Photosensitive resin composition, wavelength conversion substrate and light emitting device

US2017123317A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2017123317-A1
Application numberUS-201515318034-A
CountryUS
Kind codeA1
Filing dateJun 12, 2015
Priority dateJun 13, 2014
Publication dateMay 4, 2017
Grant date

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  1. Title

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  5. First independent claim

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  6. CPC / IPC classifications

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Abstract

Official abstract text for this publication.

A photosensitive resin composition includes a positive photosensitive resin having a photosensitive moiety that cleaves upon exposure to light, and a wavelength conversion material dispersed in the photosensitive resin. The photosensitive resin and the wavelength conversion material meet (i) to (iv): (i) The photosensitive moiety and the cleavage product of the photosensitive resin do not neutralize the wavelength conversion material; (ii) The photosensitive moiety and the cleavage product do not induce hydrolysis of the wavelength conversion material; (iii) The HOMOs of the photosensitive moiety and the cleavage product are lower than the LUMO of the wavelength conversion material; and (iv) The LUMOs of the photosensitive moiety and the cleavage product are higher than the HOMO of the wavelength conversion material. (Any combination of a chemically amplified photosensitive resin with an acidic photosensitive moiety or cleavage product and an acidic wavelength conversion material is excluded.)

First claim

Opening claim text (preview).

1 . A photosensitive resin composition comprising: a positive photosensitive resin having a photosensitive moiety that cleaves upon exposure to light; and a wavelength conversion material dispersed in the photosensitive resin, wherein the photosensitive resin and the wavelength conversion material meet the following (i) to (iv): (i) the photosensitive moiety and a cleavage product of the photosensitive resin do not neutralize the wavelength conversion material; (ii) the photosensitive moiety and the cleavage product do not induce hydrolysis of the wavelength conversion material; (iii) HOMOs of the photosensitive moiety and the cleavage product are lower than a LUMO of the wavelength conversion material; and (iv) LUMOs of the photosensitive moiety and the cleavage product are higher than a HOMO of the wavelength conversion material (excluding any combination of a chemically amplified photosensitive resin with an acidic photosensitive moiety or cleavage product and an acidic wavelength conversion material). 2 . The photosensitive resin composition according to claim 1 , wherein the photosensitive moiety and the cleavage product of the photosensitive resin are neutral. 3 . The photosensitive resin composition according to claim 2 , wherein the photosensitive moiety of the photosensitive resin includes at least one selected from the group consisting of cyclobutane diimide, o-nitrobenzyl amide, o-nitrobenzyl ether, methyl phenyl carbonate, 1-benzyloxy-1-alkyl ethanol, and disilane structures. 4 . The photosensitive resin composition according to claim 3 , wherein the photosensitive moiety of the photosensitive resin is a cyclobutane diimide structure. 5 . The photosensitive resin composition according to claim 1 , wherein the wavelength conversion material has a proton-accepting or proton-donating group. 6 . The photosensitive resin composition according to claim 1 , wherein the wavelength conversion material has a dehydration-condensable group. 7 . The photosensitive resin composition according to claim 1 , wherein the wavelength conversion material has a coumarin or boron-dipyrromethene structure. 8 . The photosensitive resin composition according to claim 1 , wherein the photosensitive resin has transparency for light of a visible spectrum. 9 . The photosensitive resin composition according to claim 1 , further comprising a solvent that dissolves the photosensitive resin. 10 . A wavelength conversion substrate comprising: a substrate; and a wavelength conversion unit provided on the substrate, wherein the wavelength conversion unit is formed from a photosensitive resin composition according to claim 1 . 11 . A light emitting device comprising: a light source that emits excitation light; and a wavelength conversion unit that absorbs the excitation light and emits light of a wavelength different from a wavelength of the excitation light, wherein the wavelength conversion unit is formed from a photosensitive resin composition according to claim 1 . 12 . The light emitting device according to claim 11 , wherein the light emitting device includes a wavelength conversion substrate including: a substrate; and the wavelength conversion unit provided on the substrate. 13 . The light emitting device according to claim 12 , wherein the wavelength conversion substrate includes a structural body that abuts the wavelength conversion unit on at least one side thereof and reflects or diffuses the light emitted from the wavelength conversion unit. 14 . The light emitting device according to claim 13 , wherein the structural body is formed from a material including a metallic material. 15 . The light emitting device according to claim 11 , wherein the wavelength conversion unit exhibits an internal quantum yield for light emission of 80% or more. 16 . The light emitting device according to claim 11 , wherein the wavelength conversion substrate includes multiple wavelength conversion units arranged in a matrix, and the multiple wavelength conversion units have a density of 450 ppi or more.

Assignees

Inventors

Classifications

  • Mechanical Engineering · mapped topic

  • Electroluminescent [EL] light sources · CPC title

  • in the form of arrays · CPC title

  • G03F7/039Primary

    Macromolecular compounds which are photodegradable, e.g. positive electron resists (G03F7/075 takes precedence; macromolecular quinonediazides G03F7/023) · CPC title

  • Wavelength conversion means, e.g. by using luminescent material, fluorescent concentrators or up-conversion arrangements · CPC title

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What does patent US2017123317A1 cover?
A photosensitive resin composition includes a positive photosensitive resin having a photosensitive moiety that cleaves upon exposure to light, and a wavelength conversion material dispersed in the photosensitive resin. The photosensitive resin and the wavelength conversion material meet (i) to (iv): (i) The photosensitive moiety and the cleavage product of the photosensitive resin do …
Who is the assignee on this patent?
Sharp Kk
What technology area does this patent fall under?
Primary CPC classification G03F7/039. Mapped technology areas include Physics.
When was this patent published?
Publication date Thu May 04 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).