Light emitting device package structure and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-2017084800-A1
Application number	US-201615268652-A
Country	US
Kind code	A1
Filing date	Sep 19, 2016
Priority date	Sep 18, 2015
Publication date	Mar 23, 2017
Grant date	—

Abstract

A light emitting device package structure includes at least one light emitting device, a wavelength conversion adhesive layer, and a protection element. The light emitting device has an upper surface, a lower surface opposite to the upper surface, and a side surface connecting the upper surface and the lower surface. The wavelength conversion adhesive layer is disposed on the upper surface of the light emitting device and has a first edge and a second edge opposite to each other. The protection element encapsulates the side surface of the light emitting device and the second edge of the wavelength conversion adhesive layer and exposes the lower surface of the light emitting device. A third edge of the protection element is aligned with the first edge of the wavelength conversion adhesive layer.

First claim

What is claimed is:

1 . A light emitting device package structure comprising:
at least one light emitting device having an upper surface, a lower surface opposite to the upper surface, and a side surface connecting the upper surface and the lower surface; a wavelength conversion layer disposed on the upper surface of the at least one light emitting device, the wavelength conversion layer having a first side surface and a second side surface opposite to each other; a protection element encapsulating the side surface of the at least one light emitting device and the second side surface of the wavelength conversion layer and exposing the lower surface of the at least one light emitting device, wherein a third side surface of the protection element is aligned with the first side surface of the wavelength conversion layer.

2 . The light emitting device package structure as recited in claim 1 , wherein the wavelength conversion layer comprises a low concentration layer and a high concentration layer, the upper surface of the at least one light emitting device is in contact with the high concentration layer, the low concentration layer has the first side surface and the second side surface, the high concentration layer has a fourth side surface and a fifth side surface opposite to each other, and the fifth side surface of the high concentration layer is aligned with the second side surface of the low concentration layer.

3 . The light emitting device package structure as recited in claim 2 , wherein the protection element comprises a first protection element and a second protection element, the low concentration layer has a first surface and a second surface opposite to each other, the high concentration layer is disposed on the first surface of the low concentration layer, the second protection element encapsulates the side surface of the at least one light emitting device, the second side surface of the low concentration layer, and the fourth side surface and the fifth side surface of the high concentration layer, a top surface of the second protection element is aligned with the second surface of the low concentration layer, and the first protection element covers the second surface of the low concentration layer and the top surface of the second protection element.

4 . The light emitting device package structure as recited in claim 1 , wherein an area of the first side surface of the wavelength conversion layer is greater than an area of the second side surface of the wavelength conversion layer.

5 . The light emitting device package structure as recited in claim 4 , wherein the wavelength conversion layer has a die bonding stage and an inclined bottom opposite to the die bonding stage, the at least one light emitting device is located on the die bonding stage, and an acute angle is formed between the inclined bottom and the first side surface.

6 . The light emitting device package structure as recited in claim 5 , wherein the protection element comprises a first protection element and a second protection element, the first protection element encapsulates the wavelength conversion layer, and the second protection element encapsulates the side surface of the at least one light emitting device and covers the first protection element.

7 . The light emitting device package structure as recited in claim 5 , further comprising:
a distributed Bragg reflective layer disposed on a side surface of the first protection element relatively away from the wavelength conversion layer.

8 . The light emitting device package structure as recited in claim 7 , further comprising:
a reflective protection layer disposed on the distributed Bragg reflective layer, wherein the distributed Bragg reflective layer is located between the first protection element and the reflective protection layer.

9 . The light emitting device package structure as recited in claim 1 , the protection element further comprises a reflective curved surface, and the reflective curved surface surrounds the side surface of the at least one light emitting device and is in contact with the side.

10 . The light emitting device package structure as recited in claim 1 , further comprising:
a die bonding layer disposed between the side surface of the at least one light emitting device and the protection element.

11 . The light emitting device package structure as recited in claim 1 , wherein the number of the at least one light emitting device is plural, the light emitting devices are spaced from one another, and every two adjacent light emitting devices of the light emitting devices expose a portion of the wavelength conversion layer.

12 . A light emitting device package structure comprising:
at least one light emitting device having an upper surface, a lower surface, and a side surface connecting the upper surface and the lower surface; a wavelength conversion layer disposed on the upper surface of the at least one light emitting device, the wavelength conversion layer having a first side surface, a second side surface opposite to the first side surface, and a top surface connecting the first side surface and the second side surface; and a protection element encapsulating the side surface of the at least one light emitting device, the second side surface of the wavelength conversion layer, and the top surface of the wavelength conversion layer, wherein a third side surface of the protection element is aligned with the first side surface of the wavelength conversion layer.

13 . The light emitting device package structure as recited in claim 12 , wherein an area of the first side surface of the wavelength conversion layer is greater than an area of the second side surface of the wavelength conversion layer.

14 . The light emitting device package structure as recited in claim 12 , wherein the wavelength conversion layer has a die bonding stage opposite to the top surface of the wavelength conversion layer, and the at least one light emitting device is located on the die bonding stage.

15 . The light emitting device package structure as recited in claim 12 , wherein the protection element comprises a first protection element and a second protection element, the first protection element encapsulates the side surface of the at least one light emitting device, and the second protection element encapsulates the wavelength conversion layer but exposes the first side surface of the wavelength conversion layer.

16 . The light emitting device package structure as recited in claim 15 , the first protection element further comprises a reflective curved surface, and the reflective curved surface surrounds the side surface of the at least one light emitting device and is in contact with the side.

17 . A light emitting device package structure comprising:
at least one light emitting device having an upper surface, a lower surface, and a side surface connecting the upper surface and the lower surface; a first protection element encapsulating the side surface of the at least one light emitting device; a wavelength conversion layer disposed on the upper surface of the at least one light emitting device and a portion of the first protection element, the wavelength conversion layer having a first side surface, a second side surface opposite to the first side surface, and a top surface connecting the first side surface and the second side surface; and a second protection element disposed on a portion of the first protection element, the second protection element at least encapsulating the second side surface and the top surfa

Assignees

• Genesis Photonics Inc

Inventors

• Hung Cheng-Wei
• Kuo Po-Tsun
• Du Long-Chi
• Chang Jui-Fu
• Lin Yu-Feng

Classifications

• H01L33/502

  Electricity · mapped topic

• H01L33/62

  Electricity · mapped topic

• H01L33/46

  Electricity · mapped topic

• H01L33/54 Primary

  Electricity · mapped topic

• H10H20/855

  Optical field-shaping means, e.g. lenses · CPC title