Manufacturing method of surface mounted inductor

Patent metadata

Field	Value
Publication number	US-2017125166-A1
Application number	US-201715407690-A
Country	US
Kind code	A1
Filing date	Jan 17, 2017
Priority date	Jul 18, 2014
Publication date	May 4, 2017
Grant date	—

Abstract

A manufacturing method of a surface mounted inductor involves using a coil and a tablet in a molding die. The coil is placed on the tablet. The coil and the tablet are arranged in the molding die and pressurized and compressed to the size of the cavity in the molding die at a first temperature. The coil and the tablet are pressurized in the molding die at a second temperature higher than the first temperature to form a formed body incorporating the coil.

First claim

1 . A manufacturing method of a surface mounted inductor obtained by sealing a coil with a sealing material containing a resin and a filler using at least one molding die, the method comprising:
a first step in which, using a coil formed by winding a conductive wire so that lead-out ends are positioned at an outer periphery of a wound portion, and a tablet having a positioning mechanism and formed so that a size in one direction perpendicular to a winding axis of the coil is larger than a cavity in the at least one molding die, the coil is placed on the tablet, the coil and the tablet are arranged in the molding die so that one of the lead-out ends of the coil is placed along an outer side surface of the tablet to be interposed between the outer side surface of the tablet and an inner wall surface of the at least one molding die, and a portion of the tablet, which is formed larger than the cavity in the at least one molding die, is pressurized and compressed to the size of the cavity in the at least one molding die at a first temperature; and a second step in which the coil and the tablet are pressurized in the at least one molding die at a second temperature higher than the first temperature to form a formed body incorporating the coil.

2 . The manufacturing method of a surface mounted inductor according to claim 1 , wherein, in the first step, after another tablet is placed on the tablet on which the coil is placed, portions of the tablets, which are each formed larger than the cavity in the at least one molding die, are pressurized and compressed to the size of the cavity in the at least one molding die at the first temperature.

3 . The manufacturing method of a surface mounted inductor according to claim 1 , wherein, in the second step, after another tablet is placed on the coil and the tablet obtained in the first step, the tablets are pressurized in the at least one molding die at the second temperature higher than the first temperature to form a formed body incorporating the coil.

4 . The manufacturing method of a surface mounted inductor according to claim 1 , wherein, in the second step, the coil and the tablet are pressurized in a direction horizontal to the winding axis of the coil in the at least one molding die.

5 . The manufacturing method of a surface mounted inductor according to claim 2 , wherein, in the second step, the portions of the tablets are pressurized in a direction horizontal to the winding axis of the coil in the at least one molding die.

6 . The manufacturing method of a surface mounted inductor according to claim 3 , wherein, in the second step, the tablets are pressurized in a direction horizontal to the winding axis of the coil in the at least one molding die.

7 . The manufacturing method of a surface mounted inductor according to claim 1 , wherein the at least one molding die used in the first step and the at least one molding die used in the second step are the same.

8 . The manufacturing method of a surface mounted inductor according to claim 1 , wherein the at least one molding die used in the first step and the at least one molding die used in the second step are different.

9 . A manufacturing method of a surface mounted inductor obtained by sealing a coil with a sealing material containing a resin and a filler using at least one molding die, the method comprising:
a first step in which, using a coil formed by winding a conductive wire so that lead-out ends of the coil are positioned at an outer periphery of a wound portion, and a tablet having a positioning mechanism and formed so that a distance between two side surfaces, which are each perpendicular to a side surface from which one of the lead-out ends of the coil is led out, as well as each being parallel to a winding axis, is larger than a cavity in the at least one molding die, the coil is placed on the tablet, the coil and the tablet are arranged in the at least one molding die so that the one lead-out end of the coil is placed along an outer side surface of the tablet to be interposed between the outer side surface of the tablet and an inner wall surface of the at least one molding die, and the two side surfaces of the tablet, which are each perpendicular to the side surface from which the one lead-out end of the coil is led out, as well as each being parallel to the winding axis, are pressurized and compressed at a first temperature so that the distance between the two side surfaces, which are each perpendicular to the side surface from which the one lead-out end of the coil is led out, as well as each being parallel to the winding axis, is compressed to the size of the cavity in the at least one molding die; and a second step in which the coil and the tablet are pressurized in the at least one molding die at a second temperature higher than the first temperature to form a formed body incorporating the coil.

10 . The manufacturing method of a surface mounted inductor according to claim 9 , wherein, in the first step, after another tablet is placed on the tablet on which the coil is placed, the two side surfaces of each tablet, which are each perpendicular to the side surface from which the one lead-out end of the coil is led out, as well as each is parallel to the winding axis, are pressurized so that the distance between the two side surfaces, which are each perpendicular to the side surface from which the one lead-out end of the coil is led out, as well as each is parallel to the winding axis, is compressed to the size of the cavity in the at least one molding die.

11 . The manufacturing method of a surface mounted inductor according to claim 9 , wherein, in the second step, after another tablet is placed on the coil and the tablet obtained in the first step, the tablets are pressurized in the at least one molding die at the second temperature higher than the first temperature to form a formed body incorporating the coil.

12 . The manufacturing method of a surface mounted inductor according to claim 9 , wherein, in the second step, the coil and the tablet are pressurized in a direction horizontal to the winding axis of the coil in the at least one molding die.

13 . The manufacturing method of a surface mounted inductor according to claim 10 , wherein, in the second step, the tablets are pressurized in a direction horizontal to the winding axis of the coil in the at least one molding die.

14 . The manufacturing method of a surface mounted inductor according to claim 11 , wherein, in the second step, the tablets are pressurized in a direction horizontal to the winding axis of the coil in the at least one molding die.

15 . The manufacturing method of a surface mounted inductor according to claim 9 , wherein the at least one molding die used in the first step and the at least one molding die used in the second step are the same.

16 . The manufacturing method of a surface mounted inductor according to claim 9 , wherein the at least one molding die used in the first step and the at least one molding die used in the second step are different.

Assignees

• Murata Manufacturing Co

Inventors

• Muneuchi Keita
• Murakami Makoto

Classifications

• H01F41/06 Primary

  Coil winding · CPC title

• H01F41/0246

  Manufacturing of magnetic circuits by moulding or by pressing powder (magnetic cores made by moulding or by pressing powder H01F27/255; soft magnetic particles H01F1/20, H01F1/36) · CPC title

• H01F27/29

  Terminals; Tapping arrangements {for signal inductances} · CPC title

• H01F41/076 Primary

  Forming taps or terminals while winding, e.g. by wrapping or soldering the wire onto pins, or by directly forming terminals from the wire · CPC title

• H01F27/02

  Casings · CPC title