Soft hand copolyamide composition

Patent metadata

Field	Value
Publication number	US-2017096529-A1
Application number	US-201515126492-A
Country	US
Kind code	A1
Filing date	Mar 5, 2015
Priority date	Mar 17, 2014
Publication date	Apr 6, 2017
Grant date	—

Abstract

Composition comprising, on a weight basis, the total being equal to 100%:
from 98% to 100% of at least one copolyamide bearing amide units and polyether units, having a melting point (T m ) from about 90 to about 150° C., in particular from about 100° C. to about 125° C., and having a flexural modulus of less than 100 MPa, as determined according to standard ISO 178 (2010); from 0 to 2% of at least one additive chosen from stabilizers and dyes, or a mixture thereof,

for the manufacture of a heat-sensitive adhesive, in particular a veil, a film, granules, a filament, a grate, a powder or a suspension.

First claim

1 . Composition comprising, on a weight basis, the total being equal to 100%:
from 98% to 100% of at least one copolyamide bearing amide units and polyether units, having a melting point (T m ) from about 90 to about 150° C., and having a flexural modulus of less than 100 MPa, as determined according to standard ISO 178 (2010);
the said amide unit having the following structure:
(A) x /(B) y /(C)

resulting from the condensation of unit (A), unit (B) and unit (C), in which:
x=0 or 1, y=0 or 1 and x+y=1 or 2,
A and B corresponding to an aliphatic repeating unit chosen from a unit obtained from at least one amino acid and a unit obtained from at least one lactam, or a unit X.Y obtained from the polycondensation:
of at least one diamine, the said diamine being chosen from a linear or branched aliphatic diamine, a cycloaliphatic diamine and an aromatic diamine or a mixture thereof, and
of at least one dicarboxylic acid, the said diacid being chosen from:
an aliphatic diacid, a cycloaliphatic diacid and an aromatic diacid,
the said diamine and the said diacid comprising from 4 to 36 carbon atoms;

(C) represents a long-chain aliphatic repeating unit, obtained from an amino acid, a lactam, or a unit X.Y, of C10 or more, or a mixture thereof, and
(A) and (B) being different from each other when they are both present, and (A) and (B) being different from (C) when they are present alone or together,

the weight proportion of polyether units in the copolyamide being greater than 40%,
from 0 to 2% of at least one additive chosen from stabilizers and dyes, or a mixture thereof.

2 . Composition according to claim 1 , in which the said at least one diamine is chosen from a linear or branched aliphatic diamine and a cycloaliphatic diamine or a mixture thereof, and the said diacid is chosen from an aliphatic diacid and a cycloaliphatic diacid or a mixture thereof.

3 . Composition according to claim 1 , in which the weight proportion of long-chain aliphatic repeating unit in the said amide unit is from 50% to 95%.

4 . Composition according to claim 1 , in which the polyalkylene ether polyol is chosen from PPG, PTMG or a PEG-PPG mixture and/or the polyalkylene ether polyamine is chosen from an Elastamine® or a Jeffamine® predominantly bearing PPG or PTMG blocks.

5 . Composition according to claim 1 , in which the said amide unit is chosen from one of the following structures: 6/X.Y/(C) and Pip.Y/X.Y/C, X, Y and C being as defined above and Pip denoting piperazine.

6 . Composition according to claim 5 , in which the said amide unit is chosen from: 6/6.6/12, 6/6.10/12, 6/11/12, Pip.10/6.10/12.

7 . Composition according to claim 6 , in which the weight proportion of each constituent of the 6/11/12 amide unit is 20/10/70.

8 . Composition according to claim 1 , in which the said amide unit is chosen from one of the following structures: A/C and X.Y/C, A corresponding to an aliphatic repeating unit chosen from a unit obtained from at least one amino acid and a unit obtained from at least one lactam and X.Y being as defined above.

9 . Composition according to claim 8 , in which the said amide unit is chosen from: 6/12, 11/12, 6.10/12 and Pip.10/12.

10 . Composition according to claim 9 , in which the weight proportion of each constituent of the 6/12 amide unit is 25/75 or 30/70.

11 . Heat-sensitive adhesive of the HMA (hot-melt adhesive) type consisting of the composition according to claim 1 .

12 . Heat-sensitive adhesive according to claim 11 , chosen from a veil, a film, granules, a filament, a grate, a powder and a suspension.

13 . Heat-sensitive adhesive according to claim 11 , the said adhesive having a thickness of from 20 to 55 μm and an adherence to a textile of greater than 3 N/cm, as determined by the T peel test at 100 mm/min.

14 . Heat-sensitive adhesive according to claim 11 , the said adhesive having a thickness of from 55 to 90 μm and an adherence to a textile of greater than 5 N/cm, as determined by the T peel test at 100 mm/min.

15 . Heat-sensitive adhesive according to claim 13 , in which the adherence is determined at a lamination temperature of from 120 to 180° C.

16 . Heat-sensitive adhesive according to claim 11 , having a loss of adherence after at least two washes at 40° C. from about 2% to about 18%.

17 . Heat-sensitive adhesive according to claim 11 , having a loss of adherence after at least two washes at 60° C. from about 2% to about 30%.

18 . A composition as defined in claim 1 , configured for use in the manufacture of a heat-sensitive adhesive.

19 . A method of using the heat-sensitive adhesive as defined in claim 11 in the textile industry.

Assignees

• Arkema France

Inventors

• Pineau Quentin
• D'Herbecourt Bruno

Classifications

• C08L77/12 Primary

  Polyester-amides · CPC title

• C08G69/44 Primary

  Polyester-amides · CPC title

• C09J177/12 Primary

  Polyester-amides · CPC title

• C08G2170/20

  Compositions for hot melt adhesives · CPC title

• C08G65/34

  from hydroxy compounds or their metallic derivatives {(C08G65/26 takes precedence)} · CPC title