Pressure sensor, acoustic microphone, blood pressure sensor, and touch panel

US2017102276A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2017102276-A1
Application numberUS-201615388629-A
CountryUS
Kind codeA1
Filing dateDec 22, 2016
Priority dateJun 12, 2013
Publication dateApr 13, 2017
Grant date

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

According to one embodiment, a pressure sensor includes a film part, and a sensing unit. A circumscribing rectangle circumscribing a configuration of a film surface of the film part has a first side, a second side, a third side connected to one end of the first side and one end of the second side, a fourth side connected to one other end of the first side and one other end of the second side, and a centroid of the circumscribing rectangle. The circumscribing rectangle includes a first region enclosed by the first side, line segments connecting the centroid to the one end of the first side, and to the one other end of the first side. The sensing unit includes sensing elements provided on a portion of the film surface overlapping the first region. Each sensing element includes a first, second magnetic layers, and a spacer layer.

First claim

Opening claim text (preview).

What is claimed is: 1 . A pressure sensor, comprising: a film part supported by a support unit, the film part being flexible, the film part having a film surface; and a sensing unit, a circumscribing rectangle configured to circumscribe a configuration of the film surface, the circumscribing rectangle having: a first side extending in a first direction, the first direction being along the film surface; a second side extending in the first direction to be separated from the first side; a third side extending in a second direction to be connected to one end of the first side and one end of the second side, the second direction being perpendicular to the first direction and being along the film surface; a fourth side extending in the second direction to be separated from the third side and connected to one other end of the first side and one other end of the second side; and a centroid of the circumscribing rectangle, the circumscribing rectangle including a first region, a second region, a third region, and a fourth region, the first region being enclosed by the first side, a first line segment and a second line segment, the first line segment connecting the centroid to the one end of the first side, the second line segment connecting the centroid to the one other end of the first side, the second region being enclosed by the second side, a third line segment and a fourth line segment, the third line segment connecting the centroid to the one end of the second side, the fourth line segment connecting the centroid to the one other end of the second side, the third region being enclosed by the third side, the first line segment and the third line segment, the fourth region being enclosed by the fourth side, the second line segment and the fourth line segment, the sensing unit including a first sensing group, a second sensing group, a third sensing group, and a fourth sensing group, the first sensing group being provided on a first portion of the film surface overlapping the first region, the second sensing group being provided on a second portion of the film surface overlapping the second region, the third sensing group being provided on a third portion of the film surface overlapping the third region. the fourth sensing group being provided on a fourth portion of the film surface overlapping the fourth region, the first sensing group including a plurality of first sensing elements, the second sensing group including a plurality of second sensing elements, the third sensing group including a plurality of third sensing elements, the fourth sensing group including a plurality of fourth sensing elements, a position of one of the first sensing elements in the first direction being different from a position of other one of the first sensing elements in the first direction, a position of one of the second sensing elements in the first direction being different from a position of other one of the second sensing elements in the first direction, a position of one of the third sensing elements in the second direction being different from a position of other one of the third sensing elements in the second direction, a position of one of the fourth sensing elements in the second direction being different from a position of other one of the fourth sensing elements in the second direction, the first sensing elements being connected in series with each other, the second sensing elements being connected in series with each other, the third sensing elements being connected in series with each other, the fourth sensing elements being connected in series with each other, each of the first sensing elements, the second sensing elements, the third sensing elements, and the fourth sensing elements including a first magnetic layer, a second magnetic layer provided between the first magnetic layer and the film part, and a spacer layer provided between the first magnetic layer and the second magnetic layer, a first end of the first sensing group being connected with a first node of a bridge circuit, a second end of the first sensing group being connected with a second node of the bridge circuit, a third end of the second sensing group being connected with a third node of the bridge circuit, a fourth end of the second sensing group being connected with a fourth node of the bridge circuit, a fifth end of the third sensing group being connected with the second node, a sixth end of the third sensing group being connected with the third node, a seventh end of the fourth sensing group being connected with the first node, an eighth end of the fourth sensing group being connected with the fourth node. 2 . The sensor according to claim 1 , wherein a first length of the film part in the first direction is longer than a second length of the film part in the second direction, the first side has the first length, the second side has the first length, the third side has the second length, and the fourth side has the second length. 3 . The sensor according to claim 1 , wherein the film surface has a central portion, and a peripheral portion provided around the central portion, and the first sensing elements, the second sensing elements, the third sensing elements, and the fourth elements are provided on the peripheral portion. 4 . The sensor according to claim 3 , wherein the configuration of the film surface has the first side, the second side, the third side, and the fourth side. 5 . The sensor according to claim 3 , wherein the configuration of the film surface is a flattened circle having the first direction as a major axis and the second direction as a minor axis. 6 . The sensor according to claim 2 , wherein a ratio of the second length to the first length is not less than 0.25 and less than 1.0. 7 . The sensor according to claim 2 , wherein a ratio of the second length to the first length is not less than 0.64 and less than 1.0. 8 . The sensor according to claim 2 , wherein a ratio of the second length to the first length is not more than 0.25. 9 . The sensor according to claim 1 , wherein the first magnetic layer is a magnetization free layer, and a magnetization direction of the magnetization free layer in a state in which an external pressure is not applied is different from the first direction and different from the second direction. 10 . The sensor according to claim 1 , wherein the first magnetic layer is a magnetization free layer, and the second magnetic layer is a magnetization fixed layer. 11 . The sensor according to claim 1 , wherein a length of the one of the first sensing elements in the first direction is not less than 0.1 micrometers and not more than 50 micrometers. 12 . The sensor according to claim 1 , further comprising the bridge circuit. 13 . An acoustic microphone including the pressure sensor according to claim 1 . 14 . A blood pressure sensor including the pressure sensor according to claim 1 . 15 . A touch panel including the pressure sensor according to claim 1 .

Assignees

Inventors

Classifications

  • using variations in ohmic resistance · CPC title

  • G01L1/2287Primary

    constructional details of the strain gauges (adjustable resistors H01C10/00) · CPC title

  • using distributed sensing elements · CPC title

  • involving simple electrical bridges · CPC title

  • Diaphragms for electromechanical transducers (in general F16J3/00); Cones (for musical instruments G10 ){(cones, diaphragms or the like, for emitting or receiving sound in general G10K13/00; Mounting thereof)} · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US2017102276A1 cover?
According to one embodiment, a pressure sensor includes a film part, and a sensing unit. A circumscribing rectangle circumscribing a configuration of a film surface of the film part has a first side, a second side, a third side connected to one end of the first side and one end of the second side, a fourth side connected to one other end of the first side and one other end of the second side, a…
Who is the assignee on this patent?
Toshiba Kk
What technology area does this patent fall under?
Primary CPC classification G01L1/2287. Mapped technology areas include Physics.
When was this patent published?
Publication date Thu Apr 13 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).