim 4 , further comprising:
a moisture barrier layer, wherein the light-emitting layer and the second electrode layer are wrapped between the moisture barrier layer and the first electrode layer, wherein the second conductive member penetrates through the moisture barrier layer to electrically connect the second electrode layer.

6 . The light-emitting assembly as claimed in claim 4 , wherein the second conductive member comprises a plurality of conductive patterns, and the second electrode layer comprises a plurality of electrode patterns independent to each other in contours, and the conductive patterns are respectively connected to the electrode patterns.

7 . The light-emitting assembly as claimed in claim 6 , wherein the conductive patterns are electrically connected to each other through the second circuit.

8 . The light-emitting assembly as claimed in claim 4 , wherein a material of the sealing layer comprises at least one of a photo curable material, a heat curable material, and a pressure curable material.

9 . The light-emitting assembly as claimed in claim 4 , wherein the barrier metal layer contacts the sealing layer.

10 . The light-emitting assembly as claimed in claim 9 , wherein the barrier metal layer has an opening corresponding to the second conductive member, the second circuit has a protrusion portion extended to the opening, such that the second conductive member is electrically connected to the protrusion portion in the opening, and the barrier metal layer is electrically isolated to the second circuit and electrically isolated to the second conductive member.

11 . The light-emitting assembly as claimed in claim 9 , wherein the barrier metal layer is connected to a ground potential.

12 . The light-emitting assembly as claimed in claim 4 , wherein the sealing layer has at least one opening, and the second conductive member is located in the at least one opening.

13 . The light-emitting assembly as claimed in claim 12 , wherein a gap is formed between the sealing layer and the second conductive member located in the at least one opening.

14 . The light-emitting assembly as claimed in claim 1 , wherein the second substrate further comprises at least one heat conducting pattern, the at least one heat conducting pattern is connected to the second circuit, and the second circuit is located between the heat conducting pattern and the second conductive member.

15 . The light-emitting assembly as claimed in claim 1 , wherein an area of the first electrode layer is greater than the area of the second electrode layer, and the first electrode layer extends outward from the second electrode layer to define a peripheral region, and the first conductive member is located at the peripheral region.

16 . The light-emitting assembly as claimed in claim 1 , wherein the second substrate comprises an insulating matrix, and the first circuit and the second circuit are embedded in the insulating matrix.

17 . The light-emitting assembly as claimed in claim 1 , wherein at least one of the first conductive member and the second conductive member is composed of a conductive package adhesive layer, and the conductive package adhesive layer comprises a matrix and a plurality of conductive particles doped in the matrix.

18 . The light-emitting assembly as claimed in claim 17 , wherein the conductive particles comprise at least one of conductive polymers, metal particles, carbon, and conductive fiber.

19 . The light-emitting assembly as claimed in claim 17 , wherein the conductive particles comprise anisotropic conductive particles.

20 . The light-emitting assembly as claimed in claim 17 , further comprising:
a lateral package adhesive layer, located between the second substrate and the first electrode layer, and sealing sidewalls of the light-emitting layer and the second electrode layer.

21 . The light-emitting assembly as claimed in claim 17 , wherein the conductive package adhesive layer comprises a first conductive package adhesive pattern serving as the first conductive member and a second conductive package adhesive pattern serving as the second conductive member, and a gap is formed between the first conductive package adhesive pattern and the second conductive package adhesive pattern.

22 . The light-emitting assembly as claimed in claim 21 , further comprising:
a package adhesive pattern, disposed in the gap, and having an insulation property, and a material of the package adhesive pattern comprising a material of the matrix.

23 . The light-emitting assembly as claimed in claim 1 , further comprising:
a first conductive bonding member and a second conductive bonding member, wherein the first conductive bonding member is disposed between the first conductive member and the first electrode layer, the second conductive bonding member is disposed between the second conductive member and the second electrode layer, and a gap exists between the first conductive bonding member and the light-emitting layer, and the first conductive bonding member and the second conductive bonding member respectively comprise a conductive adhesive or a solder paste.

24 . A light-emitting assembly, comprising:
a first substrate; a first electrode layer, disposed on the first substrate; a light-emitting layer, disposed on the first electrode layer; a second electrode layer, disposed on the light-emitting layer, where

Assignees

• Ind Tech Res Inst

Inventors

• Chen Hsin-Chu
• Yeh Wen-Yung
• Lin Hsuan-Yu
• Liu Chun-Ting
• LIU Wen-hong

Classifications

• H10K50/88

  Terminals, e.g. bond pads · CPC title

• H10H20/857

  Interconnections, e.g. lead-frames, bond wires or solder balls · CPC title

• H10K50/805 Primary

  Electrodes · CPC title

• H01L33/62 Primary

  Electricity · mapped topic

• H01L33/52

  Electricity · mapped topic