Electronic Component and Process of Producing Electronic Component

Patent metadata

Field	Value
Publication number	US-2017100744-A1
Application number	US-201514881051-A
Country	US
Kind code	A1
Filing date	Oct 12, 2015
Priority date	Oct 12, 2015
Publication date	Apr 13, 2017
Grant date	—

Abstract

Electronic components and processes of producing electronic components are disclosed. The electronic component includes a substrate, a first layer on the substrate, a rapidly solidified layer on the first layer and a conductive layer positioned on the rapidly solidified layer. The rapidly solidified layer includes a metastable phase.

First claim

1 . An electronic component, comprising:
a substrate; a first layer on the substrate; a rapidly solidified layer on the first layer; and a conductive layer positioned on the rapidly solidified layer; wherein the rapidly solidified layer includes a metastable phase.

2 . The electronic component of claim 1 , wherein metastable phase is an amorphous metallic system.

3 . The electronic component of claim 1 , wherein metastable phase is a non-equilibrium solid solution alloy.

4 . The electronic component of claim 1 , wherein the conductive metal is selected from the group consisting of nickel, titanium, molybdenum, tungsten, tantalum, niobium, zirconium, vanadium, chromium, iron, cobalt, and combinations thereof.

5 . The electronic component of claim 1 , wherein the conductive metal includes silver or gold.

6 . The electronic component of claim 1 , wherein the first layer includes a material selected from the group consisting of nickel, titanium, molybdenum, tungsten, tantalum, niobium, zirconium, vanadium, chromium, iron, cobalt, manganese, iron, hafnium, rhenium, zinc, and combinations thereof.

7 . The electronic component of claim 1 , wherein the substrate includes a material selected from the group consisting of copper, copper alloys, nickel, nickel alloys, aluminum, aluminum alloys, steel, steel derivatives, or combinations thereof.

8 . The electronic component of claim 1 , wherein the rapidly solidified layer remains in a non-equilibrium alloy state for at least 3 months at ambient conditions.

9 . The electronic component of claim 1 , wherein the rapidly solidified layer reverts to an equilibrium state in response to heat treatment at 500° C. for 48 hours.

10 . The electronic component of claim 1 , wherein the rapidly solidified layer remains in a non-equilibrium alloy state within a temperature range of between −23° C. and 300° C. for a period of time of at least 1 month, and reverts to one or more of a thermodynamically favorable state, an equilibrium solid solution state or an intermetallic phase comprised of the first layer and the conductive layer at conditions of between 400° C. and 600° C. over between 24 hours and 96 hours.

11 . The electronic component of claim 1 , wherein the rapidly solidified layer is an electron-beam produced layer.

12 . The electronic component of claim 1 , wherein the rapidly solidified layer forms an exposed contact surface.

13 . The electronic component of claim 1 , wherein the rapidly solidified layer has between 40 wt % and 60 wt % gold.

14 . The electronic component of claim 1 , wherein the rapidly solidified layer has between 40 wt % and 60 wt % nickel.

15 . The electronic component of claim 1 , wherein the rapidly solidified layer has a nickel to gold ratio of between 0.7 to 1.3 and 1.3 to 0.7.

16 . The electronic component of claim 1 , wherein the rapidly solidified layer has a thickness of less than 0.5 micrometers.

17 . The electronic component of claim 1 , wherein the metastable layer is an energetic beam remelted layer formed by an electron beam.

18 . The electronic component of claim 1 , wherein the metastable layer is an energetic beam remelted layer formed by a laser.

19 . An electronic component, comprising:
a substrate; a nickel-containing first layer on the substrate; a rapidly solidified layer on the nickel-containing first layer; and a conductive layer positioned on the metastable metal phase layer; wherein the rapidly solidified layer includes a metastable phase comprising nickel from the nickel-containing first layer and a conductive metal from the conductive layer.

20 . A process of producing an electronic component, the process comprising:
providing a substrate; applying a first layer to the substrate; applying a conductive layer to the substrate; and directing an energetic beam to at least a portion of each of the first layer and conductive layer to form a rapidly solidified layer comprising a metastable phase.

Assignees

• Tyco Electronics Corp

Inventors

• Soneja Shallu
• Zheng Min
• Nitzan Dov
• Bharadwaj Lavanya
• Mathews Barry C
• Oar Michael A
• Gulsoy Gokce

Classifications

• C23C28/021 Primary

  including at least one metal alloy layer · CPC title

• B05D3/06 Primary

  by exposure to radiation (B05D3/02 takes precedence {; plasma treatment B05D3/141}) · CPC title

• C23C26/00

  Coating not provided for in groups C23C2/00 - C23C24/00 · CPC title

• H01R13/03

  characterised by the material, e.g. plating, or coating materials · CPC title

• C23C28/026

  including at least one amorphous metallic material layer · CPC title