Electronic Device

Patent metadata

Field	Value
Publication number	US-2017102745-A1
Application number	US-201415311927-A
Country	US
Kind code	A1
Filing date	Jun 4, 2014
Priority date	Jun 4, 2014
Publication date	Apr 13, 2017
Grant date	—

Abstract

An electronic device is provided. The electronic device includes a heat emitting element, and the heat emitting element is disposed on a circuit board PCB. The electronic device further includes a heat pipe group. The heat pipe group includes at least two heat pipes, and the heat pipe group is located on the heat emitting element. The heat pipes in the heat pipe group have at least one different characteristic parameter. Optimal working regions of the heat pipes in the heat pipe group are different. When the heat pipes in the heat pipe group work in the corresponding optimal working regions, thermal resistance ranges of the at least two heat pipes in the heat pipe group are 0.05-1° C./W.

First claim

1 . An electronic device comprising:
a printed circuit board (PCB); a heat emitting element disposed on the PCB; and a heat pipe group located on the heat emitting element and comprising heat pipes, wherein the heat pipes have different characteristic parameters and optimal working regions. and thermal resistance ranges of the heat pipes are 0.05-1 degrees Celsius per watt (° C./W) when the heat pipes work in their optimal working regions.

2 . The electronic device of claim 1 , wherein the characteristic parameters are one or more of a pipe diameter, a capillary layer cross-sectional area, a working substance amount, a working substance type, a pipe material, or a pipe material thickness.

3 . The electronic device of claim 1 , further comprising a thermal interface material disposed between the heat emitting element and the heat pipe group.

4 . The electronic device of claim 1 , wherein the heat emitting element is a central processing unit (CPU), a graphics processing unit (GPU), or both a CPU and a GPU.

5 . The electronic device of claim 2 , wherein the heat pipe group comprises a first heat pipe and a second heat pipe, wherein the characteristic parameter is the pipe diameter, wherein the first heat pipe comprises a first pipe diameter and the second heat pipe comprises a second pipe diameter, and wherein the first heat pipe is a high-temperature efficient heat pipe and the second heat pipe is a low-temperature efficient heat pipe when the first pipe diameter is greater than the second pipe diameter.

6 . An electronic device comprising:
a printed circuit board (PCB); a heat emitting element disposed on the PCB; and a heat pipe located on the heat emitting element and comprising heat conduction paths, wherein the heat conduction paths have different characteristic parameters and optimal working regions, and thermal resistance ranges of the heat conduction paths are 0.05-1 degrees Celsius per watt (° C./W) when the heat conduction paths work in their optimal working regions.

7 . The electronic device of claim 6 , wherein the characteristic parameters are one or more of a diameter, a capillary layer cross-sectional area, a working substance amount, a working substance type, a pipe material, or a pipe material thickness.

8 . The electronic device of claim 6 , further comprising a thermal interface material disposed between the heat emitting element and the heat pipe.

9 . An electronic device comprising:
a printed circuit board (PCB) comprising a front side and a back side; a heat emitting element disposed on the front side; a first heat pipe disposed on the front side and connected to the heat emitting element; and a second heat pipe disposed on the back side and connected to the heat emitting element by using a thermally conductive metal, wherein the first heat pipe and the second heat pipe have different characteristic parameters and optimal working regions, and thermal resistance ranges of the first heat pipe and the second heat pipe are 0.05-1 degrees Celsius per watt (° C./W) when the first heat pipe and the second heat pipe work in their optimal working regions.

10 . The electronic device of claim 9 , wherein the first heat pipe is located on the heat emitting element, and wherein the electronic device further comprises a thermal interface material disposed between the first heat pipe and the heat emitting element.

11 . The electronic device of claim 9 , wherein the characteristic parameters are one or more of a pipe diameter, a capillary layer cross-sectional area, a working substance amount, a working substance type, a pipe material, or a pipe material thickness.

12 . The electronic device of claim 2 , wherein the heat pipe group comprises a first heat pipe and a second heat pipe, wherein the characteristic parameter is the capillary layer cross-sectional area, wherein the first heat pipe comprises a first capillary layer cross-sectional area and the second heat pipe comprises a second capillary layer cross-sectional area, and wherein the first heat pipe is a high-temperature efficient heat pipe and the second heat pipe is a low-temperature efficient heat pipe when the first capillary layer cross-sectional area is greater than the second capillary layer cross-sectional area.

13 . The electronic device of claim 2 , wherein the heat pipe group comprises a first heat pipe and a second heat pipe, wherein the characteristic parameter is the working substance amount, wherein the first heat pipe comprises a first working substance amount and the second heat pipe comprises a second working substance amount, and wherein the first heat pipe is a high-temperature efficient heat pipe and the second heat pipe is a low-temperature efficient heat pipe when the first working substance amount is equal to or greater than a capillary requirement and the second working substance amount is less than the capillary requirement.

14 . The electronic device of claim 2 , wherein the heat pipe group comprises a first heat pipe and a second heat pipe, wherein the characteristic parameter is the working substance type, wherein the first heat pipe comprises a first latent heat of a first working substance type and the second heat pipe comprises a second latent heat of a second working substance type, and wherein the first heat pipe is a high-temperature efficient heat pipe and the second heat pipe is a low-temperature efficient heat pipe when the first latent heat is greater than the second latent heat.

15 . The electronic device of claim 9 , wherein the PCB comprises a thermally conductive copper layer that connects the first heat pipe to the heat emitting element.

Assignees

• Huawei Tech Co Ltd

Inventors

• Jin Linfang
• Hui Xiaowei
• Yang Xiangyang
• Zhou Shaoxin

Classifications

• G06F1/203

  for portable computers, e.g. for laptops · CPC title

• F28D15/0275

  Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores · CPC title

• G06F1/20 Primary

  Cooling means · CPC title

• H05K7/2039

  characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00) · CPC title

• H05K7/20336

  Heat pipes, e.g. wicks or capillary pumps · CPC title